JPS63142840U - - Google Patents
Info
- Publication number
- JPS63142840U JPS63142840U JP3471287U JP3471287U JPS63142840U JP S63142840 U JPS63142840 U JP S63142840U JP 3471287 U JP3471287 U JP 3471287U JP 3471287 U JP3471287 U JP 3471287U JP S63142840 U JPS63142840 U JP S63142840U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafers
- wafers
- wafer
- held
- storage container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 9
- 210000000078 claw Anatomy 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Pile Receivers (AREA)
Description
第１図と第２図は本考案に係るウエーハ立替機
の一実施例を示す概略側面図と概略平面図、第３
図は第１図及び第２図に示すウエーハ立替機に含
まれるホルダの要部側面図、第４図は第３図のホ
ルダに含まれるローラの側面図、第５図は第４図
の要部拡大側面図、第６図乃至第９図は本考案に
係るウエーハ立替作業を順に示す各平面図、第１
０図は第１図に含まれるボートに傾斜して整列・
収納されたウエーハの概略側面図、第１１図は裏
面同士、密着して整列・収納されたウエーハの部
分側面図、第１２図はＢａｃｋ ｔｏ ｂａｃｋ
方式による熱処理装置の一具体例を示す概略平面
図である。
１，１３……半導体ウエーハ、５……第１のウ
エーハ収納器（キヤリヤ）、６……第２のウエー
ハ収納器（ボート）、９……ホルダ、１０……第
１の保持爪、１１……第２の保持爪、１２……ロ
ーラ、１２ａ……テーパ状溝。
1 and 2 are a schematic side view and a schematic plan view showing one embodiment of a wafer reloading machine according to the present invention, and FIG.
The figure is a side view of the main parts of the holder included in the wafer tipping machine shown in Figures 1 and 2, Figure 4 is a side view of the roller included in the holder in Figure 3, and Figure 5 is the main part of the holder in Figure 4. 6 to 9 are plan views sequentially showing the wafer stand-up work according to the present invention, and FIGS.
Figure 0 shows the boats included in Figure 1 aligned and tilted.
A schematic side view of the stored wafers, FIG. 11 is a partial side view of the wafers aligned and stored with their back sides in close contact, and FIG. 12 is a back to back view.
FIG. 2 is a schematic plan view showing a specific example of a heat treatment apparatus according to the method. DESCRIPTION OF SYMBOLS 1, 13... Semiconductor wafer, 5... First wafer storage container (carrier), 6... Second wafer storage container (boat), 9... Holder, 10... First holding claw, 11... ...Second holding claw, 12...Roller, 12a...Tapered groove.
Claims (1)
ーハ収納器より半導体ウエーハを取り出しその上
方に配したホルダに保持した後、ホルダ下方の空
の第２のウエーハ収納器に半導体ウエーハを収納
するものにおいて、 上記ホルダは、１方向に整列した１組の半導体
ウエーハの周縁部を保持又は解放する第１の保持
爪と、 該ウエーハと交互に、かつ、異方向に対向して
整列した他の１組の半導体ウエーハの周縁部を保
持又は解放する第２の保持爪と、 周面にテーパ状溝が刻設された棒状回転円柱体
で、第１、第２の保持爪に保持された一対の半導
体ウエーハ周縁部を上記溝にて保持又は解放する
ローラとを具備し、 第１、第２の保持爪に一旦、保持された半導体
ウエーハを上記ローラの溝にて保持し直すと共に
ローラを回転させて１対の半導体ウエーハ同士、
密着させそのまま上記第２のウエーハ収納器に収
納するようにしたことを特徴とするウエーハ立替
機。[Claim for Utility Model Registration] A semiconductor wafer is taken out from a first wafer storage container in which semiconductor wafers are arranged and stored, held in a holder placed above the wafer, and then placed in an empty second wafer storage container below the holder. In a device that stores semiconductor wafers, the holder includes first holding claws that hold or release the peripheral edges of a pair of semiconductor wafers aligned in one direction, and first holding claws that alternately face the wafers and face the wafers in different directions. a second holding pawl that holds or releases the peripheral edge of another set of semiconductor wafers that are aligned; rollers that hold or release the peripheral edges of a pair of semiconductor wafers held by the grooves, and the semiconductor wafers held by the first and second holding claws are held by the grooves of the rollers. At the same time as repairing, the rollers are rotated to connect a pair of semiconductor wafers.
A wafer advance handling machine characterized in that the wafers are stored in the second wafer storage container in close contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3471287U JPS63142840U (en) | 1987-03-09 | 1987-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3471287U JPS63142840U (en) | 1987-03-09 | 1987-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63142840U true JPS63142840U (en) | 1988-09-20 |
Family
ID=30843523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3471287U Pending JPS63142840U (en) | 1987-03-09 | 1987-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63142840U (en) |
-
1987
- 1987-03-09 JP JP3471287U patent/JPS63142840U/ja active Pending
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