JPS63151446A - Electric laminated board - Google Patents
Electric laminated boardInfo
- Publication number
- JPS63151446A JPS63151446A JP29957786A JP29957786A JPS63151446A JP S63151446 A JPS63151446 A JP S63151446A JP 29957786 A JP29957786 A JP 29957786A JP 29957786 A JP29957786 A JP 29957786A JP S63151446 A JPS63151446 A JP S63151446A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- foaming
- laminate
- prepreg
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 238000005187 foaming Methods 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 13
- 239000004604 Blowing Agent Substances 0.000 description 9
- 238000000354 decomposition reaction Methods 0.000 description 9
- 239000004088 foaming agent Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005273 aeration Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 239000004156 Azodicarbonamide Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101000650578 Salmonella phage P22 Regulatory protein C3 Proteins 0.000 description 1
- 101001040920 Triticum aestivum Alpha-amylase inhibitor 0.28 Proteins 0.000 description 1
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 1
- 235000019399 azodicarbonamide Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Insulating Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔技術分野〕 この発明は、電気用積層板に関する。。[Detailed description of the invention] 〔Technical field〕 The present invention relates to an electrical laminate. .
最近は、種々の分野で軽薄短小化が進んでおり、電気用
積層板を用いた機器も例外ではない。このような機器で
は、回路素子、回路構成などでも軽薄短小化が進められ
ている。しかしながら、電気用積層板自体を軽薄短小化
しようとする試みはほとんど見られない。ただし、積層
板を軽薄短小化しても、強度や電気絶縁性などの諸物性
が不都合なほど劣化しては実用性が乏しい。Recently, devices have become lighter, thinner, and smaller in various fields, and devices using electrical laminates are no exception. In such devices, circuit elements, circuit configurations, etc. are also becoming lighter, thinner, and shorter. However, there are almost no attempts to make electrical laminates themselves lighter, thinner, shorter and smaller. However, even if the laminate is made lighter, thinner, shorter, and smaller, its physical properties such as strength and electrical insulation deteriorate to an undesirable degree, making it impractical.
この発明は、以上のことに鑑みて、強度や絶縁抵抗など
の諸物性が不都合なほど劣化せず、軽１化された電気用
積層板を提供することを目的とする。In view of the above, an object of the present invention is to provide an electrical laminate that is light in weight and does not deteriorate in physical properties such as strength and insulation resistance to an undesirable degree.
この発明は、上記の目的を達成するために、プリプレグ
が積層成形されて作られた電気用積層板において、前記
プリプレグの樹脂として発泡性のものが用いられ、発泡
倍率が３．０以下であることを特徴とする電気用積層板
を要旨とする。In order to achieve the above object, the present invention provides an electrical laminate made by laminating and molding prepreg, in which a foamable resin is used as the prepreg resin, and the foaming ratio is 3.0 or less. The gist is an electrical laminate that is characterized by the following.
以下に、この発明の詳細な説明する。The present invention will be explained in detail below.
この発明にかかる電気用積層板も、通常のとおり、基材
に樹脂を含浸させてなるプリプレグを用い、積層成形し
て作られている。その際、プリプレグのみを所望の枚数
で積層成形して得てもよいし、プリプレグ１枚またはそ
れ以上とＳＲｔｇなどの金属箔（片面または両面）とを
積層成形して得てもよいし、３層以上のＷ体層を有する
多層板としてもよく、層構成に特に限定はない。The electrical laminate according to the present invention is also manufactured by laminating and molding using prepreg, which is a base material impregnated with resin, as usual. At that time, it may be obtained by laminating only a desired number of prepregs, or it may be obtained by laminating one or more sheets of prepreg and a metal foil such as SRtg (one side or both sides), or three It may be a multilayer board having more than one W body layer, and there is no particular limitation on the layer structure.
この発明では、プリプレグを作る際には含浸させる樹脂
として発泡性の樹脂が用いられている。In this invention, a foamable resin is used as the resin to be impregnated when making the prepreg.
すなわち、この樹脂を発泡させることにより、積層板の
密度（または比重）を低下させ、積層板の軽量化を行っ
ているのである。That is, by foaming this resin, the density (or specific gravity) of the laminate is lowered and the weight of the laminate is reduced.
樹脂を発泡性のものとするには、各種の発泡法により行
うことができる。たとえば、気体混入法、発泡剤分解法
、溶剤気散法、化学反応法等があり特に限定はない。し
かし、これらの中でも主として発泡剤分解法または溶剤
気散法によれば、樹脂を容易に発泡させることができる
ので好ましい発泡剤分解法は、加熱などにより分解する
タイプの発泡剤を用い、その発泡剤の分解により発生す
る気体で発泡させる方法である。このような発泡剤には
特に限定はないが、たとえば、東邦化学針からビニホー
ルＡＣなどの商品名で市販されているアゾジカルボンア
ミド（Ａ、Ｄ、Ｃ，Ａ、） 、東邦化学針からビニホー
ルＡＺなどの商品名で市販されているアゾビスイソブチ
ロニトリル（Ａ、 １．Ｂ、Ｎ、）、東邦化学針からセ
ルラーなどの商品名で市販されているジニトロソペンタ
メヂレンテトラミン（Ｄ、Ｐ、Ｔ、） 、東邦化学針か
らネオセルボンなどの商品名で市販されている、４．４
′−オキシビス（ベンゼンスルホニルヒドラジド）
（０，Ｂ、Ｓ、１）．）、東邦化学針からユニホールな
どの商品名で市販されているパラトルエンスルホニルヒ
ドラジド（Ｔ。Various foaming methods can be used to make the resin foamable. For example, there are no particular limitations, such as a gas mixing method, a blowing agent decomposition method, a solvent aeration method, and a chemical reaction method. However, among these methods, the blowing agent decomposition method or the solvent aeration method is preferable because the resin can be easily foamed. This is a method of foaming using gas generated by decomposition of the agent. There are no particular limitations on such blowing agents, but examples include azodicarbonamide (A, D, C, A,) commercially available from Toho Kagaku Needle under trade names such as Vinifol AC, and Toho Kagaku Needle under the trade name Vinifol AZ. azobisisobutyronitrile (A, 1.B, N,), which is commercially available under the trade names of P, T, ), 4.4, which is commercially available from Toho Kagakushin under trade names such as Neocellvon.
′-Oxybis(benzenesulfonylhydrazide)
(0, B, S, 1). ), para-toluenesulfonyl hydrazide (T.
５．１）．）などが挙げられるが、もちろん他社の製品
、他の物質でもよい。5.1). ), but of course products from other companies or other substances may also be used.
溶剤気散法は、加熱などにより蒸発するタイプの発泡剤
を用い、その発泡剤の気化膨張により樹脂を発泡させる
方法である。このような発泡剤としては、特に限定はな
いが、たとえば、ダイキン工業−のフレオンガスなどが
挙げられる。The solvent aeration method is a method in which a foaming agent that evaporates by heating or the like is used, and the resin is foamed by the vaporization expansion of the foaming agent. Such a blowing agent is not particularly limited, but includes, for example, Freon gas manufactured by Daikin Industries.
樹脂と、上記のような分解型または蒸発型の発泡剤、お
よび、必要に応じて他の物質を混ぜ合わせれば、発泡性
の樹脂とすることができる。A foamable resin can be obtained by mixing the resin, a decomposition type or evaporation type foaming agent as described above, and other substances as necessary.
基材に含浸される樹脂は特に限定はないが、たとえば、
フェノール樹脂、エポキシ樹脂などが挙げられる。樹脂
を基材に含浸させる際に、上記のような発泡剤を一緒に
含浸させる。樹脂フェスに発泡剤を配合しておけば、発
泡剤が樹脂と一緒に含浸されるが°、他のやり方で発泡
剤を樹脂と混ぜてもよい。The resin impregnated into the base material is not particularly limited, but for example,
Examples include phenol resin and epoxy resin. When impregnating the base material with the resin, a blowing agent such as the one described above is also impregnated. If a foaming agent is blended into the resin face, the foaming agent will be impregnated together with the resin, but the foaming agent may be mixed with the resin in other ways.
発泡性の樹脂を含むプリプレグは、所望の枚数で積層さ
れ、樹脂に応じた成形温度、圧力で成形される。発泡剤
が分解型のものであれば、その分解温度以上に昇温させ
、発泡させる。また、分解促進助剤等を用いて、発泡剤
の分解温度を適宜の温度まで低下させることも可能であ
る。発泡剤が蒸発型のものであれば、その蒸発温度以上
に昇温させ、発泡させる。発泡剤により発生した気体は
必要に応じて、ガス抜きの要領で除けばよい。樹脂が熱
硬化性のものであるか、または、軟化点が高いものであ
れば、得られた積層板を半田浴などに浮かべたり、浸漬
したりしたときに発泡体となった構造が潰れるおそれが
ない。このため、この発明に用いる樹脂は、熱硬化性樹
脂または軟化点の高い（たとえば、１８０℃以上）の熱
可塑性樹脂が好ましい。また、樹脂の発泡体は、積層板
の強度および耐湿性等を考慮すると、硬質フオームが好
ましい。A desired number of prepregs containing a foamable resin are laminated and molded at a molding temperature and pressure depending on the resin. If the foaming agent is of a decomposition type, the temperature is raised above its decomposition temperature to cause foaming. It is also possible to lower the decomposition temperature of the blowing agent to an appropriate temperature by using a decomposition accelerating aid or the like. If the foaming agent is of an evaporative type, the temperature is raised above the evaporation temperature to cause foaming. Gas generated by the blowing agent may be removed by degassing, if necessary. If the resin is thermosetting or has a high softening point, there is a risk that the foamed structure will collapse when the resulting laminate is floated or immersed in a solder bath, etc. There is no. Therefore, the resin used in the present invention is preferably a thermosetting resin or a thermoplastic resin having a high softening point (for example, 180° C. or higher). Further, the resin foam is preferably a rigid foam in consideration of the strength and moisture resistance of the laminate.
なお、発泡は、積層板自体で３．０倍以下の発泡倍率と
なるようにする必要がある。３．０倍を越えると、積層
板の強度が低下するとともに、耐湿性が劣化する。耐湿
性の劣化は、電気絶縁性の劣化をもたらす。Note that the foaming needs to be done so that the foaming ratio of the laminate itself is 3.0 times or less. When it exceeds 3.0 times, the strength of the laminate decreases and moisture resistance deteriorates. Deterioration of moisture resistance results in deterioration of electrical insulation.
プリプレグの樹脂含浸率は通常の範囲、たとえば、５０
％程度でよいが、樹脂が多いほど発泡効果が大きいので
、たとえば、樹脂含浸率６０％程度あるいはそれ以上と
してもよい。The resin impregnation rate of the prepreg is within a normal range, for example, 50
%, but since the larger the amount of resin, the greater the foaming effect, the resin impregnation rate may be, for example, about 60% or higher.
従来の各種積層板の標準グレード（いずれも銅箔無し）
の仮密度と、これらにそれぞれ対応し、この発明の電気
用積層板の実施例に含まれる低発泡倍率の硬質発泡化積
層板の板密度（見掛は密度）とを第１表に示した。Standard grade of various conventional laminates (all without copper foil)
Table 1 shows the tentative densities of the rigid foamed laminates (apparent density) of the rigid foamed laminates with low expansion ratios included in the examples of the electrical laminates of the present invention corresponding to these. .
第１表にみるように、この発明にかかる電気用積層板は
、従来のものに比べて見掛は密度が低くなっている。こ
のため、同一厚みの積層板とすれば、積層板を軽量化す
ることができる。なお、この発明の電気用積層板の挿動
１はこれらに限定されない。As shown in Table 1, the electrical laminate according to the present invention has a lower apparent density than the conventional one. Therefore, if the laminates have the same thickness, the weight of the laminate can be reduced. Note that the electrical laminate insert 1 of the present invention is not limited to these.
以下に、実施例および比較例を具体的に示すが、この発
明は下記実施例に限定されない。Examples and comparative examples are specifically shown below, but the present invention is not limited to the following examples.
（実施例１〜３）
第２表に示す配合のフェスを紙基材（厚み０．２龍）に
含浸させ、樹脂含浸率６０％のプリプレグを得た。この
プリプレグを８枚重ね合わせ、成形温度１３０℃、成形
圧力３０ ｋｇ ／ ｃｎｌ、成形時間１５分間で約６
５％ゲル化させ、ついで、温度のみ１３０℃から１５０
℃へ５分間で昇温させた（この間に一部発泡化が開始さ
れる）。その後、ガス抜きの要領で成形圧を無圧〜接触
圧（実圧５ｋｇ／ＣＩＩＩ以下）程度に低下させ、５０
分間成形する二段階法で樹脂を完全硬化させて積層板を
得た。(Examples 1 to 3) A paper base material (thickness: 0.2 mm) was impregnated with a fabric having the composition shown in Table 2 to obtain a prepreg with a resin impregnation rate of 60%. By stacking 8 sheets of this prepreg at a molding temperature of 130°C, a molding pressure of 30 kg/cnl, and a molding time of 15 minutes, approximately 6.
5% gelation, then temperature only from 130℃ to 150℃
The temperature was raised to 0.degree. C. for 5 minutes (some foaming started during this time). After that, the molding pressure was reduced to about no pressure to contact pressure (actual pressure 5 kg/CIII or less) by degassing, and 50
A laminate was obtained by completely curing the resin using a two-step molding process.
発泡剤としては、比較的高温分解性（分解温度１５０〜
１６０℃）のヒドラジン系発泡剤（東邦化学製ネオセル
ポンＰ等）を用イタ。As a blowing agent, it is relatively high-temperature decomposable (decomposition temperature 150~
160°C) using a hydrazine-based blowing agent (Neoserpone P, manufactured by Toho Chemical Co., Ltd., etc.).
（比較例）
第２表に示す配合のフェスを紙基材（厚み０．２ｍ１ｄ
）に含浸させ、樹脂含浸率５０％のプリプレグを得た。(Comparative example) A paper substrate (thickness 0.2 m1d
) to obtain a prepreg with a resin impregnation rate of 50%.
このプリプレグを８枚重ね合わせ、成形温度１５５℃、
成形圧力１２０ｋｇ／ｃｕｔで７０分間成形する一段階
法で樹脂を完全硬化させて積層板を得た。8 sheets of this prepreg were stacked together at a molding temperature of 155°C.
A laminate was obtained by completely curing the resin using a one-step method of molding at a molding pressure of 120 kg/cut for 70 minutes.
測定は、ＪＩＳ Ｃ６４８１に準拠して行った。The measurement was performed in accordance with JIS C6481.
実施例および比較例で用いたフェノール樹脂は、いずれ
もレヅール型であった。The phenolic resins used in Examples and Comparative Examples were all Redzur type.
第２表にみるように、実施例の積層板は比較例のものに
比べて、見掛は仮比重が小さくなっている。絶縁抵抗、
オーブン耐熱性および曲げ強さは実施例のものも比較例
のものもほぼ同じである。As shown in Table 2, the apparent tentative specific gravity of the laminates of Examples is smaller than that of Comparative Examples. insulation resistance,
The oven heat resistance and bending strength of the examples and comparative examples are almost the same.
ただし、同一板厚で比較すると、実施例のものは、曲げ
強さなどが低下する傾向がある。したがって、発泡倍率
は３．０以下であることが必要である。軽量化の効果お
よび曲げ強さ等を考慮すると、発泡倍率は１．１〜１．
８程度が好ましい。１．１を下回ると軽量化の効果があ
まり現れないことがあり、１．８を上回ると曲げ強さが
劣化しすぎることがある。However, when compared with the same plate thickness, the examples tend to have lower bending strength. Therefore, the foaming ratio needs to be 3.0 or less. Considering the weight reduction effect, bending strength, etc., the foaming ratio is 1.1 to 1.
About 8 is preferable. If it is less than 1.1, the effect of weight reduction may not be noticeable, and if it exceeds 1.8, the bending strength may deteriorate too much.
この発明にかかる電気用積層板は、以上にみてきたよう
に、プリプレグの樹脂として発泡性のものが用いられ、
発泡倍率が３．０以下であるので、強度および耐湿性な
どの諸物性が不都合となるほど劣化することなく、機密
度が低下したものとなっており、軽量化できる。この発
明にか゛かる電気用積層板を用いれば、電子機器の軽量
化を図るのにメリットが大きい。As seen above, the electrical laminate according to the present invention uses a foamable prepreg resin,
Since the foaming ratio is 3.0 or less, the physical properties such as strength and moisture resistance do not deteriorate to the point where they become inconvenient, and the density is reduced, so that the weight can be reduced. Use of the electrical laminate according to the present invention has a great advantage in reducing the weight of electronic equipment.
代理人 弁理士 松 本 武 彦
畳り晴θ堅ネ甫正饗Ｔ（自発
昭和６２年 ４月２１日
昭和６１′ＥＡ郭’ＦＩ９誦２９９５７７号２、発明の
名称
電気用積層板
３、補正をする者
事件との関係 特許出願人
住 所 大阪府門真市大字門真１０４８番
地名 称（５８３）松下電工株式会社
代表者 イ懺馴役 藤井 貞夫
４、代理人
な し
６、？！正の対象 Ｐ６１−２９９５
７７明細書
７、？！正の内容
■ 明細書第３頁第１６行ないし第１７行、同頁第１８
行ないし第１９行、第４頁第１行、同頁第３行、および
、同頁第６行に「東邦化学社」とあるを、それぞれ、「
永和化成工業株式会社」と訂正する。Agent: Takehiko Matsumoto, Patent Attorney Tatamori Haru θ Ken Fu Masaki T (Spontaneous April 21, 1988, Showa 61 'EA Guo' FI9 Recitation No. 299577 No. 2, Title of Invention: Electrical Laminate 3, Amendment) Patent applicant address: 1048 Oaza Kadoma, Kadoma City, Osaka Name (583) Matsushita Electric Works Co., Ltd. Representative: Sadao Fujii 4, no agent 6, ?! Positive target P61 -2995
77 Statement 7,? ! Correct content■ Page 3 of the specification, lines 16 to 17, page 18 of the same page
``Toho Kagaku Co., Ltd.'' in lines 19 to 19, page 4, line 1, page 3, line 6, and page 6, respectively.
Eiwa Kasei Kogyo Co., Ltd.”
■ 明細書第９頁第１行ないし第２行に「東邦化学」と
あるを、「永和化成工業株式会社」と訂正する。■ In the first and second lines of page 9 of the specification, "Toho Chemical" is corrected to "Eiwa Kasei Kogyo Co., Ltd."
Claims (1)
板において、前記プリプレグの樹脂として発泡性のもの
が用いられ、発泡倍率が３．０以下であることを特徴と
する電気用積層板。(1) An electrical laminate made by laminating and molding prepreg, characterized in that a foamable resin is used as the prepreg resin, and the foaming ratio is 3.0 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29957786A JPS63151446A (en) | 1986-12-15 | 1986-12-15 | Electric laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29957786A JPS63151446A (en) | 1986-12-15 | 1986-12-15 | Electric laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63151446A true JPS63151446A (en) | 1988-06-24 |
| JPH0473705B2 JPH0473705B2 (en) | 1992-11-24 |
Family
ID=17874433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29957786A Granted JPS63151446A (en) | 1986-12-15 | 1986-12-15 | Electric laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63151446A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011046083A (en) * | 2009-08-26 | 2011-03-10 | Panasonic Electric Works Co Ltd | Metal-clad laminate and method of manufacturing the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102037635B (en) | 2008-05-23 | 2013-08-28 | 本田技研工业株式会社 | Equipment for manufacturing stator |
| JP5353366B2 (en) | 2009-03-27 | 2013-11-27 | アイシン精機株式会社 | Rotating electric machine stator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62127325A (en) * | 1985-11-26 | 1987-06-09 | Hitachi Chem Co Ltd | Production of flame-retarding phenolic resin laminate |
| JPS62127326A (en) * | 1985-11-26 | 1987-06-09 | Hitachi Chem Co Ltd | Production of laminate |
-
1986
- 1986-12-15 JP JP29957786A patent/JPS63151446A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62127325A (en) * | 1985-11-26 | 1987-06-09 | Hitachi Chem Co Ltd | Production of flame-retarding phenolic resin laminate |
| JPS62127326A (en) * | 1985-11-26 | 1987-06-09 | Hitachi Chem Co Ltd | Production of laminate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011046083A (en) * | 2009-08-26 | 2011-03-10 | Panasonic Electric Works Co Ltd | Metal-clad laminate and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0473705B2 (en) | 1992-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |