JPS63157996U - - Google Patents
Info
- Publication number
- JPS63157996U JPS63157996U JP4994287U JP4994287U JPS63157996U JP S63157996 U JPS63157996 U JP S63157996U JP 4994287 U JP4994287 U JP 4994287U JP 4994287 U JP4994287 U JP 4994287U JP S63157996 U JPS63157996 U JP S63157996U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- guide plate
- unit
- convection guide
- convection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims description 2
- 230000020169 heat generation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Description
第１図は本考案の実施例を示す図、第２図は本
考案の実施例の動作状態を示す図、第３図は従来
の電子装置の放熱構造を説明するための図である
。
第１図、第２図において、１は装置本体、２は
プリント板パツケージ、３は装置ユニツト、４は
対流誘導板、５は放熱ユニツト、６は上昇気流、
９は仕切板、１０は通風路である。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram showing the operating state of the embodiment of the present invention, and FIG. 3 is a diagram for explaining the heat dissipation structure of a conventional electronic device. In FIGS. 1 and 2, 1 is the main body of the device, 2 is a printed circuit board package, 3 is a device unit, 4 is a convection guide plate, 5 is a heat dissipation unit, 6 is an updraft,
9 is a partition plate, and 10 is a ventilation path.
Claims (1)
した装置ユニツト３と、対流誘導板４を有する放
熱ユニツト５とを交互に積み重ねて装置本体１に
実装してなる電子装置において、 上記放熱ユニツト５は装置ユニツト３の高発熱
部に対応して対流誘導板４の一部を除去し、その
両側に仕切板９を設けてなる通風路１０を形成し
たことを特徴とした電子装置の放熱構造。[Claims for Utility Model Registration] An electronic device in which a device unit 3 housing a plurality of printed board packages 2 in parallel and a heat dissipation unit 5 having a convection guide plate 4 are stacked alternately and mounted on a device body 1. The heat dissipation unit 5 is characterized in that a part of the convection guide plate 4 is removed to correspond to the high heat generation part of the device unit 3, and a ventilation passage 10 is formed by providing partition plates 9 on both sides of the convection guide plate 4. Heat dissipation structure for electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4994287U JPS63157996U (en) | 1987-04-03 | 1987-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4994287U JPS63157996U (en) | 1987-04-03 | 1987-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157996U true JPS63157996U (en) | 1988-10-17 |
Family
ID=30872856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4994287U Pending JPS63157996U (en) | 1987-04-03 | 1987-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157996U (en) |
-
1987
- 1987-04-03 JP JP4994287U patent/JPS63157996U/ja active Pending
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