JPS63149733U - - Google Patents
Info
- Publication number
- JPS63149733U JPS63149733U JP4391787U JP4391787U JPS63149733U JP S63149733 U JPS63149733 U JP S63149733U JP 4391787 U JP4391787 U JP 4391787U JP 4391787 U JP4391787 U JP 4391787U JP S63149733 U JPS63149733 U JP S63149733U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- support plate
- inclined surface
- head substrate
- abutment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案のサーマルヘツドの１実施例を
示す断面図、第２図は第１図における支持板の断
面図、第３図は第１図におけるサーマルヘツド基
板の平面図および断面図、第４図は従来のサーマ
ルヘツドの接着方式を説明するための斜視図、第
５図は感熱転写記録装置の概略図である。
８……発熱抵抗体、９……サーマルヘツド基板
、１０……支持板、１１……接着剤、１３……傾
斜面、１４……突き当て部、１５……接着剤流入
部。
FIG. 1 is a sectional view showing one embodiment of the thermal head of the present invention, FIG. 2 is a sectional view of the support plate in FIG. 1, and FIG. 3 is a plan view and a sectional view of the thermal head substrate in FIG. 1. FIG. 4 is a perspective view for explaining a conventional thermal head adhesion system, and FIG. 5 is a schematic diagram of a thermal transfer recording apparatus. 8... Heat generating resistor, 9... Thermal head substrate, 10... Support plate, 11... Adhesive, 13... Inclined surface, 14... Abutting portion, 15... Adhesive inflow portion.
Claims (1)
支持板に接着固定してなるサーマルヘツドにおい
て、該支持板には前記サーマルヘツド基板が当接
される突き当て部および傾斜面を設けると共に、
これら突き当て部と傾斜面の間に接着剤流入部を
設けることを特徴とするサーマルヘツド。 In a thermal head formed by adhesively fixing a thermal head substrate on which a heating resistor is formed to a support plate, the support plate is provided with an abutment portion and an inclined surface against which the thermal head substrate is brought into contact, and
A thermal head characterized in that an adhesive inflow section is provided between the abutment section and the inclined surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4391787U JPS63149733U (en) | 1987-03-25 | 1987-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4391787U JPS63149733U (en) | 1987-03-25 | 1987-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63149733U true JPS63149733U (en) | 1988-10-03 |
Family
ID=30861233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4391787U Pending JPS63149733U (en) | 1987-03-25 | 1987-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63149733U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014069414A (en) * | 2012-09-28 | 2014-04-21 | Toshiba Hokuto Electronics Corp | Thermal print head, method of producing thermal print head and printer |
-
1987
- 1987-03-25 JP JP4391787U patent/JPS63149733U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014069414A (en) * | 2012-09-28 | 2014-04-21 | Toshiba Hokuto Electronics Corp | Thermal print head, method of producing thermal print head and printer |
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