JPS63142021A - Resin composition for sealing use - Google Patents
Resin composition for sealing useInfo
- Publication number
- JPS63142021A JPS63142021A JP28872686A JP28872686A JPS63142021A JP S63142021 A JPS63142021 A JP S63142021A JP 28872686 A JP28872686 A JP 28872686A JP 28872686 A JP28872686 A JP 28872686A JP S63142021 A JPS63142021 A JP S63142021A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- resin composition
- inorganic filler
- phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 14
- 238000007789 sealing Methods 0.000 title claims description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 230000001588 bifunctional effect Effects 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims 5
- 229920003986 novolac Polymers 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 12
- 239000000203 mixture Substances 0.000 abstract description 10
- 239000005011 phenolic resin Substances 0.000 abstract description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000843 powder Substances 0.000 abstract description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000377 silicon dioxide Substances 0.000 abstract description 5
- 229920001568 phenolic resin Polymers 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 2
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000012778 molding material Substances 0.000 description 8
- 239000010680 novolac-type phenolic resin Substances 0.000 description 8
- 239000001993 wax Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- -1 and among them Polymers 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000005480 straight-chain fatty acid group Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
本発明は、低応力で、耐湿性、温寒サイクル性に優れた
電子・電気部品等の封止用樹脂組成物に関する。Detailed Description of the Invention [Objective of the Invention] (Industrial Field of Application) The present invention relates to a resin composition for sealing electronic and electrical parts, etc., which has low stress, excellent moisture resistance, and excellent thermal and cold cycle properties. .
(従来の技術)
従来から、ダイオード、トランジスタ、集積回路などの
電子部品を熱硬化性樹脂を用いて封止する方法が行われ
てぎた。 この樹脂封止は、ガラス、金属、セラミック
を用いたハーメチックシール方式に比較して経済的に右
利なために、広く実用化されている。 封止用樹脂とし
ては熱硬化性樹脂組成物が多く用いられ、中でもエポキ
シ樹脂組成物が最も一般的に用いられている。 その工
ボキシ樹脂組成物には、酸無水物、芳香族アミン、ノボ
ラック型フェノール樹脂等の硬化剤が用いられている。(Prior Art) Conventionally, methods have been used to seal electronic components such as diodes, transistors, and integrated circuits using thermosetting resins. This resin sealing is economically advantageous compared to hermetic sealing methods using glass, metal, or ceramic, and is therefore widely put into practical use. Thermosetting resin compositions are often used as sealing resins, and among them, epoxy resin compositions are most commonly used. The engineered boxy resin composition uses curing agents such as acid anhydrides, aromatic amines, and novolac type phenolic resins.
硬化剤の中でもノボラック型フェノール樹脂を硬化剤
としたエポキシ樹脂組成物は、他の硬化剤を使用したも
のに比べて、成形性、耐湿性に浸れ、毒性がなく、かつ
安価であるため半導体封止材料として広く用いられてい
る。Epoxy resin compositions using novolac-type phenolic resin as a curing agent are popular for semiconductor encapsulation because they have superior moldability and moisture resistance, are nontoxic, and are inexpensive compared to those using other curing agents. Widely used as a stopper material.
しかしながら、ノボラック型フェノール樹脂を硬化剤と
したエポキシ樹脂組成物は、成形硬化時に収縮して半導
体素子に応力がかかり、信頼性に劣るという欠点がある
。 この樹脂組成物を使用した成形品(封止品)の温寒
サイクルテストを行うと、ボンディングワイヤのオーブ
ン、樹脂クラック、ペレットクラックが発生し、電子部
品としての機能が果たけなくなるという問題があった。However, epoxy resin compositions using a novolac type phenolic resin as a curing agent have the disadvantage that they shrink during molding and curing, applying stress to semiconductor elements, resulting in poor reliability. When a molded product (sealed product) using this resin composition is subjected to a hot/cold cycle test, bonding wire cracks, resin cracks, and pellet cracks occur, causing the problem that it no longer functions as an electronic component. Ta.
(発明が解決しようとする問題点)
本発明は、上記の問題点を解決するためになされたもの
で、低応力で、耐湿性、温寒サイクル性に優れ、ボンデ
ィングワイヤのオープン、樹脂クラック、ベレットクラ
ックの発生がなく、電子部品として信頼性の高い封止用
樹脂組成物を提供することを目的としている。(Problems to be Solved by the Invention) The present invention has been made to solve the above-mentioned problems. The object of the present invention is to provide a sealing resin composition that does not cause pellet cracks and is highly reliable as an electronic component.
[発明の構成]
(問題点を解決するための手段と作用)不発明名は、上
記の目的を達成しようと鋭意研究を出ねた結果、一定の
構造を有する2官能エポキシ樹脂を配合すれば、低応力
で、耐湿性および渇寒lナイクル性に優れた封止用樹脂
組成物が得られることを見いだし、本発明を完成したも
のである。 即ち、本発明は、
(A)次の一般式で示される2官能エポキシ樹脂を表づ
)
(B)ノボラック型フェノール樹脂および(C)無機質
充填剤
を必須成分とし、全体の樹脂組成物に対して、前記(C
)無機質充填剤を40〜85重量%の割合で含有するこ
とを特徴とする封止用樹脂組成物である。[Structure of the invention] (Means and effects for solving the problem) The uninvented name is the result of intensive research aimed at achieving the above purpose. The inventors have now completed the present invention by discovering that a sealing resin composition with low stress and excellent moisture resistance and cold-temperature properties can be obtained. That is, the present invention represents (A) a bifunctional epoxy resin represented by the following general formula) (B) a novolac type phenol resin and (C) an inorganic filler as essential components, and Then, the above (C
) A sealing resin composition characterized by containing an inorganic filler in a proportion of 40 to 85% by weight.
本発明に用いる(A)2官能エポキシ樹脂としては次の
一般式で示されるものであり、を表す)
具体的には
\O/
などが挙げられ、これらは単独もしくは2種以上の混合
系として使用することができる。 また前述した(A)
の2官能エポキシ樹脂に次の一般式で示されるノボラッ
ク系のエポキシ樹脂を混合して用いることもできる。The bifunctional epoxy resin (A) used in the present invention is represented by the following general formula. can be used. Also mentioned above (A)
A novolac type epoxy resin represented by the following general formula may be mixed with the bifunctional epoxy resin.
(但し、式中、R1は水素原子、ハロゲン原子又はアル
キル基を、■<2は水素原子又はアルキル基を、nは1
以上の整数を表す)
本発明に用いる(B)ノボラック型フェノール樹脂とし
ては、フェノール、アルキルフェノール等のフ上ノール
類と、ホルムアルデヒド或いはパラホルムアルデヒドと
を反応させて1qられるノボラック型フェノール樹脂お
よびこれらの変性樹脂、例えばエポキシ化もしくはブチ
ル化ノボラック型ノエノール樹脂、シリコーン変性フェ
ノール樹脂等が挙げられ、ノボラック型フェノール樹脂
である限り特に制限はなく広く使用1−ることができる
。(However, in the formula, R1 is a hydrogen atom, a halogen atom, or an alkyl group, ■<2 is a hydrogen atom or an alkyl group, and n is 1
or more) The novolac type phenolic resin (B) used in the present invention is a novolac type phenol resin obtained by reacting phenol such as phenol or alkylphenol with formaldehyde or paraformaldehyde, and a modified novolac type phenol resin thereof. Examples of resins include epoxidized or butylated novolac type noenol resins, silicone-modified phenolic resins, etc., and as long as they are novolak type phenolic resins, they can be widely used without particular limitations.
そしてこれらのノボラック型フェノール樹脂は単独もし
くは2種以上の混合系として用いることができる。 ノ
ボラック型フェノール樹脂の配合割合は、前述した(A
>の2官能エポキシ樹脂のエポキシB4(a)と<8>
のノボラック型フェノール樹脂のフェノール性水酸基(
b)との当量比[(a)/(b)]が0.1〜10の範
囲内にあることが望ましい。 この当量比が0.1未満
もしくは10を超えると、耐湿性、成形作業性および硬
化物の電気特性が悪くなり、いずれの場合も好ましくな
い。 従って上記の範囲に限定するのがよい。These novolac type phenolic resins can be used alone or as a mixture of two or more types. The blending ratio of the novolac type phenolic resin is as described above (A
Epoxy B4 (a) of the bifunctional epoxy resin of > and <8>
The phenolic hydroxyl group of novolac type phenolic resin (
It is desirable that the equivalent ratio [(a)/(b)] with b) is within the range of 0.1 to 10. If this equivalent ratio is less than 0.1 or more than 10, the moisture resistance, molding workability, and electrical properties of the cured product will deteriorate, which is undesirable in either case. Therefore, it is better to limit it to the above range.
本発明に用いる(C)無機質充填剤としては、シリカ粉
末、アルミナ、三酸化アンチモン、タルク、炭酸カルシ
ウム、チタンホワイト、クレー、マイカ、ベンガラ、ガ
ラスI!維、炭素繊維等が挙げられ、これらの中でも特
にシリカ粉末およびアルミナが好んで用いられる。 無
機質充填剤の配合割合は、全体の樹脂組成物に対して4
0〜85重量%であることが望ましい。 その割合が4
011%未満では耐湿性、耐熱性および成形性に効果な
く、また85ffif11%を超えるとカナバリが人ぎ
くなり成形性が悪く実用に適さない。Inorganic fillers (C) used in the present invention include silica powder, alumina, antimony trioxide, talc, calcium carbonate, titanium white, clay, mica, red iron oxide, glass I! Among them, silica powder and alumina are particularly preferably used. The blending ratio of the inorganic filler is 4 to the entire resin composition.
The content is preferably 0 to 85% by weight. The ratio is 4
If it is less than 0.011%, there is no effect on moisture resistance, heat resistance, and moldability, and if it exceeds 85ffif11%, the shape becomes harsh and moldability is poor, making it unsuitable for practical use.
木フチ明の封止用樹脂組成物は、2官能エポキシ樹脂、
ノボラック型フェノール樹脂、および無機質充填剤を必
須成分とするが、必要に応じて、例えば天然ワックス類
2合成ワックス類、直鎖脂肪酸の金属塩、酸アミド類、
エステル類、パラフィン類などの離型剤、塩素化パラフ
ィン、ブロムトルTン、ヘキチブロムベンピン、三酸化
アンヂEンなどの難燃剤、カーボンブラック、ベンガラ
などの着色剤、シラン系カンプリング剤、種々の硬化促
進剤等を適宜添加配合することらできる。Akira Kifuchi's sealing resin composition includes bifunctional epoxy resin,
The essential components are a novolac type phenolic resin and an inorganic filler, but if necessary, for example, natural waxes, 2 synthetic waxes, metal salts of straight chain fatty acids, acid amides, etc.
Mold release agents such as esters and paraffins, flame retardants such as chlorinated paraffin, bromutol-Tone, hexybromobenpine, anddiene trioxide, coloring agents such as carbon black and red iron, silane camping agents, etc. Curing accelerators and the like may be added and blended as appropriate.
本発明の封止用樹脂組成物を成形材料として製造する場
合の一般的な方法は、2官能エポキシ樹脂、ノボラック
型フェノール樹脂、無機質充填剤、その他の原料組成分
を所定の組成比に選んで、ミキサー等によって十分均一
に混合した後、更に熱ロールによる溶融混合処理、また
はニーダ等による混合処理を行い、次いで冷7J]同化
させ、適当な大きさに粉砕して成形材料とする。 こう
して得られた成形材料は、電子部品或いは電気部品の封
止、被覆、絶縁等に適用することができる。A general method for producing the encapsulating resin composition of the present invention as a molding material is to select a bifunctional epoxy resin, a novolak phenol resin, an inorganic filler, and other raw material components in a predetermined composition ratio. After sufficiently uniformly mixing using a mixer or the like, the mixture is further melt-mixed using hot rolls or mixed using a kneader, etc., and then assimilated with cold 7J] and pulverized to an appropriate size to form a molding material. The molding material thus obtained can be applied to sealing, covering, insulating, etc. electronic or electrical components.
(実施例)
次に本発明を実施例によって具体的に説明するが、本発
明は以下の実施例に限定されるものではない。 以下の
実施例J3よび比較例において「%」とあるのは「重量
%」を意味する。(Examples) Next, the present invention will be specifically explained by examples, but the present invention is not limited to the following examples. In Example J3 and Comparative Examples below, "%" means "% by weight".
実施例 1
クレゾールノボラックエポキシ樹脂(エポキシ当f7k
215) 14%に、次に示した2官能工ポキシ樹脂
4%、
ノボラック型フェノール樹脂(フェノール当量107)
9%、溶融シリカ粉末71%、軟化促進剤0.3%、エ
ステル系ワックス0.3%、およびシラン系カップリン
グ剤0.4%を常温で混合し、更に90〜95℃で混練
して冷fil した(ち、粉砕して成形材料を得た。
得られた成形材料を170℃に加熱した金型内に1〜ラ
ンスフア一γ↑人し硬化させて成形品(封止品〉を1q
だ。 この成形品についで耐耐性、応力、温寒すイクル
簀に関する諸14性の試験をしだので、その結果を第1
表に示した。 本発明の顕著な効果が認められた。Example 1 Cresol novolak epoxy resin (epoxy f7k
215) 14%, 4% of the following bifunctional engineered poxy resin, novolac type phenol resin (phenol equivalent: 107)
9% fused silica powder, 71% fused silica powder, 0.3% softening accelerator, 0.3% ester wax, and 0.4% silane coupling agent at room temperature, and further kneaded at 90 to 95°C. It was cooled (and crushed) to obtain a molding material.
The obtained molding material was placed in a mold heated to 170°C on a 1 to 1 γ↑ person and hardened to form a molded product (sealed product).
is. This molded product was then tested for 14 properties related to resistance, stress, and temperature and cold cycling.
Shown in the table. Remarkable effects of the present invention were observed.
実施例 2
クレゾールノボラックエポキシ樹脂(エポキシ当量21
5) 10%に、実施例1で用いた2官能工ポキシ樹脂
8%、ノボラック型フェノール樹脂(フェノール当fi
107) 9%、シリカ粉末71%、硬化促進剤0
.3%、エステル系ワックス0.3%、およびシラン系
カップリング剤0.4%を実施例1と同様に混合、混練
、粉砕して成形材料を得た。 次いで同様にして成形品
を得、その成形品について実施例1どj「11様にして
耐湿性、応力、温寒サイクル等に関する開時性の試験を
行ったので、その結束を第1表に示した。 本発明の顕
著な効果が認められた。Example 2 Cresol novolac epoxy resin (epoxy equivalent weight 21
5) 10%, 8% of the bifunctional engineered poxy resin used in Example 1, and novolac type phenol resin (phenol equivalent)
107) 9%, silica powder 71%, curing accelerator 0
.. 3% of the ester wax, 0.3% of the ester wax, and 0.4% of the silane coupling agent were mixed, kneaded, and pulverized in the same manner as in Example 1 to obtain a molding material. Next, a molded product was obtained in the same manner, and tests were conducted on the molded product in terms of moisture resistance, stress, temperature and cold cycles, etc. in accordance with Example 1 and 11. The remarkable effects of the present invention were observed.
比較例
クレゾールノボラックエポキシ樹脂(エポキシ化fit
215) 19%に、ノボラック型フェノール樹脂(
フェノール当ffi 107) 9%、シリカ粉末7
1%、硬化促進剤0.3%、エステル系ワックス0.3
%、J3よびシラン系カップリング剤0.4%を実施例
1と同様にして成形材料を1qた。 この成形材料を用
いて成形品(f、J正量つとし、成形品について実施例
1と同様にしてその開時性を試験したので、その結果を
第1表に示した。Comparative Example Cresol novolac epoxy resin (epoxidized fit
215) 19%, novolak type phenolic resin (
Phenol ffi 107) 9%, silica powder 7
1%, curing accelerator 0.3%, ester wax 0.3
%, J3 and 0.4% of the silane coupling agent in the same manner as in Example 1 to prepare 1 q of molding material. Using this molding material, molded articles (f, J) were tested for opening properties in the same manner as in Example 1. The results are shown in Table 1.
第1表
*1 : 30x25x5mmの成形品の底面に25
X25X3mmの銅板を埋め込み、−40℃と一←20
0℃の恒温槽に各30分間fつ入れ、各サイクル繰り返
した後、樹脂クラックを調査した。Table 1 *1: 25 on the bottom of a 30x25x5mm molded product
Embed a copper plate of X25X3mm and heat it to -40℃ and -20
Each sample was placed in a constant temperature bath at 0° C. for 30 minutes, and after each cycle was repeated, resin cracks were investigated.
:l:2:成形月利を用いて2木のアルミニウム配線を
有する電気部品を170℃で3分間トランスファー成形
し、その後180℃で8時間時化させた。こうして得た
1′1止電気部品100個について、120℃の高圧水
蒸気中で耐湿試験を行い、アルミニウム腐食による50
%の断線(不良発生〉の起こる時間を評価しIこ。:1:2: An electrical component having two aluminum wires was transfer molded at 170° C. for 3 minutes using a molding process, and then aged at 180° C. for 8 hours. A moisture resistance test was conducted on 100 1'1 electrical components obtained in this way in high-pressure steam at 120°C.
Evaluate the time when % of wire breakage (defect occurrence) occurs.
:l:3 : D I P16ビンリードフレームのア
イランド部に市販のストレインゲージを接着し、180
℃で8時間硬化させた後の歪を測定した。:l:3: Glue a commercially available strain gauge to the island part of the D I P16 bin lead frame, and
Strain was measured after curing at ℃ for 8 hours.
[発明の効果]
以上の説明および第1表の結果から明らかなように、本
発明の封止用樹脂組成物は、低応力で、耐湿性、温寒サ
イクルに優れている。 そのため、ボンディングワイヤ
のオープンや樹脂クラック、ベレットクランクの発生が
なく、かつ従来のエポキシ樹脂組成物の利点である電気
特性やその他の特性を保持した組成物であり、電子・電
気部品の1・1止用、被覆用、絶縁用等に用いた場合、
」−分信頼性の高い製品を得ることができる。[Effects of the Invention] As is clear from the above explanation and the results shown in Table 1, the encapsulating resin composition of the present invention has low stress and is excellent in moisture resistance and hot and cold cycles. Therefore, it is a composition that does not cause open bonding wires, resin cracks, or pellet cranks, and maintains the electrical properties and other properties that are the advantages of conventional epoxy resin compositions. When used for stopping, coating, insulation, etc.
” - You can obtain highly reliable products.
Claims (1)
表等があります▼、 ▲数式、化学式、表等があります▼、 ▲数式、化学式、表等があります▼ を表す) (B)ノボラック型フェノール樹脂および (C)無機質充填剤 を必須成分とし、全体の樹脂組成物に対して、前記(C
)無機質充填剤を40〜85重量%の割合で含有するこ
とを特徴とする封止用樹脂組成物。[Claims] 1(A) A bifunctional epoxy resin represented by the following general formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (However, R in the formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ mathematical formulas, chemical formulas,
There are tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ For the resin composition of (C
) A sealing resin composition containing an inorganic filler in a proportion of 40 to 85% by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28872686A JPH0637543B2 (en) | 1986-12-05 | 1986-12-05 | Sealing resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28872686A JPH0637543B2 (en) | 1986-12-05 | 1986-12-05 | Sealing resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63142021A true JPS63142021A (en) | 1988-06-14 |
JPH0637543B2 JPH0637543B2 (en) | 1994-05-18 |
Family
ID=17733891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28872686A Expired - Lifetime JPH0637543B2 (en) | 1986-12-05 | 1986-12-05 | Sealing resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0637543B2 (en) |
-
1986
- 1986-12-05 JP JP28872686A patent/JPH0637543B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0637543B2 (en) | 1994-05-18 |
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