JPS63155106U - - Google Patents

Info

Publication number
JPS63155106U
JPS63155106U JP4839287U JP4839287U JPS63155106U JP S63155106 U JPS63155106 U JP S63155106U JP 4839287 U JP4839287 U JP 4839287U JP 4839287 U JP4839287 U JP 4839287U JP S63155106 U JPS63155106 U JP S63155106U
Authority
JP
Japan
Prior art keywords
groove
optical fiber
silicon substrate
silicon
coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4839287U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4839287U priority Critical patent/JPS63155106U/ja
Publication of JPS63155106U publication Critical patent/JPS63155106U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例の模式的な斜視図
、第2図は位置関係を説明するための正面図、第
3図A,B,Cは接合の手順を示す正面図である
。 1…シリコン基板、2…V溝、3…光導波路基
板、4…光導波路領域、5…光フアイバ、51…
コア部、52…クラツド部、6…直流電源。
FIG. 1 is a schematic perspective view of an embodiment of this invention, FIG. 2 is a front view for explaining the positional relationship, and FIGS. 3A, B, and C are front views showing the joining procedure. DESCRIPTION OF SYMBOLS 1... Silicon substrate, 2... V groove, 3... Optical waveguide substrate, 4... Optical waveguide region, 5... Optical fiber, 51...
Core part, 52... Clad part, 6... DC power supply.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 光フアイバを置いて位置決めするためのV溝が
形成されたシリコン基板と、該シリコン基板のV
溝が形成された面に、電界印加熱接合により接合
された、シリコンに近い熱膨張率のガラスよりな
る光導波路基板とを有してなる光フアイバ接続装
置。
A silicon substrate in which a V groove for placing and positioning an optical fiber is formed, and a V groove in the silicon substrate.
An optical fiber connection device comprising an optical waveguide substrate made of glass having a coefficient of thermal expansion close to that of silicon and bonded to a surface in which a groove is formed by electric field application heat bonding.
JP4839287U 1987-03-31 1987-03-31 Pending JPS63155106U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4839287U JPS63155106U (en) 1987-03-31 1987-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4839287U JPS63155106U (en) 1987-03-31 1987-03-31

Publications (1)

Publication Number Publication Date
JPS63155106U true JPS63155106U (en) 1988-10-12

Family

ID=30869877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4839287U Pending JPS63155106U (en) 1987-03-31 1987-03-31

Country Status (1)

Country Link
JP (1) JPS63155106U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63311213A (en) * 1987-06-12 1988-12-20 Sumitomo Electric Ind Ltd Optical waveguide device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57119314A (en) * 1981-01-16 1982-07-24 Omron Tateisi Electronics Co Connecting method between optical fiber and optical waveguide
JPS60260136A (en) * 1984-06-06 1985-12-23 Nec Corp Electrostatic bonding method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57119314A (en) * 1981-01-16 1982-07-24 Omron Tateisi Electronics Co Connecting method between optical fiber and optical waveguide
JPS60260136A (en) * 1984-06-06 1985-12-23 Nec Corp Electrostatic bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63311213A (en) * 1987-06-12 1988-12-20 Sumitomo Electric Ind Ltd Optical waveguide device

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