JPH0428464U - - Google Patents
Info
- Publication number
- JPH0428464U JPH0428464U JP6966390U JP6966390U JPH0428464U JP H0428464 U JPH0428464 U JP H0428464U JP 6966390 U JP6966390 U JP 6966390U JP 6966390 U JP6966390 U JP 6966390U JP H0428464 U JPH0428464 U JP H0428464U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- light source
- laser light
- holding member
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
Landscapes
- Moving Of The Head For Recording And Reproducing By Optical Means (AREA)
- Optical Head (AREA)
Description
第1図aおよびbは本考案半導体レーザ装置の
第1実施例の構成を示す分解斜視図および断面図
、第2図は本考案半導体レーザ装置の第2実施例
の構成を示す分解斜視図、第3図は本考案半導体
レーザ装置の第3実施例の構成を示す分解斜視図
、第4図aおよびbは本考案半導体レーザ装置の
第4実施例の構成を示す断面図および斜視図、第
5図aおよびbは従来の半導体レーザ装置の構成
を示す分解斜視図および断面図である。
1……保持部材、2……半導体レーザ装置(L
D)、3……放熱板、4……固定ネジ、5……外
枠部。
1A and 1B are an exploded perspective view and a sectional view showing the structure of a first embodiment of the semiconductor laser device of the present invention, FIG. 2 is an exploded perspective view showing the structure of a second embodiment of the semiconductor laser device of the present invention, 3 is an exploded perspective view showing the structure of a third embodiment of the semiconductor laser device of the present invention, FIGS. 4a and 4b are sectional views and perspective views showing the structure of the fourth embodiment of the semiconductor laser device of the present invention, 5A and 5B are an exploded perspective view and a sectional view showing the structure of a conventional semiconductor laser device. 1... Holding member, 2... Semiconductor laser device (L
D), 3... Heat sink, 4... Fixing screw, 5... Outer frame part.
Claims (1)
合し保持する保持部材と、前記半導体レーザ光源
を保持部材に固定する放熱板とからなる半導体レ
ーザ装置において、前記放熱板および前記保持部
材の固定部と、半導体レーザ光源との接触面の中
間に、固定部2カ所を結ぶ線に対し垂直方向の溝
を設けたことを特徴とする半導体レーザ装置。 In a semiconductor laser device comprising a semiconductor laser light source, a holding member that fits and holds the semiconductor laser light source, and a heat sink that fixes the semiconductor laser light source to the holding member, a fixing portion of the heat sink and the holding member; A semiconductor laser device characterized in that a groove is provided in the middle of a contact surface with a semiconductor laser light source in a direction perpendicular to a line connecting two fixing parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6966390U JPH0428464U (en) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6966390U JPH0428464U (en) | 1990-06-29 | 1990-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0428464U true JPH0428464U (en) | 1992-03-06 |
Family
ID=31605167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6966390U Pending JPH0428464U (en) | 1990-06-29 | 1990-06-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0428464U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005136171A (en) * | 2003-10-30 | 2005-05-26 | Sankyo Seiki Mfg Co Ltd | Semiconductor laser device and optical head device |
JP2006216114A (en) * | 2005-02-02 | 2006-08-17 | Funai Electric Co Ltd | Optical pickup and optical disk drive provided therewith |
WO2007099946A1 (en) * | 2006-02-28 | 2007-09-07 | Matsushita Electric Industrial Co., Ltd. | Optical pickup device and optical disc device |
-
1990
- 1990-06-29 JP JP6966390U patent/JPH0428464U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005136171A (en) * | 2003-10-30 | 2005-05-26 | Sankyo Seiki Mfg Co Ltd | Semiconductor laser device and optical head device |
JP2006216114A (en) * | 2005-02-02 | 2006-08-17 | Funai Electric Co Ltd | Optical pickup and optical disk drive provided therewith |
WO2007099946A1 (en) * | 2006-02-28 | 2007-09-07 | Matsushita Electric Industrial Co., Ltd. | Optical pickup device and optical disc device |