JPS63123700A - Method of cutting ceramic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for cutting ceramic pipes and plates.

(Prior art and its problems) Conventionally, in order to cut ceramic pipes and plates,
Diamond circular saws and diamond band saws were used. However, this cutting method has problems in that it takes a long time to cut, the Danyamond saw wears out quickly, and the cost is relatively high.

(Object of the Invention) The present invention has been made to solve the problems of the prior art described above, and provides a method for cutting ceramics easily in a short time and at low cost.

(Structure of the invention) Plasma discharge using a pair of positive and negative electrodes close to one or both sides of a ceramic pipe or plate! , place the pole pairs, respectively. Then, while moving the ceramic relative to the electrode pair, plasma is irradiated along the line to be cut, and the irradiated area is locally heated. Thereafter, the sufficiently heated ceramic is immersed in water or the like to be rapidly cooled and cut.

(Function) Plasma generated by a plasma generator generates an extremely high temperature and can be focused extremely narrowly. Therefore, if the plasma is irradiated along the cutting line of the ceramic, the irradiated area will be localized. When it reaches a high temperature and then cools down, it is destroyed and cut due to the thermal strain caused by rapid expansion and contraction.

(Example) Hereinafter, embodiments will be described in detail with reference to the drawings.

FIG. 1 shows an embodiment of the present invention, in which 1 is a ceramic pipe, 2a and 2b are a pair of plasma discharges consisting of a positive electrode and a negative electrode arranged close to the outer wall surface of the ceramic pipe 1. Electrodes 3a and 3b are a pair of plasma discharge electrodes arranged close to the inner wall surface of the ceramic pipe 1. Therefore, while rotating the ceramic pipe 1, plasma is irradiated along the cutting lines of the outer wall surface and the inner wall surface. It depends on the thickness of the ceramic and the rotation speed, but 1
For example, when the ceramic pipe 1 is about 5 mm thick and the feeding speed is 3 am/sec, the required high temperature is obtained in 2 to 3 rotations, and the ceramic pipe 1 is first removed and immersed in water at room temperature.

By being locally heated to a high temperature in this manner and then rapidly cooled with water, the ceramic pipe breaks along the cutting line.

FIG. 2 shows another embodiment of the present invention.

This is the case when the ceramic is a flat plate. A ceramic plate 4 with a pair of plasma discharge electrodes disposed close to each other on both upper and lower surfaces is reciprocated to irradiate plasma along the cutting line and rapidly cool it by draining water or the like.

FIG. 3 shows the case where the ceramic plate 5 is thin.

In such cases, plasma irradiation should only be applied to one side.According to the method of the present invention described above, cutting can be done several tens to nearly 100 times faster than the conventional cutting method using a diamond saw. This is possible, and the power consumption is about the same as that of plasma welding, so the cost is extremely low.

Note that the cut surface of the ceramic cut by the method of the present invention is somewhat uneven, so finishing with a diamond grindstone or the like is required. However, even if this work is taken into consideration, the cost will be significantly reduced. .

The finer the ceramic particles and the greater the hardness, the easier it is to cut the ceramic. Glass can be cut extremely easily.

(Effects of the Invention) As explained above, according to the present invention, by combining local heating and rapid cooling, ceramics can be grown at high speed by thermal strain due to expansion and contraction.
It also has the advantage of being able to be cut at low cost.

[Brief explanation of the drawing]

Fig. 1 is a diagram showing a cutting method according to an embodiment of the present invention;
3 and 3 are diagrams each showing a cutting method according to another embodiment of the present invention. 1...Ceramic pipe, 2a, 2b, 3a
, 3b... plasma discharge electrode, 4, 5... ceramic plate. Patent applicant Rizo Nishimura Nippon Casting Co., Ltd. Figure 1 (a) (b) Figure 2 (a) (b) Figure 3

Claims (1)

[Claims] Plasma discharge electrode pairs each having a positive electrode and a negative electrode are placed close to one or both sides of a ceramic pipe or plate, and the ceramic is moved relative to the plasma discharge electrode pair to be cut. A method for cutting ceramics, which comprises heating the ceramic by irradiating it with plasma once or several times along a line, and then cutting the ceramic by rapidly cooling it with a liquid such as water.