JPS63155669U - - Google Patents
Info
- Publication number
- JPS63155669U JPS63155669U JP4890687U JP4890687U JPS63155669U JP S63155669 U JPS63155669 U JP S63155669U JP 4890687 U JP4890687 U JP 4890687U JP 4890687 U JP4890687 U JP 4890687U JP S63155669 U JPS63155669 U JP S63155669U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- multilayer printed
- wiring board
- printed wiring
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4890687U JPS63155669U (de) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4890687U JPS63155669U (de) | 1987-03-30 | 1987-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63155669U true JPS63155669U (de) | 1988-10-12 |
Family
ID=30870876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4890687U Pending JPS63155669U (de) | 1987-03-30 | 1987-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155669U (de) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137295A (ja) * | 1988-11-17 | 1990-05-25 | Ibiden Co Ltd | 多層プリント配線板 |
| JPH02114963U (de) * | 1989-03-03 | 1990-09-14 | ||
| JP2013074154A (ja) * | 2011-09-28 | 2013-04-22 | Hitachi Chemical Co Ltd | 多層配線基板及びその製造方法 |
-
1987
- 1987-03-30 JP JP4890687U patent/JPS63155669U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137295A (ja) * | 1988-11-17 | 1990-05-25 | Ibiden Co Ltd | 多層プリント配線板 |
| JPH02114963U (de) * | 1989-03-03 | 1990-09-14 | ||
| JP2013074154A (ja) * | 2011-09-28 | 2013-04-22 | Hitachi Chemical Co Ltd | 多層配線基板及びその製造方法 |