JPS63157450A - 集積回路の冷却構造 - Google Patents
集積回路の冷却構造Info
- Publication number
- JPS63157450A JPS63157450A JP30381086A JP30381086A JPS63157450A JP S63157450 A JPS63157450 A JP S63157450A JP 30381086 A JP30381086 A JP 30381086A JP 30381086 A JP30381086 A JP 30381086A JP S63157450 A JPS63157450 A JP S63157450A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- plate
- case
- circuit case
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 239000003507 refrigerant Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30381086A JPS63157450A (ja) | 1986-12-22 | 1986-12-22 | 集積回路の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30381086A JPS63157450A (ja) | 1986-12-22 | 1986-12-22 | 集積回路の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63157450A true JPS63157450A (ja) | 1988-06-30 |
| JPH0573270B2 JPH0573270B2 (enEXAMPLES) | 1993-10-14 |
Family
ID=17925572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30381086A Granted JPS63157450A (ja) | 1986-12-22 | 1986-12-22 | 集積回路の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157450A (enEXAMPLES) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0512667U (ja) * | 1991-07-29 | 1993-02-19 | カヤバ工業株式会社 | 可変型油圧モータ |
-
1986
- 1986-12-22 JP JP30381086A patent/JPS63157450A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0573270B2 (enEXAMPLES) | 1993-10-14 |
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