JPH047985B2 - - Google Patents
Info
- Publication number
- JPH047985B2 JPH047985B2 JP61277304A JP27730486A JPH047985B2 JP H047985 B2 JPH047985 B2 JP H047985B2 JP 61277304 A JP61277304 A JP 61277304A JP 27730486 A JP27730486 A JP 27730486A JP H047985 B2 JPH047985 B2 JP H047985B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- mold closing
- movable platen
- pressure
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は射出成形機の型締機構における金型
の開閉速度及び圧力の制御位置を設定する方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for setting the control position of the opening/closing speed and pressure of a mold in a mold clamping mechanism of an injection molding machine.
一般に射出成形機、ダイキヤストなどの型締装
置ではサイクルアツプのため型閉時はまず高速で
型閉し、型閉完了の若干手前の位置から、金型面
の異物付着から金型を破損しないように、また金
型が高速のまま衝突して破損しないように低速、
低圧に切り換えて型閉じを行ない、型閉がほぼ完
了した時点で射出圧により型が開くのを防ぐため
に高圧に切り換えて強固に型閉じを行う。
Generally, in mold clamping devices such as injection molding machines and die casting machines, the mold is closed at high speed due to the cycle up, and the mold is closed slightly before the mold is closed to prevent damage to the mold from foreign matter adhering to the mold surface. In addition, the mold is moved at low speed to avoid collision and damage while remaining at high speed.
The pressure is switched to low to close the mold, and when the mold is almost closed, the pressure is switched to high to prevent the mold from opening due to injection pressure and the mold is tightly closed.
また、型開時は、まず金型に強固に付着してい
る成形品の離型のため所定時間高圧にて型開し、
その後サイクルアツプのため高速で型開し、型開
完了の若干手前でスムーズな停止が行なえるよう
に低速に切り換えて型開し、所定の型開停止位置
に達したら型開を停止する。 In addition, when opening the mold, first the mold is opened under high pressure for a predetermined time to release the molded product that is firmly attached to the mold.
Thereafter, the mold is opened at a high speed to increase the cycle, and the mold is opened at a low speed to allow a smooth stop slightly before the mold opening is completed, and when a predetermined mold opening stop position is reached, the mold opening is stopped.
従来上記の如き各制御切換位置の設定は進退移
動する可動盤に対応して位置調整自在に設けられ
た複数のリミツトスイツチの位置調整又は、リニ
アエンコーダ等により常時可動盤位置を監視し、
制御する制御装置へのテンキーによる数値入力に
より行なつている。 Conventionally, each control switching position as described above is set by adjusting the position of a plurality of limit switches that are freely adjustable in accordance with the movable platen that moves forward and backward, or by constantly monitoring the movable platen position using a linear encoder or the like.
This is done by entering numerical values into the control device using a numeric keypad.
〔発明が解決しようとする問題点〕
上記従来の問題点は少しずつ位置を変えながら
設定を行わねばならぬため、設定に時間が掛り、
また手数を要する割に正確さに欠け、精度の高い
設定を行うことが困難なことにある。[Problems to be Solved by the Invention] The above-mentioned problems with the conventional method are that settings have to be made while changing the position little by little, so it takes a long time to set up.
Furthermore, although it requires a lot of effort, it lacks accuracy, making it difficult to perform highly accurate settings.
この発明は上記従来の問題点を解決するために
考えられたものであつて、その目的は金型取付け
後に可動盤を型閉方向に移動して、停止位置を検
出するだけで、制御位置を設定することができる
新たな方法を提供することにある。 This invention was devised to solve the above-mentioned conventional problems, and its purpose is to move the movable platen in the mold closing direction after the mold is installed, and simply detect the stop position and control the control position. The goal is to provide a new way to configure settings.
上記目的によるこの発明は、予め型閉に要する
低速型閉切換距離及び高圧型閉切換距離と、型閉
完了位置検出用時間とを設定し、可動盤と固定盤
の両方に金型を取り付けた状態にて、可動盤を中
圧、低速で移動して型閉じを行い、上記型閉完了
位置検出用時間による型閉完了の確認により、そ
の時点の可動盤位置を電気的に検出し、その検出
位置に上記高圧型閉切換距離を加算した位置を、
成形時の高圧型閉切換制御位置として設定すると
共に、検出位置に上記低圧型閉切換距離を加算し
た位置を、成形時の低圧型閉切換制御位置として
設定することによつて上記従来の問題点を解決し
てなる。
This invention for the above purpose sets in advance the low speed mold closing switching distance and high pressure mold closing switching distance required for mold closing, and the time for detecting the mold closing completion position, and the mold is attached to both the movable platen and the fixed platen. In this state, the movable platen is moved at medium pressure and low speed to close the mold, and the movable platen position at that point is electrically detected by confirming the mold closing completion using the above-mentioned mold closing completion position detection time. The position obtained by adding the above high voltage type closed switching distance to the detection position is
By setting the high-pressure mold closing switching control position during molding and setting the detection position plus the above-mentioned low-pressure mold closing switching distance as the low-pressure mold closing switching control position during molding, the above conventional problems can be solved. It will be solved.
上記構成では、型取付後に型閉じし、型閉完了
位置が検出されるとその検出位置を基準として演
算がなされ、成形時の高圧型閉切換制御位置と、
低圧型閉切換制御位置が自動的に設定される。
In the above configuration, the mold is closed after the mold is attached, and when the mold closing completion position is detected, calculations are performed based on the detected position, and the high pressure mold closing switching control position during molding is determined.
The low pressure closed switching control position is automatically set.
以下図示の実施例により更に詳細に説明する。 The present invention will be explained in more detail below with reference to the illustrated embodiments.
第１図はこの発明を実施し得る装置のブロツク
図で、１は射出成形機の型締機構、２は固定盤
３，４にわたり設けたタイバー５を案内として進
退移動する可動盤、６，７は金型である。
FIG. 1 is a block diagram of an apparatus capable of carrying out the present invention, in which 1 is a mold clamping mechanism of an injection molding machine, 2 is a movable plate that moves forward and backward using tie bars 5 provided over fixed plates 3 and 4 as a guide, and 6 and 7. is a mold.
上記可動盤２は、一方の固定盤３に設けた油圧
シリンダ或はねじ軸等による型締装置８のラム８
ａと、位置検出器９の両方に連結してある。また
型締装置８の駆動装置１０には、中央処理装置
（以下cpuという）と接続した入出力回路１１と
制御回路１２とが接続してある。 The movable platen 2 is connected to a ram 8 of a mold clamping device 8 by a hydraulic cylinder or screw shaft provided on one fixed platen 3.
a and the position detector 9. Further, the drive device 10 of the mold clamping device 8 is connected to an input/output circuit 11 and a control circuit 12 connected to a central processing unit (hereinafter referred to as CPU).
上記cpuには低速型開切換距離設定器１３、低
圧切換距離設定器１４、高圧切換距離設定器１
５、時間設定器１６等が接続してある。 The above CPU includes a low speed open switching distance setting device 13, a low voltage switching distance setting device 14, and a high voltage switching distance setting device 1.
5. A time setting device 16 etc. are connected.
また上記駆動装置１０とcpuとの接続路１７に
は、上記位置検出器９、設定パネル１８、表示装
置１９、操作パネル２０、メモリー２１などの各
装置が接続され、操作パネル２０の型取付スイツ
チ２２、型開閉スイツチ２３、教示スイツチ２４
を操作して、上記可動盤２の制御位置を設定する
ことができるようになつている。 Further, various devices such as the position detector 9, the setting panel 18, the display device 19, the operation panel 20, and the memory 21 are connected to the connection path 17 between the drive device 10 and the CPU. 22, mold open/close switch 23, teaching switch 24
can be operated to set the control position of the movable platen 2.
第２図は可動盤２の制御位置を金型６，７の位
置をもつて示すものであつて、制御位置の設定は
次のようにして行われる。 FIG. 2 shows the control position of the movable platen 2 along with the positions of the molds 6 and 7, and the control position is set as follows.
まず予め型開閉に要する低速型開切換距離（Ｃ
＝30mm）、低圧型閉切換距離（Ｂ＝30mm）、高圧型
閉切換距離（Ａ＝0.1mm）、型閉完了位置検出用時
間（1sec）等が、各設定器１３〜１６に設定され
る。 First, the low-speed mold opening switching distance required for mold opening/closing (C
= 30 mm), low pressure mold closing switching distance (B = 30 mm), high pressure mold closing switching distance (A = 0.1 mm), mold closing completion position detection time (1 sec), etc. are set in each setting device 13 to 16. .
次に第３図のフローチヤートに示すように型取
付スイツチ２２を入れて（これを入れることによ
り可動盤は一定の中圧、低速でのみ移動可能とな
り制御装置は教示モードとなる。）金型６，７の
取り付けを行ない、金型取付完了後教示スイツチ
２４をONとすることによりメモリー２１内のデ
ータがリセツトされ、型開閉スイツチ２３を型閉
側とすることにより型閉が行われると共にその時
点での可動盤位置X1が読み込まれ、更に型閉完
了位置検出用のタイマーが計時開始する。 Next, as shown in the flowchart of Fig. 3, turn on the mold installation switch 22 (by turning on this, the movable platen can only be moved at a constant medium pressure and low speed, and the control device becomes the teaching mode). 6 and 7, and after the mold installation is completed, the data in the memory 21 is reset by turning on the teaching switch 24, and the mold is closed by setting the mold open/close switch 23 to the mold closing side. The movable platen position X1 at the time is read, and a timer for detecting the mold closing completion position starts timing.
そして上記タイマーのタイムアツプ後（Tsec
後）の可動盤位置X2が読み込まれX1とX2の比較
がcpuにより行われる。ここでX1とX2が不一致
である場合は可動盤がまだ移動中（型閉中）であ
るということであるのでX1のデータをX2のデー
タに書き換えると共に再度タイマーによる計時が
行われる。 After the above timer times up (Tsec
The movable platen position X 2 (after) is read and a comparison between X 1 and X 2 is performed by the CPU. If X 1 and X 2 do not match, it means that the movable platen is still moving (mold closing), so the data of X 1 is rewritten to the data of X 2 and the timer is measured again. .
また、X1とX2が一致した場合には、可動盤の
移動がない（型閉完了した）ということであるの
でその時点の可動盤位置X2は基準位置S0とされ
る。 Furthermore, when X 1 and X 2 match, it means that there is no movement of the movable platen (mold closing has been completed), and therefore the movable platen position X 2 at that time is set as the reference position S 0 .
cpuでは該基準位置S0に設定器１５にて設定さ
れた高圧型閉切換距離Ａを加算して得られた位置
を成形時の高圧型閉切換制御位置S1としてメモリ
ー２１に設定記憶すると共に、設定器１４にて設
定された低圧型閉切換距離ＢをS0に加算して得ら
れた位置を成形時の低圧型閉切換制御位置（低速
型閉切換制御位置を兼ねる）S2としてメモリー２
１に設定記憶する。 In the CPU, the position obtained by adding the high pressure mold closing switching distance A set by the setting device 15 to the reference position S 0 is set and stored in the memory 21 as the high pressure mold closing switching control position S 1 during molding. , the position obtained by adding the low pressure mold closing switching distance B set by the setting device 14 to S 0 is memorized as the low pressure mold closing switching control position (also serves as the low speed mold closing switching control position) S 2 during molding. 2
Save the setting to 1.
次に型開閉スイツチ２３を型開側に切換えて可
動盤２を目測により適宜な型開停止位置まで後退
移動した後、型開閉スイツチ２３をOFFとして
型開を停止する。 Next, the mold opening/closing switch 23 is switched to the mold opening side and the movable platen 2 is moved backward to a suitable mold opening stop position by visual measurement, and then the mold opening/closing switch 23 is turned OFF to stop the mold opening.
そして教示スイツチ２４をOFFとすることに
よりその時点での可動盤位置X3が読み込まれ、
X3位置はcpuにより成形時の型開停止位置（型閉
開始位置を兼ねる）S4としてメモリー２１に設定
記憶される。 Then, by turning off the teaching switch 24, the movable platen position X3 at that point is read.
The X3 position is set and stored in the memory 21 by the CPU as a mold opening stop position (also serving as a mold closing start position) during molding.
同時にX3より設定器１３に設定された低速型
開切換距離Ｃが減算されて得られた位置が成形時
の低速型開切換制御位置S3とししてメモリー２１
に設定、記憶される。 At the same time, the low speed mold opening switching distance C set in the setting device 13 is subtracted from X 3 , and the obtained position is stored in the memory 21 as the low speed mold opening switching control position S 3 during molding.
is set and stored.
以上により成形時の制御切換位置S1〜S4が設定
され、型取付スイツチ２２をOFFとして制御装
置を成形モードに戻して型開閉を行うと、S1〜S4
を制御切換位置とする型開閉が行われる。 As described above, the control switching positions S 1 to S 4 during molding are set, and when the mold installation switch 22 is turned OFF and the control device is returned to the molding mode to open and close the mold, the positions S 1 to S 4 are set.
The mold is opened and closed using the control switching position.
尚各工程における速度、圧力は図示なき別個の
設定器により設定され、高圧型開時間も図示なき
別個のタイマーにより設定される。 Note that the speed and pressure in each step are set by a separate setter (not shown), and the high-pressure mold opening time is also set by a separate timer (not shown).
本実施例中、低圧型閉切換制御位置を低速型閉
切換制御位置と兼用したが、低速型閉切換制御位
置は別個の設定器により同様に設定しても良い。 In this embodiment, the low-pressure type closing switching control position is also used as the low-speed type closing switching control position, but the low-speed type closing switching control position may be similarly set using a separate setting device.
又、S0の位置に対してS1の位置をＡだけ手前に
設定するのは型取付時の圧力に対して成形時の低
圧型閉力が異物の挟み込みにより金型破損防止の
ため極めて低く設定され、可動盤がS0まで到達し
ないためである。 Also, the reason why the S 1 position is set A distance ahead of the S 0 position is that the low-pressure mold closing force during molding is extremely low compared to the pressure when the mold is installed to prevent mold breakage due to foreign objects being caught. This is because the movable platen does not reach S0 .
この発明は上述のように型取付時に一回型閉動
作を行うだけで電気的に高圧型閉切換制御位置、
低圧型閉切換制御位置が設定され、オペレーター
は何ら調整作業を行う必要がないので設定時間の
短縮、誤設定の防止が図れ、生産性、安全性が向
上する。また各位置の設定に際し、中圧にて型閉
するので、タイバーの伸びの影響を受けず、スプ
リングの入つた金型についても確実に型閉してそ
の位置を検出することができる等の特長を有す
る。
As described above, this invention electrically switches the high-voltage mold closing control position by performing a single mold closing operation when the mold is installed.
The low-pressure closed switching control position is set and the operator does not need to make any adjustments, reducing setting time and preventing incorrect settings, improving productivity and safety. In addition, when setting each position, the mold is closed using medium pressure, so it is not affected by the elongation of the tie bar, and even molds with springs can be reliably closed and their positions can be detected. has.
図面はこの発明の型締機構における制御位置設
定方法を例示するもので、第１図は装置ブロツク
図、第２図は操作説明図、第３図はフローチヤー
ト図である。
１……型締機構、２……可動盤、６，７……金
型、９……位置検出器。
The drawings illustrate the control position setting method in the mold clamping mechanism of the present invention; FIG. 1 is a block diagram of the apparatus, FIG. 2 is an explanatory diagram of operation, and FIG. 3 is a flowchart. 1... Mold clamping mechanism, 2... Movable platen, 6, 7... Mold, 9... Position detector.
Claims (1)
型閉切換距離と、型閉完了位置検出用時間とを設
定し、可動盤と固定盤の両方に金型を取り付けた
状態にて、可動盤を中圧、低速で移動して型閉じ
を行い、上記型閉完了位置検出用時間による型閉
完了の確認により、その時点の可動盤位置を電気
的に検出し、その検出位置に上記高圧型閉切換距
離を加算した位置を、成形時の高圧型閉切換制御
位置として設定すると共に、検出位置に上記低圧
型閉切換距離を加算した位置を、成形時の低圧型
閉切換制御位置として設定することを特徴とする
型締機構における制御位置設定方法。1. Set the low-speed mold closing switching distance and high-pressure mold closing switching distance required for mold closing, and the mold closing completion position detection time in advance, and with the mold attached to both the movable platen and the fixed platen, The mold is closed by moving the movable platen at medium pressure and low speed, and by confirming the mold closing completion using the mold closing completion position detection time described above, the movable platen position at that point is electrically detected, and the high pressure mold is moved to the detected position. The position obtained by adding the closing switching distance is set as the high pressure mold closing switching control position during molding, and the position obtained by adding the above low pressure mold closing switching distance to the detection position is set as the low pressure mold closing switching control position during molding. A method for setting a control position in a mold clamping mechanism, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27730486A JPS63130323A (en) | 1986-11-20 | 1986-11-20 | Setting method for control position in mold clamping mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27730486A JPS63130323A (en) | 1986-11-20 | 1986-11-20 | Setting method for control position in mold clamping mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63130323A JPS63130323A (en) | 1988-06-02 |
| JPH047985B2 true JPH047985B2 (en) | 1992-02-13 |
Family
ID=17581671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27730486A Granted JPS63130323A (en) | 1986-11-20 | 1986-11-20 | Setting method for control position in mold clamping mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63130323A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02263617A (en) * | 1989-04-05 | 1990-10-26 | Japan Steel Works Ltd:The | Method and device for setting of changing point of moving platen in injection molding machine |
| CN104175424A (en) * | 2014-07-22 | 2014-12-03 | 安庆市曙光包装有限责任公司 | Pushing and pulling mechanism of rubber pad forming mold for metal transfer box |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55124632A (en) * | 1979-03-22 | 1980-09-25 | Toshiba Mach Co Ltd | Control system for opening and closing of moving mold for injection molding machine |
| JPS58194524A (en) * | 1982-05-10 | 1983-11-12 | Tekunopurasu:Kk | Controlling method of operations of opening and closing mold in straight hydraulic mold clamping apparatus |
-
1986
- 1986-11-20 JP JP27730486A patent/JPS63130323A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55124632A (en) * | 1979-03-22 | 1980-09-25 | Toshiba Mach Co Ltd | Control system for opening and closing of moving mold for injection molding machine |
| JPS58194524A (en) * | 1982-05-10 | 1983-11-12 | Tekunopurasu:Kk | Controlling method of operations of opening and closing mold in straight hydraulic mold clamping apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63130323A (en) | 1988-06-02 |
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