JPS63137943U - - Google Patents
Info
- Publication number
- JPS63137943U JPS63137943U JP3058787U JP3058787U JPS63137943U JP S63137943 U JPS63137943 U JP S63137943U JP 3058787 U JP3058787 U JP 3058787U JP 3058787 U JP3058787 U JP 3058787U JP S63137943 U JPS63137943 U JP S63137943U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- resin
- sealed
- resin material
- grounded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案による一実施例の側断面図、第
２図は本考案による他の実施例の側断面図、第３
図は従来技術による側断面図である。
図において、１はチツプ、２は樹脂材、３，３
ａは静電遮蔽電極、４は絶縁性保護膜、５は空間
、を示す。
Figure 1 is a side sectional view of one embodiment of the present invention, Figure 2 is a side sectional view of another embodiment of the present invention, and Figure 3 is a side sectional view of another embodiment of the present invention.
The figure is a side sectional view according to the prior art. In the figure, 1 is a chip, 2 is a resin material, 3, 3
a represents an electrostatic shielding electrode, 4 represents an insulating protective film, and 5 represents a space.
Claims (1)
において、上記チツプ１と上記樹脂材２との間に
該チツプ１のアース電極に接地された静電遮蔽電
極３を備えたことを特徴とする樹脂封止型ＩＣ。 Resin-sealed IC with a chip molded in resin material
A resin-sealed IC characterized in that an electrostatic shielding electrode 3 grounded to the ground electrode of the chip 1 is provided between the chip 1 and the resin material 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3058787U JPS63137943U (en) | 1987-03-02 | 1987-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3058787U JPS63137943U (en) | 1987-03-02 | 1987-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63137943U true JPS63137943U (en) | 1988-09-12 |
Family
ID=30835534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3058787U Pending JPS63137943U (en) | 1987-03-02 | 1987-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63137943U (en) |
-
1987
- 1987-03-02 JP JP3058787U patent/JPS63137943U/ja active Pending