JPS63138991U - - Google Patents

Info

Publication number
JPS63138991U
JPS63138991U JP1987032488U JP3248887U JPS63138991U JP S63138991 U JPS63138991 U JP S63138991U JP 1987032488 U JP1987032488 U JP 1987032488U JP 3248887 U JP3248887 U JP 3248887U JP S63138991 U JPS63138991 U JP S63138991U
Authority
JP
Japan
Prior art keywords
excimer laser
workpiece
scanning means
lens
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987032488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987032488U priority Critical patent/JPS63138991U/ja
Publication of JPS63138991U publication Critical patent/JPS63138991U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す縦断面図、第
2図aは第1図のエキシマレーザ発振器から出射
されたレーザビームの断面図、第2図bは第1図
の試料上に照射されたレーザビームの断面図、第
3図aは第2図aの矩形ビームの短辺方向のレー
ザ光強度分布を示す図、第3図bは第2図aの矩
形ビームの長辺方向のレーザ光強度分布を示す図
、第4図は第1図の円筒状fθレンズの斜視図、
第5図aは本考案の他の実施例の構成を示す平面
図、第5図bは第5図aのD―D方向の断面図、
第6図aは第5図のエキシマレーザ発振器から出
射されたレーザビームの断面図、第6図bは第5
図の試料上に照射されたレーザビームの断面図で
ある。 主要部分の符号の説明、1……エキシマレーザ
発振器、2……スキヤンニングミラー、3……円
筒状fθレンズ、6……シリンドリカルレンズ。
FIG. 1 is a longitudinal cross-sectional view showing an embodiment of the present invention, FIG. 2 a is a cross-sectional view of the laser beam emitted from the excimer laser oscillator of FIG. 1, and FIG. A cross-sectional view of the irradiated laser beam, FIG. 3a is a diagram showing the laser light intensity distribution in the short side direction of the rectangular beam in FIG. 2a, and FIG. 3b is a diagram showing the long side direction of the rectangular beam in FIG. 2a. Figure 4 is a perspective view of the cylindrical fθ lens in Figure 1,
FIG. 5a is a plan view showing the configuration of another embodiment of the present invention, FIG. 5b is a sectional view taken along the line DD in FIG. 5a,
FIG. 6a is a cross-sectional view of the laser beam emitted from the excimer laser oscillator in FIG.
FIG. 3 is a cross-sectional view of a laser beam irradiated onto the sample shown in the figure. Explanation of symbols of main parts: 1... Excimer laser oscillator, 2... Scanning mirror, 3... Cylindrical fθ lens, 6... Cylindrical lens.

Claims (1)

【実用新案登録請求の範囲】 (1) エキシマレーザ光を用いてレーザ加工を行
うエキシマレーザ加工装置であつて、前記エキシ
マレーザ光を被加工物上で走査する走査手段と、
前記走査手段を通過した前記エキシマレーザ光を
前記被加工物上に集光する円筒状fθレンズとを
前記エキシマレーザ光の光軸と直交するように設
け、前記走査手段と前記円筒状fθレンズとを介
して前記エキシマレーザ光で前記被加工物上を走
査するようにしたことを特徴とするエキシマレー
ザ加工装置。 (2) 前記走査手段は回動自在な反射鏡と、シリ
ンドリカルレンズとにより構成され、前記反射鏡
の回動動作により前記エキシマレーザ光で前記被
加工物上を走査するようにしたことを特徴とする
実用新案登録請求の範囲第1項のエキシマレーザ
加工装置。
[Claims for Utility Model Registration] (1) An excimer laser processing device that performs laser processing using excimer laser light, comprising a scanning means for scanning the excimer laser light on a workpiece;
A cylindrical fθ lens that focuses the excimer laser light that has passed through the scanning means onto the workpiece is provided so as to be perpendicular to the optical axis of the excimer laser light, and the scanning means and the cylindrical fθ lens An excimer laser processing apparatus characterized in that the excimer laser beam scans the workpiece using the excimer laser beam. (2) The scanning means includes a rotatable reflecting mirror and a cylindrical lens, and the excimer laser beam scans the workpiece by rotating the reflecting mirror. An excimer laser processing device according to claim 1 of the utility model registration claim.
JP1987032488U 1987-03-05 1987-03-05 Pending JPS63138991U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987032488U JPS63138991U (en) 1987-03-05 1987-03-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987032488U JPS63138991U (en) 1987-03-05 1987-03-05

Publications (1)

Publication Number Publication Date
JPS63138991U true JPS63138991U (en) 1988-09-13

Family

ID=30839210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987032488U Pending JPS63138991U (en) 1987-03-05 1987-03-05

Country Status (1)

Country Link
JP (1) JPS63138991U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8686315B2 (en) 2001-09-25 2014-04-01 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8686315B2 (en) 2001-09-25 2014-04-01 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device
US9748099B2 (en) 2001-09-25 2017-08-29 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device

Similar Documents

Publication Publication Date Title
JPS63138991U (en)
JPS6267689U (en)
JPS6382216U (en)
JPS63160525U (en)
JPS61157917U (en)
JPS62154402U (en)
JPH0229047U (en)
JPS62104217U (en)
JPS6449390U (en)
JPS63109919U (en)
JPH0367311U (en)
JPH0177640U (en)
JPH01121837U (en)
JPH02148114U (en)
JPS626846U (en)
JPS6289616U (en)
JPS61132853U (en)
JPH0381664U (en)
JPS644413U (en)
JPH01127691U (en)
JPH01151993U (en)
JPH0351982U (en)
JPS61172695A (en) Laser beam processing device
JPH03116284U (en)
JPH0331084U (en)