JPS6313465B2 - - Google Patents
Info
- Publication number
- JPS6313465B2 JPS6313465B2 JP8192282A JP8192282A JPS6313465B2 JP S6313465 B2 JPS6313465 B2 JP S6313465B2 JP 8192282 A JP8192282 A JP 8192282A JP 8192282 A JP8192282 A JP 8192282A JP S6313465 B2 JPS6313465 B2 JP S6313465B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing composition
- inorganic compound
- compound powder
- silicone oil
- silicone resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 15
- 238000005498 polishing Methods 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 229920002545 silicone oil Polymers 0.000 claims description 11
- 150000002484 inorganic compounds Chemical class 0.000 claims description 9
- 229910010272 inorganic material Inorganic materials 0.000 claims description 9
- 229920002050 silicone resin Polymers 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 7
- 239000003960 organic solvent Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- 239000005909 Kieselgur Substances 0.000 claims description 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 3
- 229910018626 Al(OH) Inorganic materials 0.000 claims description 2
- 229910002971 CaTiO3 Inorganic materials 0.000 claims description 2
- 229910002370 SrTiO3 Inorganic materials 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- 229910052882 wollastonite Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 239000003082 abrasive agent Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052711 selenium Inorganic materials 0.000 description 4
- 239000011669 selenium Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910004762 CaSiO Inorganic materials 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Description
【発明の詳細な説明】
この発明は、金属、ガラス等の鏡面材料表面を
研摩するための研摩用組成物およびその製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a polishing composition for polishing the surface of a mirror-like material such as metal or glass, and a method for producing the same.
一般に金属、ガラス等の鏡面材料を研摩するに
際し使用される研摩用組成物は、金属の酸化物、
硫酸塩、炭酸塩、チタン酸塩、ケイ酸塩、シリ
カ、シリカゲル、ケイソウ土などを水及び有機溶
媒中に分散させてスラリー状にしたものが主流で
ある。また、分散性、剥離性を高めるため種々の
ポリマーを上記のような無機化合物に混合した研
摩剤もいくつか提案されている。 Generally, polishing compositions used for polishing mirror-like materials such as metals and glass include metal oxides,
The mainstream is a slurry made by dispersing sulfate, carbonate, titanate, silicate, silica, silica gel, diatomaceous earth, etc. in water or an organic solvent. In addition, several abrasives have been proposed in which various polymers are mixed with the above-mentioned inorganic compounds in order to improve dispersibility and releasability.
一方、被研摩体である鏡面材料はいろいろな用
途に使用されているが、いずれも硬い表面を有
し、それに使われる上記のような一般的な研摩剤
もかなり硬質なものである。しかし、鏡面材料の
なかには非常に脆くて薄い材質のものがあり、こ
れを研摩するのに上記のような通常の研摩剤を使
用すると表面に傷、穴、剥れが生じて好ましくな
い。例えば複写機の感光体としてのセレンドラム
は、銅やアルミニウムの円筒面に厚さ数10μｍ程
度の無定型セレン層を形成させている。このよう
な薄層セレンの表面を研摩するのは難しく、通常
の研摩剤を用いると被研摩面に支障をきたす危険
性性が高い。 On the other hand, mirror-finish materials that are objects to be polished are used for various purposes, but all of them have hard surfaces, and the general abrasives used for them are also quite hard. However, some mirror materials are extremely brittle and thin, and using the above-mentioned ordinary abrasives to polish them is undesirable because scratches, holes, and peeling occur on the surface. For example, in a selenium drum used as a photoreceptor in a copying machine, an amorphous selenium layer with a thickness of about 10 μm is formed on a cylindrical surface of copper or aluminum. It is difficult to polish the surface of such a thin layer of selenium, and using ordinary abrasives has a high risk of damaging the surface to be polished.
この発明は、薄層でかつ脆性が高い材料等に対
しても表面欠陥を生じさせない研摩用組成物を提
供することを目的とする。 An object of the present invention is to provide a polishing composition that does not cause surface defects even in thin and highly brittle materials.
この発明は、無機化合物粉体表面にたとえばシ
リコーンオイルを塗布した後熱処理を行うことに
より、前記粉体をシロキサン重合体（シリコーン
樹脂）の膜で被覆し、これを有機溶媒に分散させ
た研摩用組成物を得るものであつて、いわゆるス
ラリー状にして用いる。 This invention provides a polishing method in which the powder is coated with a film of siloxane polymer (silicone resin) by coating the surface of an inorganic compound powder with, for example, silicone oil and then heat-treated, and this is dispersed in an organic solvent. The composition is obtained and used in the form of a so-called slurry.
ここで用いる無機化合物粉末としては、粒子径
50μｍ以下のものが望ましく、その材質としては
SiO2、Al2O3、Cr2O3、MgO、CeO2、ZnO、
CaO、ZrO2、Al（OH）3、CaTiO3、SrTiO3、
CaSiO3、CaSO4、SrSO4、BaSO4、PbSO4、
CaCO3などや、ケイソウ土、活性白土が用いら
れる。これ以外にも一般に用いられる研摩剤も使
用できる。 The inorganic compound powder used here has a particle size of
It is desirable to have a thickness of 50 μm or less, and the material is
SiO2 , Al2O3 , Cr2O3 , MgO, CeO2 , ZnO ,
CaO, ZrO2 , Al(OH) 3 , CaTiO3 , SrTiO3 ,
CaSiO 3 , CaSO 4 , SrSO 4 , BaSO 4 , PbSO 4 ,
CaCO 3 , diatomaceous earth, and activated clay are used. In addition to these, commonly used abrasives can also be used.
シリコーンオイルは、水素を含んでいるアルキ
ルハイドロジエンシロキサンが適している。これ
はシリコーンオイルの熱処理過程においての反応
機構が、次の化合構造式、のようになつてい
ることによる。式は熱処理される前のアルキル
ハイドロジエンシロキサン、式は熱処理後酸化
脱水反応が起こり、新しいシロキサン結合の架橋
が生じているアルキルハイドロジエンシロキサン
を示す。 As the silicone oil, an alkylhydrogen siloxane containing hydrogen is suitable. This is because the reaction mechanism during the heat treatment process of silicone oil is as shown in the following chemical structural formula. The formula represents an alkylhydrodiene siloxane before heat treatment, and the formula represents an alkylhydrodiene siloxane in which an oxidative dehydration reaction occurs after the heat treatment, resulting in new crosslinking of siloxane bonds.
式においてシロキサン中の点枠で示された水
素原子が空気中の酸素によつて酸化され、ここに
脱水反応が起こり新しいシロキサン結合の架橋が
生じ式のようになる。この反応が隣接した水素
原子の間で次々に起こり、三次元の網目構造に発
達してシリコーン樹脂となる。このようにアルキ
ルハイドロジエンシロキサンを用いると、熱処理
になる脱水反応のみで容易にシリコーン樹脂を被
覆形成できる。ここで、シリコ ンに結合してい
るアルキル基にはメチル基またはフエニル基が一
般に用いられる。すなわち、シリコーンオイルと
しては、メチルハイドロジエンシロキサン又はフ
エニルハイドロジエンシロキサンが好ましい。 In the formula, the hydrogen atoms shown in the dotted frame in the siloxane are oxidized by oxygen in the air, and a dehydration reaction occurs, resulting in new crosslinking of siloxane bonds, resulting in the formula shown. This reaction occurs one after another between adjacent hydrogen atoms, developing a three-dimensional network structure and forming a silicone resin. When an alkylhydrodiene siloxane is used in this way, a silicone resin coating can be easily formed by only a dehydration reaction that involves heat treatment. Here, a methyl group or a phenyl group is generally used as the alkyl group bonded to silicone. That is, as the silicone oil, methylhydrodienesiloxane or phenylhydrodienesiloxane is preferable.
このようにして得られた研摩剤粉末を有機溶媒
に分散させるのであるが、有機溶媒としてはメタ
ノール、エタノール、イソプロパノールなどのア
ルコールが安価で分散性がよく最適である。 The abrasive powder thus obtained is dispersed in an organic solvent, and as the organic solvent, alcohols such as methanol, ethanol, and isopropanol are most suitable as they are inexpensive and have good dispersibility.
以下に本発明の実施例を示す。 Examples of the present invention are shown below.
シリコーンオイル0.5ｇを溶剤10mlに希釈する。
ここで用いる溶剤にはトリクレン、パークレンな
どの塩素化炭化水素を使う。シリコーンオイルは
他の炭化水素溶剤にも溶けるが、後で熱処理をす
る関係上、不燃性のトリクレン、パークレンを用
いるのが安全である。 Dilute 0.5g of silicone oil to 10ml of solvent.
The solvent used here is a chlorinated hydrocarbon such as trichlene or perchrene. Silicone oil is soluble in other hydrocarbon solvents, but since it will be heat treated later, it is safe to use nonflammable trichlene and percrene.
無機化合物粉末には前記に列記したもののうち
ここではSiO2（シリカ）を用いる。シリカ粉末を
２ｇビーカーに採り、これを撹拌しながら、前述
したシリコーンオイルを前記溶剤にて希釈した希
釈液を加え、シリカ粉末の表面に均一に付着させ
る。これをロータリーキルンで溶剤を除去し、引
き続き加熱焼付処理を150℃で１時間行つてシリ
コーンオイルを重合させ、シリカ粉末表面にシリ
コーン樹脂の被膜を形成する。 Among the inorganic compound powders listed above, SiO 2 (silica) is used here. 2 g of silica powder is placed in a beaker, and while stirring, a diluted solution prepared by diluting the silicone oil with the solvent is added, and the mixture is uniformly adhered to the surface of the silica powder. The solvent is removed from this in a rotary kiln, followed by baking at 150°C for 1 hour to polymerize silicone oil and form a silicone resin coating on the surface of the silica powder.
この研摩剤粉末を有機溶媒としてのエタノール
100mlに分散させた研摩剤をＡとする。一方、こ
れと比較するための対象研摩剤としてシリカ粉末
２ｇをエタノール100mlに分散させた研摩剤Ｂを
作る。それぞれの研摩剤を脱脂綿に含ませ複写機
のセレンドラムを研摩し、視覚的観察によつて両
者の比較テストを行つた。その結果Ｂの研摩剤を
使用した場合には、数ケ所の明隙な傷が確認され
たのに対し、Ａの研摩剤を使用した場合には傷な
どの表面欠陥を生じることなく、トナー、その他
付着物をきれいに取り去ることができた。 This abrasive powder is mixed with ethanol as an organic solvent.
Let A be the abrasive dispersed in 100ml. On the other hand, as a target abrasive for comparison, abrasive B was prepared by dispersing 2 g of silica powder in 100 ml of ethanol. Absorbent cotton was soaked in each abrasive and a selenium drum of a copying machine was polished, and a comparative test was conducted by visual observation. As a result, when abrasive B was used, several clear scratches were observed, whereas when abrasive A was used, there were no surface defects such as scratches, and the toner I was able to cleanly remove other deposits.
以上の実施例から判かるように、この発明によ
れば、無機化合物粉末表面にシリコーン樹脂を被
覆することにより、薄層で、脆性の高い材料に対
しても表面欠陥を生じさせない研摩用組成物が得
られる。また、シリコーン樹脂が撥水性、剥離性
を持つことから、研摩剤が被研摩面に付着しにく
く、またたとえ付着した場合であつても後で軽く
から払拭することにより容易に拭きとることがで
きる。 As can be seen from the above examples, the present invention provides a polishing composition that is thin and does not cause surface defects even on highly brittle materials by coating the surface of an inorganic compound powder with a silicone resin. is obtained. In addition, because silicone resin has water repellency and releasability, it is difficult for the abrasive to adhere to the surface to be polished, and even if it does, it can be easily wiped off with a gentle wipe afterwards. .
Claims (1)
化合物粉体をアルコール中に分散させてなる研摩
用組成物であつて、前記無機化合物粉体がSiO2、
Al2O3、Cr2O3、MgO、CeO2、ZnO、CaO、
ZrO2、Al（OH）3、CaTiO3、SrTiO3、CaSiO3、
CaSO4、SrSO4、BaSO4、PbSO4、CaCO3、ケイ
ソウ土及び活性白土よりなる群から選んだもので
ある研摩用組成物。 ２ 無機化合物粉体表面にシリコーンオイルを付
着させ、熱処理してシリコーン樹脂被膜を形成
し、前記シリコーン樹脂被膜の形成された無機化
合物粉体を有機溶媒中に分散させることを特徴と
する研摩用組成物の製造方法。 ３ シリコーンオイルが、アルキルハイドロジエ
ンシロキサンである特許請求の範囲第２項記載の
研摩用組成物の製造方法。 ４ シリコーンオイルがトリクレン又はパークレ
ンで希釈されたものである特許請求の範囲第２項
記載の研摩用組成物の製造方法。[Scope of Claims] 1. A polishing composition comprising an inorganic compound powder having a silicone resin coating formed on the surface thereof dispersed in alcohol, wherein the inorganic compound powder is SiO 2 , SiO 2 ,
Al 2 O 3 , Cr 2 O 3 , MgO, CeO 2 , ZnO, CaO,
ZrO2 , Al(OH) 3 , CaTiO3 , SrTiO3 , CaSiO3 ,
A polishing composition selected from the group consisting of CaSO 4 , SrSO 4 , BaSO 4 , PbSO 4 , CaCO 3 , diatomaceous earth and activated clay. 2. A polishing composition characterized by adhering silicone oil to the surface of an inorganic compound powder, heat-treating it to form a silicone resin film, and dispersing the inorganic compound powder with the silicone resin film formed in an organic solvent. How things are manufactured. 3. The method for producing a polishing composition according to claim 2, wherein the silicone oil is an alkylhydrodiene siloxane. 4. The method for producing a polishing composition according to claim 2, wherein the silicone oil is diluted with tricrene or percrene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8192282A JPS58198581A (en) | 1982-05-14 | 1982-05-14 | Abrasive composition and its preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8192282A JPS58198581A (en) | 1982-05-14 | 1982-05-14 | Abrasive composition and its preparation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58198581A JPS58198581A (en) | 1983-11-18 |
| JPS6313465B2 true JPS6313465B2 (en) | 1988-03-25 |
Family
ID=13759945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8192282A Granted JPS58198581A (en) | 1982-05-14 | 1982-05-14 | Abrasive composition and its preparation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58198581A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61278587A (en) * | 1985-06-04 | 1986-12-09 | Fujimi Kenmazai Kogyo Kk | Polishing composition |
| JP6533995B2 (en) * | 2015-07-03 | 2019-06-26 | 堺化学工業株式会社 | Method of manufacturing composite metal oxide polishing material and composite metal oxide polishing material |
-
1982
- 1982-05-14 JP JP8192282A patent/JPS58198581A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58198581A (en) | 1983-11-18 |
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