JPS63136373U - - Google Patents
Info
- Publication number
- JPS63136373U JPS63136373U JP2850587U JP2850587U JPS63136373U JP S63136373 U JPS63136373 U JP S63136373U JP 2850587 U JP2850587 U JP 2850587U JP 2850587 U JP2850587 U JP 2850587U JP S63136373 U JPS63136373 U JP S63136373U
- Authority
- JP
- Japan
- Prior art keywords
- core
- thickness
- ceramic
- ceramic substrate
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000881 Cu alloy Chemical group 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図はこの考案に係るセラミツクス基板と他
の基板との熱伝導率を比較したグラフ図である。
の基板との熱伝導率を比較したグラフ図である。
Claims (1)
- 銅コアまたは銅合金コアの表面にセラミツクス
材料をコーテイングして構成されてなるセラミツ
クス基板において、上記コアの厚さを１．４mm以
上に形成し、かつ、上記セラミツクス層の厚さを
１００μmm以下に形成してなることを特徴とする
セラミツクス基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2850587U JPS63136373U (ja) | 1987-02-27 | 1987-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2850587U JPS63136373U (ja) | 1987-02-27 | 1987-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63136373U true JPS63136373U (ja) | 1988-09-07 |
Family
ID=30831534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2850587U Pending JPS63136373U (ja) | 1987-02-27 | 1987-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63136373U (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59184586A (ja) * | 1983-04-01 | 1984-10-19 | 住友電気工業株式会社 | 半導体素子搭載用回路基板 |
| JPS6130042A (ja) * | 1984-07-20 | 1986-02-12 | Sumitomo Electric Ind Ltd | 半導体素子搭載用基板 |
-
1987
- 1987-02-27 JP JP2850587U patent/JPS63136373U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59184586A (ja) * | 1983-04-01 | 1984-10-19 | 住友電気工業株式会社 | 半導体素子搭載用回路基板 |
| JPS6130042A (ja) * | 1984-07-20 | 1986-02-12 | Sumitomo Electric Ind Ltd | 半導体素子搭載用基板 |
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