JPH0428464U - - Google Patents

Info

Publication number
JPH0428464U
JPH0428464U JP6966390U JP6966390U JPH0428464U JP H0428464 U JPH0428464 U JP H0428464U JP 6966390 U JP6966390 U JP 6966390U JP 6966390 U JP6966390 U JP 6966390U JP H0428464 U JPH0428464 U JP H0428464U
Authority
JP
Japan
Prior art keywords
semiconductor laser
light source
laser light
holding member
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6966390U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6966390U priority Critical patent/JPH0428464U/ja
Publication of JPH0428464U publication Critical patent/JPH0428464U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moving Of The Head For Recording And Reproducing By Optical Means (AREA)
  • Optical Head (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aおよびbは本考案半導体レーザ装置の
第1実施例の構成を示す分解斜視図および断面図
、第2図は本考案半導体レーザ装置の第2実施例
の構成を示す分解斜視図、第3図は本考案半導体
レーザ装置の第3実施例の構成を示す分解斜視図
、第4図aおよびbは本考案半導体レーザ装置の
第4実施例の構成を示す断面図および斜視図、第
5図aおよびbは従来の半導体レーザ装置の構成
を示す分解斜視図および断面図である。 1……保持部材、2……半導体レーザ装置(L
D)、3……放熱板、4……固定ネジ、5……外
枠部。
1A and 1B are an exploded perspective view and a sectional view showing the structure of a first embodiment of the semiconductor laser device of the present invention, FIG. 2 is an exploded perspective view showing the structure of a second embodiment of the semiconductor laser device of the present invention, 3 is an exploded perspective view showing the structure of a third embodiment of the semiconductor laser device of the present invention, FIGS. 4a and 4b are sectional views and perspective views showing the structure of the fourth embodiment of the semiconductor laser device of the present invention, 5A and 5B are an exploded perspective view and a sectional view showing the structure of a conventional semiconductor laser device. 1... Holding member, 2... Semiconductor laser device (L
D), 3... Heat sink, 4... Fixing screw, 5... Outer frame part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体レーザ光源と、該半導体レーザ光源を嵌
合し保持する保持部材と、前記半導体レーザ光源
を保持部材に固定する放熱板とからなる半導体レ
ーザ装置において、前記放熱板および前記保持部
材の固定部と、半導体レーザ光源との接触面の中
間に、固定部2カ所を結ぶ線に対し垂直方向の溝
を設けたことを特徴とする半導体レーザ装置。
In a semiconductor laser device comprising a semiconductor laser light source, a holding member that fits and holds the semiconductor laser light source, and a heat sink that fixes the semiconductor laser light source to the holding member, a fixing portion of the heat sink and the holding member; A semiconductor laser device characterized in that a groove is provided in the middle of a contact surface with a semiconductor laser light source in a direction perpendicular to a line connecting two fixing parts.
JP6966390U 1990-06-29 1990-06-29 Pending JPH0428464U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6966390U JPH0428464U (en) 1990-06-29 1990-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6966390U JPH0428464U (en) 1990-06-29 1990-06-29

Publications (1)

Publication Number Publication Date
JPH0428464U true JPH0428464U (en) 1992-03-06

Family

ID=31605167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6966390U Pending JPH0428464U (en) 1990-06-29 1990-06-29

Country Status (1)

Country Link
JP (1) JPH0428464U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136171A (en) * 2003-10-30 2005-05-26 Sankyo Seiki Mfg Co Ltd Semiconductor laser device and optical head device
JP2006216114A (en) * 2005-02-02 2006-08-17 Funai Electric Co Ltd Optical pickup and optical disk drive provided therewith
WO2007099946A1 (en) * 2006-02-28 2007-09-07 Matsushita Electric Industrial Co., Ltd. Optical pickup device and optical disc device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136171A (en) * 2003-10-30 2005-05-26 Sankyo Seiki Mfg Co Ltd Semiconductor laser device and optical head device
JP2006216114A (en) * 2005-02-02 2006-08-17 Funai Electric Co Ltd Optical pickup and optical disk drive provided therewith
WO2007099946A1 (en) * 2006-02-28 2007-09-07 Matsushita Electric Industrial Co., Ltd. Optical pickup device and optical disc device

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