JPH01133734U - - Google Patents
Info
- Publication number
- JPH01133734U JPH01133734U JP1988029385U JP2938588U JPH01133734U JP H01133734 U JPH01133734 U JP H01133734U JP 1988029385 U JP1988029385 U JP 1988029385U JP 2938588 U JP2938588 U JP 2938588U JP H01133734 U JPH01133734 U JP H01133734U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- wire bonding
- substrate
- bonding pads
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
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- H10W72/5449—
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- H10W72/932—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988029385U JPH01133734U (index.php) | 1988-03-04 | 1988-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988029385U JPH01133734U (index.php) | 1988-03-04 | 1988-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133734U true JPH01133734U (index.php) | 1989-09-12 |
Family
ID=31253552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988029385U Pending JPH01133734U (index.php) | 1988-03-04 | 1988-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133734U (index.php) |
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1988
- 1988-03-04 JP JP1988029385U patent/JPH01133734U/ja active Pending