JPS63134711U - - Google Patents
Info
- Publication number
- JPS63134711U JPS63134711U JP2829887U JP2829887U JPS63134711U JP S63134711 U JPS63134711 U JP S63134711U JP 2829887 U JP2829887 U JP 2829887U JP 2829887 U JP2829887 U JP 2829887U JP S63134711 U JPS63134711 U JP S63134711U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- plunger
- pot
- pressed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に係る装置の一実施例を示す要
部縦断面図、第２図はプランジヤの拡大縦断面図
、第３図は本考案装置の動作前の状態を示す縦断
面図である。第４図は従来の樹脂モールド装置の
一部省略部分を含む平面図、第５図は第４図のＡ
―Ａ線断面図、第６図は動作状態を示す縦断面図
である。
１…上金型、２…ポツト、３…下金型、４…カ
ル、５…ランナ、６…ゲート、７…キヤビテイ、
９…樹脂モールド部品、１０…樹脂タブレツト、
１３…プランジヤ本体、１５…押圧ピン。
Fig. 1 is a longitudinal cross-sectional view of a main part showing an embodiment of the device according to the present invention, Fig. 2 is an enlarged longitudinal cross-sectional view of the plunger, and Fig. 3 is a longitudinal cross-sectional view showing the state of the device of the present invention before operation. be. Fig. 4 is a plan view of a conventional resin molding device with some omitted parts, and Fig. 5 is A of Fig. 4.
- A sectional view taken along line A; FIG. 6 is a longitudinal sectional view showing the operating state. 1...Upper mold, 2...Pot, 3...Lower die, 4...Cull, 5...Runner, 6...Gate, 7...Cavity,
9... Resin molded parts, 10... Resin tablets,
13...Plunger body, 15...Press pin.
Claims (1)
された樹脂タブレツトを加熱しながらプランジヤ
で押圧し、溶融した樹脂を金型のカルからランナ
、ゲートを介して被樹脂モールド部品のあるキヤ
ビテイに圧送する装置において、 上記プランジヤは、金型のポツトに上下動可能
に嵌挿された本体と、該本体の先端部に、樹脂タ
ブレツトの押圧時に内部に退入し、かつ、被樹脂
モールド部品の離型時に外部に突出するように設
けた押圧ピンを具備したことを特徴とする樹脂モ
ールド装置。[Scope of claim for utility model registration] A resin tablet is supplied to a pot of a mold consisting of an upper mold and a lower mold, and is heated and pressed by a plunger, and the molten resin is poured from the cull of the mold to the runner and gate. In this device, the plunger has a main body fitted into a pot of the mold so as to be movable up and down, and a tip of the main body that retracts inside when the resin tablet is pressed. 1. A resin molding device comprising a press pin that is inserted into the mold and protrudes to the outside when a resin-molded part is released from the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2829887U JPS63134711U (en) | 1987-02-26 | 1987-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2829887U JPS63134711U (en) | 1987-02-26 | 1987-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63134711U true JPS63134711U (en) | 1988-09-05 |
Family
ID=30831125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2829887U Pending JPS63134711U (en) | 1987-02-26 | 1987-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63134711U (en) |
-
1987
- 1987-02-26 JP JP2829887U patent/JPS63134711U/ja active Pending
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