JPS63153537U - - Google Patents
Info
- Publication number
- JPS63153537U JPS63153537U JP4604087U JP4604087U JPS63153537U JP S63153537 U JPS63153537 U JP S63153537U JP 4604087 U JP4604087 U JP 4604087U JP 4604087 U JP4604087 U JP 4604087U JP S63153537 U JPS63153537 U JP S63153537U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor
- semiconductor wafer
- holder
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims 2
Landscapes
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4604087U JPS63153537U (fr) | 1987-03-27 | 1987-03-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4604087U JPS63153537U (fr) | 1987-03-27 | 1987-03-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63153537U true JPS63153537U (fr) | 1988-10-07 |
Family
ID=30865332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4604087U Pending JPS63153537U (fr) | 1987-03-27 | 1987-03-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63153537U (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03218017A (ja) * | 1990-01-23 | 1991-09-25 | Tokyo Electron Ltd | 縦型熱処理装置 |
WO2010041446A1 (fr) * | 2008-10-08 | 2010-04-15 | 株式会社アルバック | Appareil de traitement sous vide |
-
1987
- 1987-03-27 JP JP4604087U patent/JPS63153537U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03218017A (ja) * | 1990-01-23 | 1991-09-25 | Tokyo Electron Ltd | 縦型熱処理装置 |
WO2010041446A1 (fr) * | 2008-10-08 | 2010-04-15 | 株式会社アルバック | Appareil de traitement sous vide |
JPWO2010041446A1 (ja) * | 2008-10-08 | 2012-03-08 | 株式会社アルバック | 真空処理装置 |
JP5142414B2 (ja) * | 2008-10-08 | 2013-02-13 | 株式会社アルバック | 真空処理装置 |