JPS63148640A - Semiconductor substrate washer - Google Patents

Abstract

PURPOSE:To facilitate the washing of a substrate which is subjected to a precision processing securely by a method wherein a ring member is provided above the substrate to make washing solution stay on the substrate for a required time. CONSTITUTION:A mechanical chuck 21 on which a substrate 23 is placed horizontally, a ring member 24 which is provided closely to or made to adhere tightly to the substrate 23 and has a diameter smaller than the diameter of the substrate 23, 1st nozzle 25 which is provided above the substrate 23 and pours pure water onto the substrate 23 and 2nd nozzle 26 which is provided above the substrate 23 and pours chemical solution onto the substrate 23 are provided. By providing the ring member 24 with a diameter smaller than the diameter of the substrate 23 closely to the substrate 23 or by making the ring member 24 adhere tightly to the substrate 23, a time during which the washing solution is staying on the substrate 23 can be selectively predetermined. With this constitution, a semiconductor substrate which is subjected to a precision processing can be positively washed.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Field of Application) The present invention relates to a cleaning device for semiconductor substrates, and in particular, to a cleaning device for semiconductor substrates, particularly for cleaning devices with a high degree of integration of 1M pitch or more on which microfabrication with a design rule of 1 μm or less is formed. It is used for cleaning dynamic memories and large diameter silicon substrates of 8 inches or more. (Prior art) Conventionally, there are two types of semiconductor substrate cleaning apparatuses.

(1) Patch type cleaning device (shown in Figure 5) 1 in the figure is a cleaning tank having a drain 2 at the bottom. This cleaning ial
A cleaning liquid 3 is stored inside this cleaning tank 1. A cleaning liquid 3 is stored inside this cleaning tank 1. A tray 5 in which a semiconductor substrate 4 is set is placed in the cleaning chamber. Note that 6 in the figure is a chemical solution or pure water supply system. The operation of such a device is as follows. First, the semiconductor substrate 4 is placed in the core rear 5, and the carrier 5 is placed in the cleaning tank IK.

Here, a chemical solution or a liquid is supplied to the cleaning @X from a pure water supply system 6, and the drain 2 is used to drain the cleaning liquid 3 from the cleaning tank 1. Further, the installation and movement of the core rear 5 into the cleaning tank is carried out by an operator holding the handle portion of the core rear 5 in his hand, or by the arm of a robot. In addition, there is also a method in which several cleaning tanks are connected and installed in the above-mentioned apparatus, and cleaning is performed in different cleaning tanks in sequence.

(2) Single wafer type cleaning device (shown in FIG. 6) 1) in the figure is a mechanical chuck supported by a rotating shaft 12. A semiconductor substrate 1 is horizontally attracted to the upper part of this mechanical chuck 1). This board 4
At the upper right of the
3 is provided. In the above device, the nozzle 1
A chemical solution is sprayed from the nozzle 2, and pure water is sprayed from the other nozzle 13. At this time, the substrate 1 is rotated in order to uniformly spray the chemical solution or pure water.

Further, as a drying device after washing, the following one is used corresponding to the above (1) and (21).

(1) Patch type drying device Carriers containing the same number of semiconductor substrates are placed facing each other in the drying device, and the tank in which these carriers are placed is
The substrate was rotated at a speed of 0.00 rpm for 5 minutes, and water was removed by centrifugal force to dry the semiconductor substrate.

(2) Single wafer dryer While holding the semiconductor substrate in a horizontal position, rotate the shaft of the mechanical chuck that supports the semiconductor substrate at a speed of 1000 revolutions per minute for 30 seconds to remove water using centrifugal force. Dry the substrate.

However, conventional cleaning devices have the following problems.

(1) Semiconductor substrate 4 and middle plate 5 are immersed in cleaning liquid 3 in cleaning tank 1 of patch type cleaning equipment.
If the carrier 5 is immersed in water, the metal may be eluted from the surface of the carrier 5, lowering the purity of the cleaning liquid 3 and reducing the cleaning effect. In addition, because the distance between semiconductor substrates is as narrow as 5 mm, the circulation of the cleaning liquid 3 is poor and the cleaning effect is poor for semiconductor substrates with microfabrication of 1 μm or less.〇(2) Single wafer cleaning equipmentWater or chemical solution Since the liquid is sprayed onto the semiconductor substrate 4 rotating at high speed, the contact time between the liquid and the substrate surface is short, and when chemically cleaning a microfabricated substrate, the cleaning effect may be inferior. The present invention has been made in view of the above circumstances, and an object thereof is to provide a semiconductor substrate cleaning apparatus that can reliably clean a microfabricated semiconductor substrate.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a mechanical chuck for horizontally placing a semiconductor substrate, and a ring material provided densely or close to the substrate and having a diameter smaller than the diameter of the substrate. The gist of the present invention is to include a first nozzle that is provided above the substrate and pours pure water onto the substrate, and a second nozzle that is provided above the substrate and pours a chemical solution onto the substrate.

(Function) According to the present invention, by providing a ring member having a diameter smaller than that of the substrate in close contact with or in close proximity to the substrate, it is possible to freely set the time period during which the liquid remains on the substrate, and the microfabricated Semiconductor substrates can be reliably cleaned.

(Example) Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 3.

21 in the figure is a mechanical chuck supported by a rotating shaft 22. A semiconductor substrate 23 is horizontally attracted to the upper part of this mechanical chuck 21 . On the surface of this substrate 23, there is formed, for example, a diameter 4 x m smaller than the diameter of the substrate 23 and a height of 20 mm.

A ring material 24 made of Teflon and having a length of 2 m is provided in close contact with each other. Diagonally above and to the right of the substrate 23 is a pure water supply nozzle 25 for pouring pure water onto the substrate 23. A chemical liquid supply nozzle 26 for pouring the chemical liquid is provided respectively.

In a cleaning apparatus having such a structure, the substrate 23 is first held horizontally by a mechanical chuck 21 as shown in FIG.
While rotating the substrate 23 by rotating the substrate 23 at 1001[P/d], pure water is supplied from the pure water supply nozzle 25 at
Spray at the same pressure for 10 seconds. Next, the spray from the nozzle 25 is stopped, and the substrate 23ft is rotated for 5 seconds, and when the surface of the substrate is dry, the rotation is stopped. Then the second
As shown in the figure, the ring material 24 is lowered from above the substrate 23 by motor drive and brought into close contact with the surface of the substrate. In this state, 200 ml of a liquid obtained by diluting 50% hydrofluoric acid to 1/200 with pure water is poured onto the substrate 23 from the supply nozzle 26. However, in this state, the liquid on the substrate 23 remains within the ring.

After holding for 3 minutes, the ring material 24 is raised by motor drive and cleaning with pure water is performed again in the state shown in FIG. Easy cleaning of large-diameter substrates 0
At the same time, with conventional single-wafer cleaning equipment, the liquid sprayed onto the substrate leaves the substrate in a short period of time, so chemical cleaning cannot always be performed sufficiently. In contrast, in the present invention, the liquid is sprayed onto the substrate 23 for a desired period of time.
You can stay on top. Therefore, chemical cleaning can be carried out sufficiently, and in particular, impurities inside the irregularities on the surface of the substrate microfabricated with a glossy turn size of 1 μm or less can be removed.

In addition, although the said Example described the case where the ring material was brought into close contact with the board|substrate, it is not limited to this. For example, as shown in FIG. 4, the distance between the ring material 24 and the substrate 23 may be increased by one inch. In this case, by pouring 50 ml of chemical liquid per second from the nozzle 26, the chemical accumulated on the substrate flows out from the gap between the ring material 24 and the substrate 23 and from above the ring material 24. In this case, by changing the distance between the ring material 24 and the substrate 23, it is possible to change the time period during which the liquid stays on the substrate. [Effects of the Invention] As detailed above, according to the present invention, for example, It is possible to provide a highly reliable semiconductor substrate cleaning device that can reliably clean microfabricated semiconductor substrates.

[Brief explanation of the drawing]

1 and 2 are explanatory diagrams of a semiconductor substrate cleaning apparatus according to one embodiment of the present invention, FIG. 3 is a plan view of a ring material according to the same apparatus, and FIG. 4 is another embodiment of the present invention. FIG. 5 is an explanatory diagram of a conventional patch type cleaning apparatus, and FIG. 6 is an explanatory diagram of a conventional single wafer type cleaning apparatus. 2. Mechanical chuck, 22. Rotating shaft, 2
3... Semiconductor substrate, 24... Ring material, 25... Pure water supply nozzle, 26... Chemical solution supply nozzle 〇 Applicant's agent Patent attorney Takehiko Suzue Figure 4

Claims (2)

[Claims] (1) A mechanical chuck for horizontally placing a semiconductor substrate; a ring material provided in close contact with or close to the substrate and having a diameter smaller than the diameter of the substrate; and a ring material provided above the substrate and attached to the substrate. A semiconductor substrate cleaning apparatus comprising: a first nozzle for pouring water; and a second nozzle provided above the substrate for pouring a chemical onto the substrate. (2) The distance between the semiconductor substrate and the ring material is 0 to 200 mm.
2. The semiconductor substrate cleaning apparatus according to claim 1, wherein the cleaning apparatus can be varied up to .