JPS63157934U - - Google Patents
Info
- Publication number
- JPS63157934U JPS63157934U JP1987050071U JP5007187U JPS63157934U JP S63157934 U JPS63157934 U JP S63157934U JP 1987050071 U JP1987050071 U JP 1987050071U JP 5007187 U JP5007187 U JP 5007187U JP S63157934 U JPS63157934 U JP S63157934U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- bond pad
- board
- bare chip
- semiconductor bare
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987050071U JPS63157934U (index.php) | 1987-04-02 | 1987-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987050071U JPS63157934U (index.php) | 1987-04-02 | 1987-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157934U true JPS63157934U (index.php) | 1988-10-17 |
Family
ID=30873089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987050071U Pending JPS63157934U (index.php) | 1987-04-02 | 1987-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157934U (index.php) |
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1987
- 1987-04-02 JP JP1987050071U patent/JPS63157934U/ja active Pending