JPS6313401A - Connection circuit for high frequency transmission line - Google Patents

Abstract

PURPOSE:To contrive to attain light weight and low cost by providing plural ground terminals prolonged from a ground conductor onto the upper part of a dielectric base near a microstrip line so as to surely connect transmission lines. CONSTITUTION:The ground terminal 11 prolonged from the ground conductor 2 to the upper part of the dielectric base 1 is formed near the microstrip line 3 formed from an end face of the dielectric base 1 and the ground terminals are connected in addition to the microstrip lines 3 at the connection with other high frequency transmission line. Through the constitution above, a high frequency signal flows from the ground conductor 2a to the ground conductor 2b through the ground terminals 11a, 11b, a conductor ribbon 4 and ground terminals 11c, 11d. Thus, the adjustment of thickness of the ground conductor 2, a carrier 5b, the surface processing of the carrier 5b and a base 6 and the selection of material are not required. Thus, the connection of transmission lines is ensured and simplified and light weight and low cost are attained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a connection circuit for a high frequency transmission line that reliably connects a ground circuit at a connecting portion of a high frequency transmission line.

[Conventional technology]

Figure 2 shows the configuration of a conventional high-frequency transmission line connection circuit. In Figure 2, (1) is a flat dielectric substrate, (2m) (
2b) is a ground conductor formed on one side of the dielectric substrate (1).

(3m) (3b) is a microstrip line formed on the opposing surface of the ground conductor (2), and is a conductor ribbon for connecting the 41 microstrip lines (3m) (3b) to each other.

(5a) and (5b) are carriers that mechanically hold each of the dielectric substrates (1), and (6) is the carrier (5m) (
5b) A base that mechanically holds and fixes each. Third
The figure shows an equivalent circuit of the above conventional high frequency transmission line connection circuit, where (7) is the series inductance caused by the conductor ribbon (4) in Figure 2, and (8) is the second factor ground conductor (2 m). (2b) Series inductance caused by requiring an extra current path between the ground conductors (2aX2b) when they are electrically connected via the carrier (5m) (5b) and the base (61), (9 ) is a series resistance including the contact resistance and internal resistance between the ground conductor (2a) (2b) and the fixed metal plate (5), and αl is a signal line.

The conventional high frequency transmission line connection circuit is configured as described above.
The signal is transmitted to the microstrip line (3b). At this time, the high frequency transmission circuits divided into two parts are placed in the best condition, and one
Series inductance +71 (81 and series resistance (9)
By connecting in a way that minimizes the total.

It is a highly versatile means for connecting integrated circuits and transmission circuits using dielectric substrates because it is possible to connect a wide variety of high-frequency transmission lines without changing the line impedance of the high-frequency transmission line. can be provided.

[Problems to be Solved by the Invention] Conventional high frequency transmission line connection circuits have the following problems.

That is, in order to suppress changes in line impedance in the connection circuit, it is necessary to pay particular attention to the series inductance (8) and the series resistance (9) and reduce them.

This is because the change in line impedance caused by the Fi series inductance (7) can be easily corrected on the microstrip line (3).

Therefore, the above series inductance (8) and series resistance (9)
), firstly, the end faces of the dielectric substrate (1) are brought close to each other in order to make the high-frequency ground current path sufficiently short compared to its wavelength and to reduce the 2M series inductance (8). and reduce the thickness of the ground conductor +21 and the carrier (5). Second, in order to reduce the series resistance (9), the ground conductor (2), the carrier (5), and the carrier (5)
) and the base +81. Thirdly, the series resistor (9
), various technical requirements such as using good conductors for the carrier (5) and the paste (6) must be realized.

However, the distance between the end faces of the dielectric substrates (1) depends on the processing and assembly accuracy of the high-frequency transmission line connection circuit, and the thickness of the ground conductor +21 is determined by the skin effect of the high-frequency signal. ) should be selected to have the strength to suppress bending and thermal stress to the dielectric substrate (1) when fully holding the dielectric substrate (1). There is also a career (51
Surface treatment and use of a good conductor for the base (6) have the disadvantage of being disadvantageous in terms of weight reduction and cost reduction.

This invention was made in order to solve the problems encountered in the above-mentioned high frequency transmission line connection circuit.
) or reduce the thickness of the carrier (5).

There is no need for surface treatment and material selection of the carrier (5) and base +61, especially for lowering the series inductance (8) and series resistance (9) of the grounding circuit, making connection of the grounding circuit more reliable and easier than before. The purpose is to obtain a circuit.

[Means for solving problems]

In the high frequency transmission line connection circuit according to the present invention, a ground conductor (21) is connected to a ground terminal an' extending above the dielectric substrate (1) near the microstrip line formed from the end surface of the dielectric substrate (1). 6, and when connecting to another high frequency transmission line, not only the microstrip lines (3) but also the address terminals are connected to each other.

[For production]

In the high frequency transmission line connection circuit according to the present invention, a ground current path for a high frequency signal is formed over the shortest distance by a ground terminal extending from a ground conductor to the upper part of a dielectric substrate.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
Figure (,) is a detailed view of the end of the dielectric substrate in Figure 1 (bl).Here, (1) to (6) are exactly the same as the conventional device, and α1J is the end surface of the dielectric substrate (1). Ground conductor (2
This is a ground terminal extending from 1 to the top of the dielectric substrate (1).

In the high-frequency transmission line connection circuit configured as described above, the high-frequency signal ground conductor (2a) is connected to the ground terminal (l1
m) (Ilb) k way 1 and then flows through the conductor ribbon (4), through the ground terminal (lie) (lld) 't', and to the ground conductor (2b).For this reason, the problem that occurred in the conventional device This is a means to completely reduce the series inductance (8) and series resistance (9) that exist in the grounding current path.Reducing the thickness of the grounding conductor (21) and carrier (5), and reducing the thickness of the carrier (5) and pace (6). Often requires surface treatment and material selection.

Therefore, as long as the thickness of the ground conductor (2) does not impede the propagation of high-frequency signals, the carrier (5) and the paste (61) may be made of metal, or materials other than metal, such as synthetic resin or ceramic. Since no surface treatment is required, it can contribute to weight reduction and cost reduction.

Also, there is no need to rely on mechanical connections for grounding current paths.

Since the grounding terminals Cl1l are connected by bonding or brazing with the conductor ribbon (4), a reliable electrical connection is possible, and the width of the conductor ribbon (4) and the grounding terminal α1) are made wide to reduce impedance. The dielectric substrate (
1) It is no longer necessary to consider the distance between the end faces as in the conventional device, and the ease of processing and assembling when connecting the ground circuit is greatly improved.

〔Effect of the invention〕

As described above, this invention provides a grounding terminal on the surface of the dielectric substrate of the connection circuit for high-frequency transmission lines, thereby making the connection between the transmission lines reliable and simple, and contributing significantly to weight reduction and low cost. This has the effect of providing.

[Brief explanation of the drawing]

Fig. 1 (-) (b) A block diagram of a connection circuit for a high frequency transmission line showing an embodiment of the invention, and Figs. 2 and 3 are block diagrams and equivalent circuits of a conventional connection circuit for a high frequency transmission line. It is a diagram. In the figure, (1) is the dielectric substrate, (2j is the ground conductor, (3) is the microstrip line, (4) is the conductor ribbon, (5) is the carrier, (6) is the pace, and α1 is the ground terminal. be. In Figure 9, the same or corresponding parts are all indicated by the same reference numerals.

Claims (1)

[Claims] a dielectric substrate whose one side is covered with a ground conductor;
In a connection circuit that connects a plurality of high frequency transmission lines formed by a microstrip line formed on the other surface of the dielectric substrate that is not covered with a ground conductor, the microstrip line formed from the end surface of each of the dielectric substrates is a plurality of ground terminals provided near the microstrip line and extending from the ground conductor to the top of the dielectric substrate; a conductor ribbon connecting the plurality of high frequency transmission path microstrip lines and the ground terminals, respectively; a carrier that holds the dielectric substrate from the ground conductor side;
A connection circuit for a high frequency transmission line, comprising a base for holding and fixing each of the above carriers.