JPS63155704A - Variable resistor - Google Patents
Variable resistorInfo
- Publication number
- JPS63155704A JPS63155704A JP30349886A JP30349886A JPS63155704A JP S63155704 A JPS63155704 A JP S63155704A JP 30349886 A JP30349886 A JP 30349886A JP 30349886 A JP30349886 A JP 30349886A JP S63155704 A JPS63155704 A JP S63155704A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- layer
- silver
- insulating substrate
- surface side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 17
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 10
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011195 cermet Substances 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、絶縁基板上に形成した抵抗体上で摺動子を回
動許せることにより抵抗値を可変とした、プリント回路
基板等への表面実装可能な可変抵抗器に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to surface mounting on printed circuit boards, etc., in which the resistance value is made variable by allowing rotation of a slider on a resistor formed on an insulating substrate. Concerning possible variable resistors.
従来の技術
従来、この種の可変抵抗器としては、第８図に示す様に
、絶縁基板１の上面に円弧状のザーメット抵抗体５を形
成し、この絶縁基板１上に摺動子（図示せず）を抵抗体
５上を摺動する様に回動可能に取付けたものが提供され
ている。なお、摺動子は絶縁基板１の中心孔２に図示し
ない電極を介して回動可能に取り付けられている。2. Description of the Related Art Conventionally, as shown in FIG. (not shown) is rotatably mounted so as to slide on the resistor 5. Note that the slider is rotatably attached to the center hole 2 of the insulating substrate 1 via an electrode (not shown).
また、抵抗体５の両端部には銀−パラジウム合金からな
る外部電極６，６が設げられている。この外部電極６は
、第９図に示す様に、まず、絶縁基板１の表裏面に銀−
パラジウム合金６ａ 、 ６ｂを印刷・焼付げし、端面
に同じく銀−パラジウム合金６ｃをチップ・焼付けした
もので、その後抵抗体５が印刷・焼付けされる。Furthermore, external electrodes 6, 6 made of a silver-palladium alloy are provided at both ends of the resistor 5. As shown in FIG.
Palladium alloys 6a and 6b are printed and baked, and a silver-palladium alloy 6c is similarly chipped and baked on the end face, and then a resistor 5 is printed and baked.
発明が解決しようとする問題点
しかしながら、以上の可変抵抗器においては、半田中に
銀が拡散する銀くわれを防止して半田耐熱特性の向上を
図るために外部電極６として銀−パラジウム合金を使用
しているが、これでは高価であり、かつ、銀くわれを確
実に防止することも不可能であるという問題点を有して
いる。また、端面に設けた銀−パラジウム合金６ｃの膜
厚がどうしても厚くなり、ガラスフリットが表面に露出
して半田付は特性を損ない、煩雑な予備半田が必要であ
るという問題点をも有している。Problems to be Solved by the Invention However, in the above-mentioned variable resistor, a silver-palladium alloy is used as the external electrode 6 in order to prevent the silver from diffusing into the solder and improve the solder heat resistance. However, it is expensive and it is impossible to reliably prevent silver scratches. In addition, the film thickness of the silver-palladium alloy 6c provided on the end face inevitably becomes thick, and the glass frit is exposed on the surface, which impairs the properties of soldering, and requires complicated preliminary soldering. There is.
肌薇を解決するためｑ壬碧
そこで、本発明に係る可変抵抗器は、
（１）絶縁基板の端面近傍の表面部に設けた銀−パラジ
ウム合金からなる表面側最下層と、絶縁基板の端面に設
けた銀からなる端面側最下層と、前記表面側最下層の一
部と前記端面側最下層とを覆う様に形成された少なくと
も一層のメッキ層とで構成された外部電極と、
（ｉ）前記表面側最下層の一部を覆う様に設置された抵
抗体とを備え、
（ｉ）前記メッキ層と前記抵抗体との間にギャップを設
けたこと、
を特徴とする。In order to solve this problem, the variable resistor according to the present invention has the following features: (1) The lowermost layer on the surface side made of a silver-palladium alloy provided on the surface near the end surface of the insulating substrate, and the end surface of the insulating substrate. (i ) a resistor installed so as to cover a part of the bottom layer on the surface side, and (i) a gap is provided between the plating layer and the resistor.
作用
即ち、本発明では、外部電極の最下層は少なくとも一層
のメッキ層で被覆、保護されることとなる。従って、端
面側最下層に安価な銀を使用しても銀くわれが発生ずる
ことはない。また、前記メッキ層と抵抗体とはギャップ
で分離されていることから、メッキ層にて抵抗体の特性
が劣化したり、メッキ層が剥がれて絶縁不良を招来する
ことがなく、抵抗体やメツキレシストの印刷のばらつき
を吸収できる等の作用を有する。しがも、表面側最下層
には銀−パラジウム合金を使用していることから、ギャ
ップによる露出が生じても該露出部分で銀くわれが生じ
ることはない。In other words, in the present invention, the lowermost layer of the external electrode is covered and protected with at least one plating layer. Therefore, even if inexpensive silver is used in the lowermost layer on the end surface side, silver cavities will not occur. In addition, since the plating layer and the resistor are separated by a gap, there is no possibility that the properties of the resistor will deteriorate in the plating layer, or the plating layer will peel off, resulting in poor insulation. It has the ability to absorb variations in printing. However, since a silver-palladium alloy is used for the lowermost layer on the surface side, even if exposure occurs due to a gap, the exposed portion will not be damaged by silver.
実施例 第１図ないし第４図は本発明の第１実施例を示す。Example 1 to 4 show a first embodiment of the invention.
この可変抵抗器は、絶縁基板１０と、その表面に設置し
た摺動子２０とから構成されている。This variable resistor is composed of an insulating substrate 10 and a slider 20 installed on the surface of the insulating substrate 10.
絶縁基板１０はアルミナを成形、焼結したもので、中心
孔１１を有し、その表面には円弧状のサーメット抵抗体
１５と環状のコレクタ電極１７とが形成されている。抵
抗体１５の両端部とコレクタ電極１７とは基板１０の一
端部まで延在され、以下に詳述する外部電極１６； １
６．１８と電気的に接続されている。The insulating substrate 10 is made of molded and sintered alumina, has a center hole 11, and has an arcuate cermet resistor 15 and an annular collector electrode 17 formed on its surface. Both ends of the resistor 15 and the collector electrode 17 extend to one end of the substrate 10, and an external electrode 16;
6.18 is electrically connected.
摺動子２０は、第２図に示す様に、皿状部２１と中心部
に設けた筒状部２２と外周部に設けたアーム部２３とを
有している。この摺動子２ｏは、筒状部２２を絶縁基板
１０の中心孔１１に挿入して裏面側でかしめることによ
り、皿状部２１がコレクタ電極１７上に接触すると共に
、アーム部２３の下方に突き出された接点部２４が抵抗
体１５上に接触した状態で回動可能に取り付けられてい
る。As shown in FIG. 2, the slider 20 has a dish-shaped portion 21, a cylindrical portion 22 provided at the center, and an arm portion 23 provided at the outer periphery. This slider 2o is constructed by inserting the cylindrical part 22 into the center hole 11 of the insulating substrate 10 and caulking it on the back side, so that the dish-shaped part 21 comes into contact with the collector electrode 17 and the lower part of the arm part 23. A contact portion 24 protruding from the resistor 15 is rotatably attached to the resistor 15 in contact with the contact portion 24 .
次に、外部電極１６の構造について説明する。Next, the structure of the external electrode 16 will be explained.
外部電極１６は、第４図に示す様に、表面側最下ＪＷ１
６ａ 、端面側最下Ｊｉ１６ａ’、裏面側最下１ｉ１６
ａ”ト、第１のメッキＦｔ１６ｂと、第２のメッキ層１
６ｃとの三層にて構成されている。表面側最下層１６ａ
は銀−パラジウム合金を印刷・焼付けし、端面側最下Ｊ
Ｆｔ１６ａ’と裏面側最下層１６ａ”とは銀を印刷・焼
付はしたもので、その厚さは例えばそれぞれ１５μｍで
ある。第１のメッキ層ｔ６ｂはニッケル又はニッケル合
金からなり、その厚さは例えば２μｍである。−第２の
メッキ層１６ｃは錫又は錫−鉛合金からなり、その厚さ
は例えば４μｍである。As shown in FIG. 4, the external electrode 16 is located at the bottom surface side JW1.
6a, bottom side Ji16a' on end side, bottom side 1i16 on back side
a'', first plating Ft16b and second plating layer 1
It is composed of three layers with 6c. Surface side bottom layer 16a
is printed and baked with silver-palladium alloy, and the bottom J on the end side
Ft16a' and the bottom layer 16a'' on the back side are printed and baked with silver, and each has a thickness of, for example, 15 μm.The first plating layer t6b is made of nickel or a nickel alloy, and has a thickness of, for example, The second plating layer 16c is made of tin or a tin-lead alloy and has a thickness of, for example, 4 μm.
第１のメッキ１１６ｂは前記最下ｒｌｌ １６ａ、 １
６ａ ’ 、 １６ａ”に対して銀くわれを防止するバ
リアとして機能し、半田耐熱特性を向上させる作用を有
する。第２のメッキ層１６ｃは半田ぬれ性を高めて半田
付は特性を向上きせる作用を有し、合わせて予備半田を
省略させる作用を有する。The first plating 116b is the bottom rll 16a, 1
6a' and 16a", and has the effect of improving the soldering heat resistance characteristics. The second plating layer 16c has the effect of increasing the solder wettability and improving the soldering characteristics. It also has the effect of omitting preliminary soldering.
一方、前記メッキＪＷ１６ｂ、１６ｃと抵抗体１５との
間にはギャップＧが形成されている。このギャップＧは
メッキ層１．６ｂ、１６ｃと抵抗体１５とを完全に分離
するために形成されたもので、メッキＪＪ９１．６ｂ、
１６ｃが抵抗体１５に接触して抵抗体１５の特性が劣化
することを防止すると共に、仮にギャップＧがなくメッ
キＪｉｆｉｌ？ １６ｂ、 １６ｃが抵抗体１５上を覆
うと、その被覆部分が抵抗値の調整時等に剥がれて絶縁
不良を招来することを防止する。また、抵抗体１５の使
用量自体が少なくて済み、さらには以下に説明する製造
工程上の利点をも有する。On the other hand, a gap G is formed between the plating JWs 16b and 16c and the resistor 15. This gap G was formed to completely separate the plating layers 1.6b, 16c and the resistor 15, and the plating JJ91.6b,
16c comes into contact with the resistor 15 and the characteristics of the resistor 15 are prevented from deteriorating, and even if there is no gap G, plating Jifil? When the resistors 16b and 16c cover the resistor 15, the covering portions are prevented from peeling off during resistance value adjustment and the like, resulting in poor insulation. Furthermore, the amount of resistor 15 used can be reduced, and furthermore, there are advantages in terms of the manufacturing process as described below.
外部電極１６の製造工程としては、まず、絶縁基板１０
の表面、端面、裏面に最下層１６ａ、１６ａ’、１６”
を形成し、抵抗体１５を形成する。次に、抵抗体１５上
にメツキレシスト２５（第４図ウニ点鎖線で示す）を塗
布する。このとき、メツキレシスト２５の端縁はギャッ
プＧだけ延長される。統いて、第１のメッキ層１６ｂ、
第２のメッキＪ１１６ｃを形成し、その後メツキレシス
ト２５を除去する。In the manufacturing process of the external electrode 16, first, the insulating substrate 10 is
Bottom layers 16a, 16a', 16" on the front, end, and back surfaces of
, and the resistor 15 is formed. Next, a metal resist 25 (indicated by a dotted chain line in FIG. 4) is applied onto the resistor 15. At this time, the edge of the mesh resist 25 is extended by the gap G. In general, the first plating layer 16b,
A second plating J116c is formed, and then the plating resist 25 is removed.
以上の製造工程においては、ギャップＧを設けることか
ら、抵抗体１５．メツキレシスト２５の印刷のばらつき
を吸収でき、メツキレシスト２５の端縁が表面側最下層
１６ａ上に位置することから密着性が良好で、抵抗体１
５がメッキｌ１１６ｂ、１６ｃから完全に保護されるこ
ととなる。In the above manufacturing process, since the gap G is provided, the resistor 15. Variations in the printing of the mesh resist 25 can be absorbed, and since the edge of the mesh resist 25 is located on the bottom layer 16a on the surface side, the adhesion is good, and the resistor 1
5 will be completely protected from plating 116b, 16c.
一方、コレクタ電極１７の外部電極１８も前記外部電極
１６と同様の三層構造とされ、ギャップＧを有している
。さらに、１９は遊び電極であり、この遊び電極１９も
外部電極１６と同様の三層構造ときれている。On the other hand, the external electrode 18 of the collector electrode 17 also has a three-layer structure similar to the external electrode 16, and has a gap G. Further, reference numeral 19 denotes an idle electrode, and this idle electrode 19 also has a three-layer structure similar to the external electrode 16.
なお、本発明にあっては、第２のメッキ層１６ｃは必ず
しも必要なものではなく、最下層１６ａ、１６ａ’。Note that, in the present invention, the second plating layer 16c is not necessarily required, but is the lowermost layer 16a, 16a'.
１６ａ”上には少なくとも第１のメッキ層１６ｂが形成
されていれはよい。また、メッキ１ｉ１６ｂ、１６ｃは
前記の材質に限定されるものではなく、種々のものを使
用することができる。At least a first plating layer 16b may be formed on the plating layer 16a''. Furthermore, the plating materials 1i16b and 16c are not limited to the above-mentioned materials, and various materials can be used.
第５図ないし第７図は本発明の第２実施例を示す。5 to 7 show a second embodiment of the invention.
この可変抵抗器は、前記第１図に示したものに対してコ
レクタ電極に代えて電極３０をその筒状部３１を絶縁基
板１０の中心孔１１に挿入した状態で設け、筒状部３１
の上部をかしめることにより摺動子２０を回動可能に取
り付けたもので、ザーメット抵抗体１５の外部電極１６
．１６は前記第１実施例のものと同様に三層構造ときれ
、ギャップＧを有している。In this variable resistor, an electrode 30 is provided in place of the collector electrode in the variable resistor shown in FIG.
The slider 20 is rotatably attached by caulking the upper part of the outer electrode 16 of the cermet resistor 15.
．． Reference numeral 16 has a three-layer structure and a gap G, similar to that of the first embodiment.
発明の効果
以上の説明で明らかな様に、本発明によれは、外部電極
を最下層と、該最下層上に形成された少なくとも一層の
メッキ層とで構成したため、メ・７キ層が最下層の保護
バリアとして作用し、端面側最下層に銀を使用しても、
あるいは必要に応じて裏面側最下層に銀を使用しても、
銀くわれを確実に防止して半田耐熱特性の向上を図るこ
とができ、電極の全ての部分に必ずしも高価な銀−パラ
ジウム合金を使用しなくても済む。また、メッキ層と抵
抗体との間にはギャップが形成され、両者を完全に分離
したため、メッキ層が抵抗体に接触して抵抗体の特性が
劣化したり、メッキ層が抵抗値の調整時等に剥がれて絶
縁不良を生じたりすることがなく、抵抗体やメツキレシ
ストの印刷のばらつきをも吸収でき、抵抗体の使用量も
減少する。さらには、メツキレシスト端縁の外部電極表
面側最下層への密着性が良好であり、抵抗体がメッキ層
から完全に保護きれることとなる。しかも、表面側最下
層には銀−パラジウム合金を使用したため、ギャップを
設けたことによる露出部分で銀くわれが発生する不具合
もない。Effects of the Invention As is clear from the above explanation, according to the present invention, since the external electrode is composed of the bottom layer and at least one plating layer formed on the bottom layer, the first and seventh layers are the top layer. It acts as a protective barrier for the lower layer, even if silver is used as the bottom layer on the edge side.
Alternatively, you can use silver on the bottom layer on the back side if necessary.
It is possible to reliably prevent silver cavities and improve solder heat resistance, and it is not necessary to use an expensive silver-palladium alloy in all parts of the electrode. In addition, a gap is formed between the plating layer and the resistor, completely separating the two, which may cause the plating layer to come into contact with the resistor and deteriorate the characteristics of the resistor, or when the plating layer is used to adjust the resistance value. It does not peel off and cause insulation defects, and it can also absorb variations in printing of resistors and mesh resists, reducing the amount of resistors used. Furthermore, the adhesion of the edge of the plating resist to the lowermost layer on the surface side of the external electrode is good, and the resistor can be completely protected from the plating layer. Furthermore, since a silver-palladium alloy is used for the lowermost layer on the surface side, there is no problem of silver hollowing in the exposed portion due to the provision of a gap.
第１図ないし第４図は本発明の第１実施例を示し、第１
図は可変抵抗器の中央断面図、第２図は摺動子の斜視図
、第３図は絶縁基板の平面図、第４図は外部電極の詳細
を示すＡ−Ａ断面図である。
第５図ないし第７図は本発明の＄２実施例を示し、第５
図は平面図、第６図は中央断面図、第７図は底面図であ
る。第８図は従来の可変抵抗器の絶縁基板の斜視図、第
９図はその外部電極を示す断面図である。
１０・・・絶縁基板、１５・・・ザーメット抵抗体、１
６・・・外部電極、１６ａ・・・表面側最下層、１６８
′・・・端面側最下層、１６ａ”・・・裏面側最下層、
１６ｂ、１６ｃ・・・メッキ層、１７・・・コレクタ電
極、１８・・・外部電極、２０・・・摺動子。1 to 4 show a first embodiment of the present invention.
2 is a perspective view of the slider, FIG. 3 is a plan view of the insulating substrate, and FIG. 4 is a sectional view taken along line A-A showing details of the external electrode. Figures 5 through 7 show a $2 embodiment of the present invention;
The figure is a plan view, FIG. 6 is a central sectional view, and FIG. 7 is a bottom view. FIG. 8 is a perspective view of an insulating substrate of a conventional variable resistor, and FIG. 9 is a sectional view showing its external electrode. 10... Insulating substrate, 15... Zermet resistor, 1
6... External electrode, 16a... Bottom layer on surface side, 168
'... Bottom layer on the end side, 16a''... Bottom layer on the back side,
16b, 16c... Plating layer, 17... Collector electrode, 18... External electrode, 20... Slider.
Claims (1)
、抵抗体上を摺動する摺動子を回動可能に取り付けた可
変抵抗器において、 絶縁基板の端面近傍の表面部に設けた銀−パラジウム合
金からなる表面側最下層、絶縁基板の端面に設けた銀か
らなる端面側最下層、前記表面側最下層の一部と前記端
面側最下層とを覆う様に形成された少なくとも一層のメ
ッキ層にて構成された外部電極と、前記表面側最下層の
一部を覆う様に設置された抵抗体とを備え、前記メッキ
層と前記抵抗体との間にギャップを設けたことを特徴と
する可変抵抗器。(1) In a variable resistor in which a slider that slides on the resistor is rotatably attached to an insulating substrate on which an arc-shaped resistor is formed, a slider that slides on the resistor is rotatably attached to the surface near the end face of the insulating substrate. A lowermost layer on the surface side made of a silver-palladium alloy provided on the insulating substrate, a lowermost layer on the end surface side made of silver provided on the end surface of the insulating substrate, a part of the lowermost layer on the surface side and the lowermost layer on the end surface side. An external electrode configured with at least one plating layer, and a resistor installed to cover a part of the bottom layer on the surface side, with a gap provided between the plating layer and the resistor. A variable resistor characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30349886A JPS63155704A (en) | 1986-12-19 | 1986-12-19 | Variable resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30349886A JPS63155704A (en) | 1986-12-19 | 1986-12-19 | Variable resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63155704A true JPS63155704A (en) | 1988-06-28 |
Family
ID=17921689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30349886A Pending JPS63155704A (en) | 1986-12-19 | 1986-12-19 | Variable resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155704A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03214601A (en) * | 1990-01-19 | 1991-09-19 | Alps Electric Co Ltd | Electrode structure of variable resistor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592302A (en) * | 1982-06-28 | 1984-01-07 | 日本電気株式会社 | Variable resistor and method of producing same |
-
1986
- 1986-12-19 JP JP30349886A patent/JPS63155704A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592302A (en) * | 1982-06-28 | 1984-01-07 | 日本電気株式会社 | Variable resistor and method of producing same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03214601A (en) * | 1990-01-19 | 1991-09-19 | Alps Electric Co Ltd | Electrode structure of variable resistor |
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