JPS63160370A - Video camera - Google Patents

Abstract

PURPOSE:To make a video camera small-sized by a method wherein an imaging device constituting a solid-state imaging system and a semiconductor device for signal processing or the like are arranged in an identical package. CONSTITUTION:A charge-coupled device is used for an imaging device 12; a hybrid integrated circuit is used for an IC chip 13 for signal processing use; the hybrid integrated circuit is used for the IC chip 14 for driving use. At a package 15, the IC chip 13 for signal processing use and the IC chip 14 for driving use can be arranged together with the imaging device 12. The package 15 is formed in such a way that it can be attached to a substrate 16 together with terminal pins 17 which protrude from the face opposite to the face where the imaging device 12 and the like are packed. By this structure, the substrate where the package is attached can be made small; the mounting density can be enhanced; a video camera can be made small-sized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a video camera using a solid-state imaging device equipped with a semiconductor element such as an imaging element and a signal processing device.

[Summary of the Invention] A video camera that uses a solid-state imaging device equipped with a semiconductor element such as an imaging device and a signal processing device, and in which an optical system is arranged in front of the imaging device, comprising the steps of: By packaging semiconductor elements such as processing devices in the same package, the solid-state imaging device can be made more compact than when semiconductor elements such as image sensors and signal processing devices are individually packaged. This allows a video camera that uses an imaging device to be made smaller.

[Prior Art] As shown in FIGS. 4 and 5, an image sensor 1, a semiconductor element for signal processing (hereinafter referred to as a signal processing IC) 2, or a semiconductor element for timing and driving (hereinafter referred to as a driving IC) A video camera (not shown) is known that uses a solid-state imaging device 6 configured by disposing an integrated circuit (IC) 3 on a substrate 5 via a package 4. In addition, in FIG. 5, 7 is an optical system attached to the front surface of the image sensor I.

[Problems to be Solved by the Invention] By the way, as shown in FIGS. 4 and 5, the conventional solid-state imaging device 6 has an image sensor I, a signal processing system IC 2, and a drive system IC 3.
However, because the configuration was such that they were arranged in separate packages 4...4, so-called high-density mounting was not possible due to the size of the packages 4...4, the length of the bins, the number of pins, etc. The problem was that it was restricted.

In the present invention, the image sensor 1 is a signal processing system IC 2 or a drive system IC 2.
Focusing on the fact that it is a semiconductor element like C3 and is disposed in the package 4 like IC2 of the signal processing system and IC3 of the drive system, By sharing package 4 of
This is an attempt to solve the above-mentioned conventional problems.

Means for Solving Problem 1] The image pickup device, the signal processing system IC, or the drive system IC is arranged in the same package.

[Function] Since the image sensor package, the signal processing system IC package, or the drive system IC package is shared, individual packages for the image sensor, signal processing system IC, etc. are no longer necessary, and the resulting high-density implementation becomes possible.

"Example" Next, the present invention will be explained with reference to FIGS. 1 to 3.

In the figure, reference numeral 11 indicates a solid-state imaging device constituting the main part of the video camera of the present invention. The solid-state imaging device 11 includes an image sensor 12, a signal processing system ICl3, and a drive system IC1.
4, the package 15 of the image sensor I2, the signal processing system IC+3, or the drive system ICI4, and the package I
5, and a substrate 16 that supports the image pickup device 12, a signal processing system ICl3, or a drive system ICI4.

A so-called COD is used for the image sensor 12, a HIC is used for the ICl3 of the signal processing system, and an ICI of the drive system is used.
4 uses TII C. These image sensor 12, signal processing system ICl3, or drive system ICI
4 are arranged in a single package 15. The package 15 is formed by stretching the package of the image sensor 12 to the left and right sides to provide pack spaces for the signal processing system ICl 3 and the drive system IC 14 on both the left and right sides of the image sensor 12, In these spaces, the signal processing system ICl3 and the drive system ICI4 can be arranged together with the image sensor I2. The package 15 is connected to the image sensor 12, the signal processing system IC 13, or the drive system IC 13.
It is designed to be attached to the board 16 with terminal pins 17 . . . 17 protruding from the side opposite to the side where the CI 4 is packed.

Further, a cylindrical peripheral wall 15a is provided at the periphery of the package I5 so as to surround the image sensor 12, the signal processing system ICl3, or the drive system IC14, and the image sensor 12 is provided at the tip of the peripheral wall 15a. and signal processing system ICl3
Alternatively, a cap-shaped frame 18 is attached to cover the upper part of IC+4 of the drive system. At the center of this frame 18, a cylindrical optical system receiver 1 is located north of the image sensor 12.
9 is provided, and an optical system 20 containing various lenses is removably attached to the optical system receiving portion I9. As shown in FIG. 3, the optical system 20 is attached to protrude from the body 22 of the video camera 21, while the solid-state imaging device 11 is attached inside the body 22, and the optical system 20 The object is imaged on the imaging section of the image sensor I2, and the signal processing system IC+
Obtain the information signal necessary to reproduce the subject with 3rd grade,
This is recorded on a magnetic recording medium such as a videotape.

Note that 23 indicates the connection between the image sensor 12, the signal processing system IC13, and the drive system IC14, and between these and the terminal bins I7...I7.
This is the lead wire that connects.

The video camera 21 of the embodiment has a configuration as described in 1. The package I5 of the image sensor 12 is extended laterally, and the signal processing system IC+3 and the drive system IC+4 are installed on both the left and right sides of the image sensor 12. Provide a space to back up,
ICl3 for the signal processing system and ICI4 for the drive system are installed in this space.
Since the ICI3 of the signal processing system and the ICI4 of the drive system are packed separately, there is no need for a separate package, and the solid-state imaging device 11 can be made smaller accordingly.

In the embodiment shown in the drawings, the image sensor I2 is packaged!
The image sensor 12 is packed in the center of the image sensor 12.
It is not necessary to pack it in the center of the package 15. Furthermore, in the embodiment, a case is shown in which the signal processing system ICl3 and the drive system 1014 are packed together in the package of the image sensor 12, but the image sensor 12 and the drive system ICI4 are packed together in the package of the signal processing system ICl3. In short, it is sufficient to pack the image sensor 12, the signal processing system ICl 3, or the drive system 1 (, 14) in the same package.

[Effects of the Invention] As described above, the present invention provides a video camera that uses a solid-state imaging device equipped with an image sensor, a semiconductor element for a signal processing system, or a semiconductor element for a drive system. Since the image pickup device, the signal processing system semiconductor device, or the drive system semiconductor device are arranged in the same package, the following effects can be obtained.

(1) Since individual packages such as image pickup elements, signal processing semiconductor elements, drive system semiconductor elements, etc. are not required, the package or the substrate on which the package is attached can be made smaller.

(2) There are no restrictions on packaging due to the presence of packages for semiconductor elements in the signal processing system or semiconductor elements in the drive system, and it is possible to improve the packaging density and downsize the video camera.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a solid-state imaging device used in the video camera of the present invention, and FIG. 2 is a surface view with the frame removed.
FIG. 3 is a perspective view of a video camera equipped with a solid-state imaging device, FIG. 4 is a plan view of the conventional solid-state imaging device, and FIG. 5 is a side view of the same. 11... Solid-state imaging device, ■2... Photographing element, ■3.
...Signal processing system IC1■4...Drive system rc, 15
...Package, 16...Substrate. Goo n Mera's Kabutan Calendar, Figure 3, Figure 4, Figure 5, Figure 5

Claims (1)

[Claims] (1) In a video camera that uses a solid-state imaging device equipped with a semiconductor element such as an image sensor and a signal processing device, the image sensor and the semiconductor device such as a signal processor that make up the solid-state image sensor are arranged in the same package. A video camera featuring: