JPS63155650U - - Google Patents

Info

Publication number
JPS63155650U
JPS63155650U JP4971287U JP4971287U JPS63155650U JP S63155650 U JPS63155650 U JP S63155650U JP 4971287 U JP4971287 U JP 4971287U JP 4971287 U JP4971287 U JP 4971287U JP S63155650 U JPS63155650 U JP S63155650U
Authority
JP
Japan
Prior art keywords
external lead
unconnected
wide
external
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4971287U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451489Y2 (US07709020-20100504-C00041.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987049712U priority Critical patent/JPH0451489Y2/ja
Publication of JPS63155650U publication Critical patent/JPS63155650U/ja
Application granted granted Critical
Publication of JPH0451489Y2 publication Critical patent/JPH0451489Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1987049712U 1987-03-31 1987-03-31 Expired JPH0451489Y2 (US07709020-20100504-C00041.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987049712U JPH0451489Y2 (US07709020-20100504-C00041.png) 1987-03-31 1987-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987049712U JPH0451489Y2 (US07709020-20100504-C00041.png) 1987-03-31 1987-03-31

Publications (2)

Publication Number Publication Date
JPS63155650U true JPS63155650U (US07709020-20100504-C00041.png) 1988-10-12
JPH0451489Y2 JPH0451489Y2 (US07709020-20100504-C00041.png) 1992-12-03

Family

ID=30872419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987049712U Expired JPH0451489Y2 (US07709020-20100504-C00041.png) 1987-03-31 1987-03-31

Country Status (1)

Country Link
JP (1) JPH0451489Y2 (US07709020-20100504-C00041.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0393257A (ja) * 1989-09-05 1991-04-18 Toshiba Corp 樹脂封止型半導体装置
JP2008060597A (ja) * 2001-05-18 2008-03-13 Sanyo Electric Co Ltd 電源回路装置
JP2010016289A (ja) * 2008-07-07 2010-01-21 Mitsubishi Electric Corp 半導体パッケージおよび半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155757A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Semiconductor device
JPS59115653U (ja) * 1983-01-25 1984-08-04 サンケン電気株式会社 絶縁物封止半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155757A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Semiconductor device
JPS59115653U (ja) * 1983-01-25 1984-08-04 サンケン電気株式会社 絶縁物封止半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0393257A (ja) * 1989-09-05 1991-04-18 Toshiba Corp 樹脂封止型半導体装置
JP2008060597A (ja) * 2001-05-18 2008-03-13 Sanyo Electric Co Ltd 電源回路装置
JP4651652B2 (ja) * 2001-05-18 2011-03-16 三洋電機株式会社 電源回路装置
JP2010016289A (ja) * 2008-07-07 2010-01-21 Mitsubishi Electric Corp 半導体パッケージおよび半導体装置

Also Published As

Publication number Publication date
JPH0451489Y2 (US07709020-20100504-C00041.png) 1992-12-03

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