JPS63130323A - Setting method for control position in mold clamping mechanism - Google Patents

Abstract

PURPOSE:To improve productivity and safely by shortening setting time and preventing malsetting, by a method wherein a position a position of a movable platen at that time is detected electrically through confirmation of completion of mold clamping and a changeover control position in high-pressure mold clamping at the time of molding, and that of low- pressure mold clamping at the time of molding are set up. CONSTITUTION:A changeover distance in low-speed mold break, changeover distance in low- pressure mold clamping, changeover distance in high-pressure mold clamping and time for detection of completion position of mold clamping are set up to setting instruments 13-16, fitting of a mold is performed, and mold clamping is performed. When a position X1 of a movable platen at that point of time of time is read in, timing is begun by a timer for the detection of the completion position of mold clamping and a position X2 of the movable platen after the time has been up coincides with the position X2 of the movable platen is regarded as a reference position S0 by regarding that mold clamping has been completed. A position obtained by adding the changeover distance A in the high-pressure mold clamping to the reference position S0 and a position obtained by adding the changeover distance B in the low-pressure mold clamping to the S0 are regarded respectively as a changeover control position S1 in the high-pressure mold clamping at the time of molding and a changeover control position S2 in the low-pressure mold clamping by CPU and stored in a memory 21.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for setting the control position of the opening/closing speed and pressure of a mold in a mold clamping mechanism of an injection molding machine.

[Conventional technology]

In general, mold clamping devices for injection molding machines, die casting, etc. first close the mold at high speed to increase the cycle, and close the mold slightly before the mold closes to prevent damage to the mold from foreign matter adhering to the mold surface. In addition, to prevent the mold from colliding with the mold at high speed and damaging it, the mold is closed at low speed and low pressure.
When mold closing is almost complete, switch to high pressure to firmly close the mold to prevent the mold from opening due to injection pressure. ′
In addition, when opening the mold, first the mold is removed under high pressure for a predetermined time to release the molded product that is firmly attached to the mold, then the mold is removed at high speed for cycle-up, and then slightly before the mold closes. Open the mold by switching to low speed so that it can stop smoothly at
When a predetermined mold opening stop position 2 is reached, mold opening is stopped.

Conventionally, each control switching position as described above can be set at any time by adjusting the position of multiple limit switches that are installed so that the positions can be adjusted freely according to the movable platen that moves forward and backward, or by using a linear encoder, etc. This is done by inputting numerical values on a numeric keypad to a control device that supervises and controls the position of the Ill board.

[Problem that the invention seeks to solve]

The problem with the conventional method described above is that the settings have to be made while changing the position little by little, so the setting process is time-consuming and labor-intensive, and lacks accuracy, making it difficult to perform highly accurate settings. That's true.

This invention was devised to solve the above-mentioned conventional problem, and its purpose is to simply move the movable platen in the closing direction each time the mold is installed and detect the stop position. The object is to provide a new method by which control positions can be set.

[Means for solving problems]

This invention for the above-mentioned purpose is to remove metal from both the movable plate and the fixed plate, move the movable plate to close the mold, and confirm the completion of the mold closing at that point. The position of the movable plate is electrically detected, and the position obtained by adding a preset high-pressure mold open switching distance 1 to that position is set as the high-pressure mold close switching control position during molding, and is also set in advance to the above-mentioned detection position. The above-mentioned conventional problems are solved by setting the position at the end of the low-pressure mold closing switching distance determined as the low-pressure mold closing switching control position during molding.

[For production]

The above (in step 1, the mold is closed after the mold is taken, and when the closing completion position is detected, based on that detected position), the high pressure mold closing switching control position during molding and the low pressure The mold closing switching control position should be set to "self-V".

The present invention will be explained in more detail below with reference to the illustrated embodiments.

〔Example〕

FIG. 1 is a block diagram of an apparatus capable of actually applying the present invention.
is a mold closing date mechanism of an injection molding machine, a movable plate that moves forward and backward using a tie bar 5 provided over a 2μ fixed plate 3°4 as a guide, 6,
7 is the mold.

The movable VJ board 2 has a hydraulic cylinder or a screwdriver provided on one fixed board 3 connected to both the ram 8a of the tightening neck 8 and the position detector 9. Further, the drive device 10 of the mold clamping device 8 is connected to an input/output circuit 11 and a control circuit 12 connected to a central processing unit (hereinafter referred to as CPU).

The above CPU has a low-speed type switching button PI! A setting device 13, a low voltage switching distance setting device 14, a high voltage switching distance setting device 15, a time setting device 16, etc. are connected.

Also, in the connection path 17 between the drive device 10 and the CPU,
Each device such as the position detector 9, setting panel 18, display device 19, operation panel 20, memory 21 is connected,
The control position of the movable platen 2 can be set by operating the mold mounting switch 22, mold opening/closing switch 23, and teaching switch 24 on the operation panel 20.

FIG. 2 shows the control position of the movable platen 2 with respect to the positions of the molds 6 and 7, and the control position is set as follows.

First, the low-speed mold opening/closing distance required for mold opening/closing (C = 30 m)
>, low pressure type closed switching distance PR (B = 30 m), high pressure type closed switching distance lI! 1t (A=0.1#), mold closing completion position detection time (1 sec), etc. are set in each setting 2S13 to 2S16.

Next, as shown in the flowchart of FIG. 3, turn on the mold installation switch 22 (by turning on this, the movable platen can only be moved at a constant medium pressure and low speed, and the control radical is placed in the teaching mode). After installing the molds 6 and 7 and turning on the teaching switch 24, the memory 2
The data in 1 is reset, and the mold is closed by setting the mold open/close switch 23 to the close side, and the movable mold position x 1 at point B) is read, and the mold closing completion position n is detected in the history. The timer starts counting.

And after the above timer times up (Tsecl)
The movable mold position
This is done by pU. If ×1 and ×2 do not match, it is possible.1fIJ'Q is still moving (mold closing), so change the data of Time is done.

Also, if X and x2 match, it means that there is no movement of the movable platen (mold closing has been completed), so the movable mold position x2 at that point is 2! jX (position S.

The reference position S in the CPU. The position obtained by adding the high pressure mold open switching distance Δ set in the setting device 15 is set and stored in the memory 21 as the l:b pressure mold closing switching control position $1 during molding, and is also stored in the setting device 14. Low pressure type closed switching distance 1111tB set by S. The obtained position is set and stored in the memory 21 as the low-pressure mold closing switching control position (also serving as the low-speed mold closing switching control position) S2 during molding.

Next, turn the mold open/close switch 23 to F! X! After switching to the open side and moving the movable platen 2 backward to a suitable mold opening stop position by visual measurement, the mold opening/closing switch 23 is turned OFF to stop mold opening.

Then, by turning off the teaching switch 24, the movable platen position x3 at that time is read, and the x3 position is cp
u is set and stored in the memory 21 as the mold opening stop position (which also serves as the closing start position) S4 during molding.

At the same time, the low-speed inter-mold switching distance 111tC set in the setting device 13 is reduced by x3, and the obtained position is set and stored in the memory 21 as the low-speed inter-mold switching control position S3 during molding.

As described above, the control switching position aS - S4 during molding is set, and when the mold mounting switch 22 is turned OFF and the control device is returned to the molding mode to open and close the mold, the mold opening and closing that brings S to S4 to the control switching position is performed. do.

Incidentally, the speed and pressure in each step are set by a separate setter (not shown), and the high-pressure inter-mold time is also set by a separate timer (not shown).

In this embodiment, the low pressure mold closing switching control 211 position is also used as the low speed mold closing switching control position, but the low speed mold closing switching control position may be similarly set using a separate setting device.

In addition, the reason why the position of Sl is set one position before A with respect to the position of So is that the low-pressure mold closing force during molding is extremely low compared to the pressure during installation to prevent total mold breakage due to foreign matter being caught. set low, possible iEl]1 is S. This is because it does not reach that point.

〔Effect of the invention〕

This invention electrically sets the high-pressure mold closing switching control position and the low-pressure mold ■1 switching control position by performing the mold closing operation once when the mold is installed as described above, and the operator does not need to perform any adjustment work. Since there is no need to set the parameters, it is possible to shorten the setup time, prevent erroneous settings, and improve productivity and safety.

[Brief explanation of the drawing]

The drawings illustrate the control position setting method on the side of the mold clamp 11 according to the present invention, in which FIG. 1 is a block diagram of the apparatus, FIG. 2 is an operation explanatory diagram, and FIG. 3 is a flow chart diagram.

Claims (1)

[Claims] After the mold is attached to both the movable platen and the fixed platen, the movable platen is moved to close the mold, and after confirming that the mold has been closed, the position of the movable platen at that point is electrically detected, and the mold is placed in that position in advance. The position obtained by adding the set high-pressure mold closing switching distance is set as the high-pressure mold closing switching control position during molding, and the position obtained by adding the preset low-pressure mold closing switching distance to the above detection position is set as the low-pressure mold closing control position during molding. A control position setting method in a mold clamping mechanism, characterized in that the control position is set as a closed switching control position.