JPS63137425A - Projection aligner provided with liquid crystal shutter reticle - Google Patents

Abstract

PURPOSE:To enhance projection exposure throughput, by detecting aligning marks on first and second substrates, determining the positions of pads, and forming a wiring mask with transmitting type liquid crystal shutter reticles with the positions of the pads as references. CONSTITUTION:Aligning marks 50 (50a and 50b) of a supporting substrate 2 are detected through camera eyes 34 (34-1 and 34-2). The positions of pads 6, 8, 12 and 14 are detected. Aligning marks 52 (52a and 52b) of a mounted chip 20 are detected through a camera eye 36. The position of pads 24 and 26 are recognized with a controller 62 on the basis of stored values by an aligner. Wiring conditions are read out of a memory through the controller 62 so that wiring between the pads to be connected is performed based on the positions of the recognized pads. A wiring pattern is computed. A driving means 46 is operated based on the formed wiring pattern, and exposure is performed through a liquid shutter network 48. In this constitution, the optimum mask can be formed through the liquid crystal shutter network in correspondence with deviation even if the mounted chip 20 is deviated on the substrate 2. Thus the processability in the photoengraving step for the wiring is increased.

Description

Detailed Description of the Invention (Technical Field) The present invention relates to an exposure method for wiring between the support substrate and the LSI chip after an LSI chip is embedded and mounted on the support substrate in, for example, a wafer scale integrated circuit device. This relates to a projection exposure apparatus used for such applications.

(Conventional technology) FIG. 5 shows an example of a wafer scale integrated circuit device.

2 is a support substrate, and elements 4- such as sensors are mounted on the surface of the support substrate.
1 to 4-18 are arranged and formed. Each element 4-
1 to 4-18 have pads 6-1 to 6-9.8-, respectively.
1 to 8-9 are provided correspondingly, and the elements and pads 6-1 to
13-9. 8-1 to 8-9 are connected by wiring. Wirings 10-1 to 10-4 for connection to external circuits are also provided on the surface of the support substrate 2, and two sets of pads 12-1 to 12-4 are provided on the wirings 10-1 to 10-4. 4 and 14-1 to 14-4 are provided.

Two holes 16-1 and 16-2 are formed in the support substrate 2, and LSI chips 20 are inserted into these holes 16-1 and 16-2.
．． 22 are each embedded with resin 18.

The heights of the surfaces of the LSI chips 20 and 22 and the surface of the support substrate 2 are determined so that they are in the same plane.

The LSI chip 20 has pads 24-1 to 24-9 and 26.
-1 to 26-4 are provided. Pad 24-1~2
4-9 are connected to pads 6-1 to 6-9 of elements 4-1 to 4-9, respectively, and pads 26-1 to 26-4 are connected to wiring 1.
It is connected to pads 12-1 to 12-4 of 0-1 to 10-4, respectively. In the LSI chip 22, pads 28-1 to 28-9 and 30-1 to 30-4 are similarly provided. Pads 28-1 to 28-9 are elements 4-10 to 4
-18 pads 8-1 to 8-9, respectively, and pads 30-1 to 30-4 are connected to pads 14-1 to 14-4 of wiring lines 10-1 to 10-4, respectively.

When wiring between pads in such a wafer scale integrated circuit device is formed, lithography technology is used. For example, when attempting to form a wiring pattern using photolithography technology using a mask, if the position of the LSI chip 20 or 22 mounted on the support substrate 2 shifts, a different wiring pattern will be formed to correspond to the shift. You need to have a mask ready. For example, one support substrate 2
If we consider the case where 10 LSI chips are mounted on a reticle, the reticle needs to be replaced 10 times at maximum. If the reticle is replaced frequently in this manner, there is a problem in that the possibility of defects occurring increases and the processing capacity decreases significantly.

It is also possible to form wiring patterns by direct drawing technology using an electron beam or ion beam without using a mask, but direct drawing equipment has the drawback of being complicated and expensive.

(Objective) The present invention utilizes a photolithography process for mounting a second substrate by embedding it in a first substrate and forming wiring between the first substrate and the second substrate, such as in a wafer scale integrated circuit device. The purpose of this project is to increase the throughput of projection exposure apparatuses used in

(Structure) To explain with reference to FIGS. 1, 2, and 5 showing embodiments, the projection exposure apparatus of the present invention has a first camera eyes 34 (34-1, 34-2) and a second camera eye 34 (34-1, 34-2) that detects the alignment marks 52a (54a), 52b (54b) on the second board 20 (22) mounted on the first board 2. 2 camera eye 36 and an arithmetic processing unit 62 that creates a wiring pattern connecting pads on both boards based on the alignment marks on both boards 2.20 (22).
and a transmissive liquid crystal shutter reticle 48 that realizes the wiring pattern created by the arithmetic processing unit 62 using liquid crystal.

The arithmetic processing unit 62 has the configuration shown in FIG. A memory 32 stores the relative positional relationship between the pads and alignment marks on both substrates 2, 2° (22) and conditions necessary for the wiring pattern. 38 is a first substrate pad position recognition means, and the first camera eye 34 (3
The position of the pad on the first substrate 2 is recognized from the detection signal of 4-1, 34-2) and the relative positional relationship between the pad on the first substrate 2 and the alignment mark stored in the memory 32. do. 40 is a second substrate pad position recognition means, which detects the detection signal of the second camera eye 36 and the relative positional relationship between the pad on the second substrate 20 (22) and the alignment mark stored in the memory 32. and second board 2
Recognize the position of pad 0 (22). 42 is a pad position recognition means, which determines the pads of the first substrate 2 and the pads of the second substrate 20 (22) from the output of the first substrate pad position recognition means 38 and the output of the second substrate pad position recognition means 40. Recognize the positional relationship with. Reference numeral 44 denotes a mask creation means, which uses the output from the pad position recognition means 42 and the wiring pattern conditions stored in the memory 32 to create a mask for both substrates 2.20.
(22) Create a wiring pattern connecting the pads to be connected between them. Reference numeral 46 denotes driving means for driving the transmissive liquid crystal shutter reticle 48 in accordance with the output of the mask creating means 44.

The present invention will be explained in detail using FIG.

The memory 32 stores in advance the relative positions of the pads on the first substrate 2 and the alignment marks, the relative positions of the pads and the alignment marks on the second substrate 20, 22, and the line width and space necessary for forming the wiring pattern. The maximum width and minimum width are each input (step Sl).

The first camera eye 34 (34-1, 34-2)
alignment marks 50a on the substrate 2.

50b is detected, and the camera eye 36 detects the second substrate 2.
0 (22) alignment mark 52a (54a),
52b (54b) is detected (step S2).

The first substrate pad position recognition means 38 identifies the pads 6-1 to 6-9.8-1 to 8-9.12-1 to 12- of the first substrate 2.
4. The positions of pads 24-1 to 14-4 on the second substrate 20 (22) are recognized with reference to this projection exposure apparatus, and the second substrate pad position recognition means 40
(28-1 to 28-9), 26-1 to 26-4 (30
-1 to 3O-4) are recognized based on this projection exposure apparatus (step S3).

The pad position recognition means 42 detects the pad 6-1 on the first substrate 2.
〜6-9.8-1〜8-9.12-1〜12-4 (1
4-1 to 14-4) and pads 24-1 to 24-9 (28-1 to 28-9), 26- of the second substrate 20 (22)
1 to 26-4 (30-1 to 3O-4) are recognized based on this projection exposure apparatus (step S4).
).

Based on the thus recognized pad positions, wiring conditions are read from the memory 32 and a wiring pattern is formed so that wiring is formed between pad positions to be connected (step S5).

Based on the formed wiring pattern, the driving means 46 is driven to perform exposure using the liquid crystal shutter reticle 48 (step S6).

Examples will be specifically described below.

A case will be described in which a wiring pattern for a wafer scale integrated circuit device as shown in FIG. 5 is formed.

Alignment marks 50a and 50b on the support substrate 2 as the first substrate are formed at the same time as the elements 4-1 to 4-18 and wiring are formed. Hole 16-1 in support substrate 2
．． Alignment marks 52a, 52b, 54a, and 54b are also formed on the LSI chips 20 and 22, which serve as second substrates, and which are embedded in the LSI chips 16-2 with the tallow 18, respectively.

FIG. 1 shows an embodiment of a projection exposure apparatus.

56 is a light source, 58 and 60 are liquid crystal shutter reticle 48
This is an optical system that reduces and projects the mask formed on the photoresist on the support substrate 2 using light from the light source 56. 61 is an X-Y stepping device that holds the support substrate 2 and can move the support substrate 2 within a plane (X-Y plane). 34-1.34-2 is a camera eye for detecting the alignment marks 50a and 50b on the support substrate 2, and 36 is an alignment mark 52a, 52b or 54a, 54 on the LSI chip 20 or 22.
This is a camera eye for detecting b. 62 is an arithmetic processing unit which inputs the detection signals of camera eyes 34-1, 34-2 and camera eyes 36 and creates a mask, and has the function surrounded by a chain line in FIG. Reference numeral 48 denotes a transmission type liquid crystal shutter reticle, in which transparent electrodes are provided in a matrix in directions perpendicular to each other with a liquid crystal layer in between, and a desired light transmission pattern is formed by applying a voltage to predetermined electrodes. be able to.

46 is a driving means for driving the liquid crystal shutter reticle 48 to create a mask.

The arithmetic processing unit 62 can be realized by a microcomputer, as shown in FIG.

CPU 64 is connected to bus 66, RAM 68 and ROM
70 are each connected to the CPU 64 via a bus 66. The camera eyes 34-1, 34-2, and 36 are also connected to the bus 66 via an interface 72, and the driving means 46 is also connected to the bus 66 via an interface 74.
It is connected to the.

In a wafer scale integrated circuit device as shown in FIG.
-9 and pads 12-1 to 12-4.14-1 to 14-
4 is stored in the RAM 68 in advance with reference to the alignment marks 50a and 50b. Regarding the LSI chip 20, the positions of the pads 24-1 to 24-9 and pads 26-1 to 26-4 are aligned with the alignment marks 52.
It is stored in the RAM 68 using a and 52b as references.

The same applies to the LSI chip 22.

Pads 28-1 to 28-9 and pads 30-1 to 30-4
The position of is stored in the RAM 68 with reference to the alignment marks 54a and 54b.

The RAM 68 also stores the line width of wiring and the maximum and minimum widths of spaces.

Pads 6-1 to 6-9, 8-1 to 8- on support substrate 2 are detected by camera eyes 34-1 and 34-2 to detect alignment marks 50a and 50b on support substrate 2.
9. The positions of 12-1 to 12-4 degrees 14-1 to 14-4 are determined based on this projection exposure device, and the alignment marks 52a and 52b of the mounted LSI chip 20 are determined by the camera eye 36. By detecting the pads 24-1 to 24-9°26 on the LSI chip 20
Positions -1 to 26-4 are determined with this projection exposure apparatus as a reference. Then, by determining the positions of the pads on the support substrate 2 and the pads on the LSI chip 2o, a wiring pattern connecting the pads is determined according to pre-stored wiring conditions.

The wiring patterns for the other LSI chips 22 are similarly determined.

In FIG. 5, the LSI chips 20 and 22 are of the same type, but the present invention can be implemented by inputting the pad positions, alignment marks, and the positions where they are embedded even for LSI chips of different types. It can also be applied as a projection exposure apparatus for creating wiring masks when different types of LSI chips are embedded in one support substrate.

(Effects) According to the present invention, the positions of the respective pads are determined by detecting the alignment marks on the first substrate and the second substrate, and the wiring is performed using the transmissive liquid crystal shutter reticle based on the pad positions. Since one mask is created for the LCD shutter reticle, even if the position of the second board embedded and mounted on the first board is shifted, the most suitable mask is selected according to the shift. Since the reticle can be formed by the conventional method, it is possible to eliminate the trouble of replacing the reticle depending on the misalignment. This greatly improves the throughput of the photolithography process for wiring.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an embodiment of the present invention, FIG. 2 is a block diagram mainly showing the functions of the arithmetic processing device in the present invention, and FIG. 3 is a flowchart explaining the present invention in detail.
FIG. 4 is a block diagram mainly showing an example of an arithmetic processing device, and FIG. 5 is a schematic plan view showing an integrated circuit device in which a wiring pattern is created according to the present invention. 2...Support board, 20.22...LSI chip, 32...
・Memory, 34.34-1.34-2.36... Camera eye, 38... First board pad position recognition means, 40.
...Second board pad position recognition means, 42...
... Pad position recognition means, 44 ... Mask creation means, 46 ... Drive means, 50a, 50b, 52a, 52b, 54a. 54b... Alignment mark. 62... Arithmetic processing unit.

Claims (1)

[Claims] (1) a first camera eye that detects an alignment mark on a first substrate; a second camera eye that detects an alignment mark on a second substrate mounted on the first substrate; A processing unit that creates a wiring pattern connecting the pads on both boards based on the alignment marks on both boards, and a transmissive liquid crystal shutter that realizes the wiring pattern created by this processing unit on a liquid crystal. a reticle; the arithmetic processing unit includes a memory that stores the relative positional relationship between the pads of both substrates and the alignment mark and conditions necessary for the wiring pattern; and a detection signal of the first camera eye and the a first substrate pad position recognition means for recognizing the position of the pad on the first substrate based on the relative positional relationship between the pad on the first substrate and the alignment mark stored in a memory; and the second camera. a second substrate pad position recognition means for recognizing the position of the pad on the second substrate from the eye detection signal and the relative positional relationship between the pad on the second substrate and the alignment mark stored in the memory; ,
Based on the output of the first substrate pad position recognition means and the output of the second substrate pad position recognition means, the pad of the first substrate and the second pad position of the first substrate are determined.
pad position recognition means that recognizes the positional relationship with the pads of the two boards; and wiring that connects the pads to be connected between both boards based on the output from the pad position recognition means and the wiring pattern conditions stored in the memory. A projection exposure apparatus comprising a mask creating means for creating a pattern.