JPS63140675U - - Google Patents
Info
- Publication number
- JPS63140675U JPS63140675U JP3182587U JP3182587U JPS63140675U JP S63140675 U JPS63140675 U JP S63140675U JP 3182587 U JP3182587 U JP 3182587U JP 3182587 U JP3182587 U JP 3182587U JP S63140675 U JPS63140675 U JP S63140675U
- Authority
- JP
- Japan
- Prior art keywords
- film printed
- lead frame
- hybrid
- thick
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 3
Landscapes
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3182587U JPH0510382Y2 (US20030199744A1-20031023-C00003.png) | 1987-03-06 | 1987-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3182587U JPH0510382Y2 (US20030199744A1-20031023-C00003.png) | 1987-03-06 | 1987-03-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63140675U true JPS63140675U (US20030199744A1-20031023-C00003.png) | 1988-09-16 |
| JPH0510382Y2 JPH0510382Y2 (US20030199744A1-20031023-C00003.png) | 1993-03-15 |
Family
ID=30837917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3182587U Expired - Lifetime JPH0510382Y2 (US20030199744A1-20031023-C00003.png) | 1987-03-06 | 1987-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510382Y2 (US20030199744A1-20031023-C00003.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259648A (ja) * | 1992-01-22 | 1993-10-08 | Internatl Business Mach Corp <Ibm> | 電子回路パッケージおよびその作製方法 |
-
1987
- 1987-03-06 JP JP3182587U patent/JPH0510382Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259648A (ja) * | 1992-01-22 | 1993-10-08 | Internatl Business Mach Corp <Ibm> | 電子回路パッケージおよびその作製方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510382Y2 (US20030199744A1-20031023-C00003.png) | 1993-03-15 |
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| JPS6350866B2 (US20030199744A1-20031023-C00003.png) |
