JPS63160780A - Laser beam machining device - Google Patents

Abstract

PURPOSE:To improve the quality of the machining by using a linear light spot obtained by condensing partial light with an uniform intensity distribution extracted from laser light to perform the machining and reducing the variance of the quality of the machining by a machining part. CONSTITUTION:The cylindrical laser light 14 obtained through a concave lens 12 and a convex lens 13 is formed to the light 18 with the uniform intensity through a field diaphragm 16. The light 18 with the uniform intensity is passed through a cylindrical lens 19 and the linear light spot 20 is obtained. The linear light spot 20 is projected on a reed 9 mounted on an XY table 6 to perform the soldering. The uniform machining can be performed by this constitution.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a laser processing device that heat-processes a workpiece by irradiating a laser beam onto the workpiece, and in particular, a laser processing device that forms a linear original spot with a uniform intensity distribution, and The present invention relates to a processing device that can perform soldering and other processing at one time.

[Conventional technology]

Conventionally, JP-A-60-1117FIFI, JP-A-Sho-1!111767, JP-A-58-441
According to Japanese Patent Publication No. 942 and Japanese Patent Publication No. 58-57271, the apparatus for laser soldering shown in FIG. A laser oscillator emits light, and 3 is a flat reflecting mirror that changes the direction of the laser beam 2.

Reference numeral 4 denotes a condensing lens set at Vc so as to condense the laser beam 2 whose direction has not been changed on the repulsion bond 3 and form it into a circular light spot 51. 6 is an XY table that is movable on the plane formed by the orthogonal X and Y axes by a mechanism not shown in the figure, and 7 is a printed wiring board mounted on the XY table 6. This is a DIP type IC which is to be attached by soldering to a PC. When the part 10 is irradiated with the original spot 5, it is heated and becomes soldered to the wiring pattern 8a on the board 8.

The soldering shown in Fig. 7 is done in the equipment &S1 Laser generator l
A laser beam emitting means 11 consisting of a reflector 3 and a lens 4
Since t1''C is fixed, when the substrate 8 is moved in a straight line by the XY table 6, the original spot 5 will relatively scan the substrate 8 in a straight line. The smell king is that the main parts are arranged so that the soldering on multiple leads 9 in IC 7 can be done sequentially using the original spot 5, so the XY table 6 is Lead 9 is distributed sequentially by movement pattern 8
You will have to solder it to a. In this case, as the XY table 6 moves, a situation occurs in which the C light spot 5 irradiates the substrate 8, but the intensity of the light spot 5 must be set to a value that will not damage the substrate 8. Since the spot 5 is irradiated with the spot 5, no inconvenience will occur to the substrate 8.

[Problem that the invention seeks to solve]

Since the apparatus shown in Fig. 7 performs soldering using a laser beam as described above, this kind of soldering is difficult to do when soldering a large number of minute components. Although it is a suitable device for producing
Since the one-dimensional spot is simply formed by focusing the 50% laser beam 2, the intensity distribution at the spot 51C is uneven, with the intensity distribution being strongest at the center of the spot 5 as shown in Figure 8. After some modification, this result
There is a problem D) as explained in .

In other words, such an unconstrained-intensity distribution? The soldering part 10 is irradiated by the light spot 5Vc, the soldering part 10 is heated, the cooling part is 9, and the soldering part 10 is heated vigorously and the part is not done slowly. arise.

For this reason, in the former part, the solder is heated to near its boiling point and then rapidly cooled, which causes air bubbles n1 to be trapped in the solidified solder, making wire breakage more likely to occur, and in the latter part, A phenomenon occurs in which the solder remains in a discolored state where the solder does not reach the f4@ state, resulting in a poor appearance of the solder finish. In other words, in the case of the 4fc hawk Vc in Fig. 7, the laser beam 2 emitted from the laser oscillator l and having an uneven intensity distribution is converged as it is into the source spot 5. There is a problem that the soldering is not uniform, and proper soldering that is durable and has a good appearance is not possible.

In addition, in the @neck of Figure 7, the soldering is done at the light spot 5.
Since soldering is performed by successively heating one part at a time, in - IC7, VcvI'I is heated at the beginning, and the soldering is heated at 10 and at the end. In soldering, the temperature conditions of the part 10 are different, and as a result, when soldering a large number of parts, there is a problem that the finished quality of the soldering in the part 10Vc is not VcIc.

An object of the present invention is to enable proper thermal processing in a laser processing device by applying θ heat to one heating section. By simultaneously heating and processing the heat η loe part of
The purpose is to perform IC'' so that thermal processing can be performed without causing variations in processing quality depending on the processing location.

[Means for solving problems]

In order to solve the above-mentioned problems, IC, laser light? A laser beam emitting means is used to emit a laser beam, and a portion of the laser beam having a uniform intensity distribution is extracted and a uniform intensity beam is generated.
℃ uniform source extraction means, and a linear light focusing means that collects the uniform light to form a linear light spot, and performs processing using the linear light spot. The configuration of the laser processing equipment is different.

[Effect]

When the laser processing section is set up as described above, the light spot used for processing has a uniform intensity distribution, so the heating section irradiated with this light spot is heated uniformly. Therefore, it is possible to perform proper heat processing to improve the appearance of processed products. In addition, in this case, the light spot is formed in a straight line with a uniform intensity distribution, so it is possible to heat-process many heat-processed parts at the same time on a single workpiece. Part processed product 9i
This means that thermal processing can be performed without causing variations in .

〔Example〕

FIG. 1 is a block diagram of a first embodiment of the present invention, and FIG. 2 is an enlarged plan view of the main parts in FIG. 1. In Figures 1 and 2, 12.13t''! is a concave lens and a convex lens designed to obtain a cylindrical laser beam !4 with a diameter larger than that of the laser beam from the laser source 2, and !5 is a laser oscillator l and a lens. 1
2.13. 16 is
Extract the part of the uniform intensity distribution of the laser beam 14 shown in Figure 3, Vc17, into a long and narrow rectangular shape.
Field aperture % l 6 a)
Engineering'i! [Aperture ll'ii to emit uniform light 18
This is a cylindrical lens that uses an aperture hole provided in C to condense the emitted light 18 to form a linear light spot 20Y. 2! is an XY table 6 and a laser beam emitting means 15
A laser soldering device consisting of a diaphragm 16 and a lens 19 is used. In this device, an ffi pants) 20 is placed on a substrate 8 as shown in FIG. Each soldering part of all the leads 9 on the side is constructed so that the part 10 is irradiated all at once.

In FIG. 1, C indicates that the soldering device 21 is configured as described above and is machined, so according to the above-mentioned direction, the soldering part 10 of the IC lead 9 is a laser beam with a uniform intensity distribution. Result of being heated by light.

Electric II! It is important for the IC to be properly soldered so that the continuation is durable and has a good appearance. Furthermore, according to such a device, all the soldering on one side of the IC7 is performed at the same time as the soldering on the part 10rc, so that the soldering is performed without causing any variation in the finished quality of the soldering. .

FIG. 4 is a configuration diagram of a second embodiment of the present invention, and the difference from FIG. This is the point where one linear light spot 20 is obtained. Reference numeral 23 denotes a laser soldering device consisting of the various parts shown in the figure. For soldering, use @23
According to the above, the soldering shown in Figure 1 is the same as the device 21 (it can perform soldering with good quality and good appearance, and it can perform soldering of many parts without variation in quality). It is clear that soldering is possible, but soldering is difficult [23
Another advantage of this method is that by tilting the concave mirror 22 in the direction of the arrow P, the position of the light spot 20 can be changed more easily than in the case of soldering.

FIG. 5 is a block diagram of a soldering device according to a third embodiment of the present invention. What is different about this diagram from Figure 1?

A laser beam emitting means 24 corresponding to the laser beam emitting means 15 in FIG. The conical laser beam 27 emitted from the end 25b is focused to produce parallel cylindrical laser beam 14%.
'T1''C
In many ways, this kind of soldering can also be done on equipment with one quality or good-looking solder as in Figures 1 and 4, and a large number of solders can be soldered with one quality per spot. It is clear that the soldering shown in Fig. 5 has the characteristic of being able to perform soldering without variation.
In particular, since the laser beam emitting means 24 is configured as described above, the position of the laser oscillator 26, which is usually large and large in size and is not easy to move, is determined to be at a position to form the C1 light spot 201. That is, the soldering shown in FIG. 1 has the advantage that the soldering position can be set much more freely than in the device 21.

Figure 6 is a configuration diagram of a soldering device according to a fourth embodiment of the present invention. The difference from Figure 5 in this figure is light spot 2.
0 is formed by the concave mirror 22 as in FIG.
Although the soldering shown in Fig. 5 has the same advantages as the soldering shown in Fig. 5, the soldering shown in Fig. It is obvious that there is no need to specifically explain that the method also has the advantage that the soldering position can be set fairly freely, as in the case of .

The above-mentioned embodiment was an f-ben soldering device.

The present invention is applicable not only to this type of soldering device but also to other laser devices. This can also be applied to the thermal processing equipment used.

〔Effect of the invention〕

As mentioned above, in the present invention, there is provided a laser beam emitting means for emitting a laser beam, and a uniform element extractor for extracting a portion of the almost uniform intensity distribution of the laser beam and emitting it as uniform intensity light. and a linear light condensing means for condensing the intensity light to form a linear light spot, the laser processing apparatus is configured to perform a process using the linear light spot. Configured. For this reason, in this type of laser processing equipment, the intensity distribution of the single spot is uniform, so the F1 is driven by such a light spot.
Uniform heating in the stone heating section results in proper heat processing with good processing quality and appearance. In addition, in such a laser processing device, since the spot is formed in a straight line with a uniform intensity distribution, it is possible to heat-process many heat-processed parts in one workpiece at the time of IW1. I can do it.

As a result, there is an effect that heat processing can be performed without any damage even if processing quality varies depending on the loe location.

[Brief explanation of the drawing]

Figure m1 is a configuration diagram of the first embodiment of the present invention, Figure 2 is an enlarged plan view of the main parts in Figure 1, Figure 3 is a functional explanatory diagram of the main parts in Figure 1, and Figures 4 to 6. FIG. 7 is a block diagram of each of the i2 to fourth embodiments of the present invention, and FIG. 7 is a block diagram of a conventional laser soldering apparatus. FIG. 8 is an explanatory diagram of the intensity distribution of the light spot in FIG. 7. 2.14... Laser light, 5.20...
Light spot, 11, 15.24... Laser beam output means, 16... Field aperture % 18...
・Intensity - Lighting, 19... Cylindrical lens, 21.23... Laser soldering equipment, 2
2... Concave mirror. 11 mouth 2θ note 2 note note 3 note note 4 note note 5I2]

Claims (1)

[Claims] a laser beam emitting means for emitting a laser beam; a uniform light extracting means for extracting a portion of the laser beam having a substantially uniform intensity distribution and emitting it as uniform intensity light; and a uniform light extraction means for condensing the uniform intensity light. 1. A laser processing apparatus comprising: a linear light condensing means for forming a linear light spot using a linear light spot; and processing is performed using the linear light spot.