JPS63149547U - - Google Patents
Info
- Publication number
- JPS63149547U JPS63149547U JP1987043097U JP4309787U JPS63149547U JP S63149547 U JPS63149547 U JP S63149547U JP 1987043097 U JP1987043097 U JP 1987043097U JP 4309787 U JP4309787 U JP 4309787U JP S63149547 U JPS63149547 U JP S63149547U
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- heat
- heat dissipation
- electronic component
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図は本考案に係る電子部品の放熱構造の一
実施例断面図、第2図は従来の放熱構造の斜視図
、第3図は第2図に示した従来例の背面図、第4
図は他の従来例を示す正面図である。 10……プリント配線板、11……ピン、12
……電子部品、16……ヒートパイプ、20……
放熱フイン、26……セラミツク基板、28……
ICチツプ、30……密封蓋、32……配線。
実施例断面図、第2図は従来の放熱構造の斜視図
、第3図は第2図に示した従来例の背面図、第4
図は他の従来例を示す正面図である。 10……プリント配線板、11……ピン、12
……電子部品、16……ヒートパイプ、20……
放熱フイン、26……セラミツク基板、28……
ICチツプ、30……密封蓋、32……配線。
Claims (1)
- 【実用新案登録請求の範囲】 プリント配線板10上に実装された電子部品1
2にヒートパイプ16を接続し、該ヒートパイプ
16の放熱部分に放熱フイン20を取付けて、電
子部品12で発生した熱を放熱フイン20から放
熱する電子部品の放熱構造において、 電子部品12の密封蓋30に取付穴を設け、該
取付穴にヒートパイプ16を気密接続すると共に
、 ヒートパイプ16内部に絶縁性作動液を封入し
、作動液が直接電子部品12のチツプ部分28に
接触するようにしたことを特徴とする電子部品の
放熱構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987043097U JPS63149547U (ja) | 1987-03-24 | 1987-03-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987043097U JPS63149547U (ja) | 1987-03-24 | 1987-03-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63149547U true JPS63149547U (ja) | 1988-10-03 |
Family
ID=30859633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987043097U Pending JPS63149547U (ja) | 1987-03-24 | 1987-03-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63149547U (ja) |
-
1987
- 1987-03-24 JP JP1987043097U patent/JPS63149547U/ja active Pending