JPS60257986A - Optical device for laser beam machining - Google Patents
Optical device for laser beam machiningInfo
- Publication number
- JPS60257986A JPS60257986A JP59114941A JP11494184A JPS60257986A JP S60257986 A JPS60257986 A JP S60257986A JP 59114941 A JP59114941 A JP 59114941A JP 11494184 A JP11494184 A JP 11494184A JP S60257986 A JPS60257986 A JP S60257986A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- plate
- laser
- rotary plate
- worked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、炭酸ガスレーザ、YAGレーザなどによるレ
ーザ加工分野におけるレーザ加工用光学装置に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an optical device for laser processing in the field of laser processing using carbon dioxide lasers, YAG lasers, and the like.
従来例の構成とその問題点
レーザ加工は、指向性、集光性に優れたレーザビームを
集光レンズによづて、微小な従ってエネルギ密度の高い
スポットに集光し、このスポットを、被加工物に照射し
て行なう熱加工である。従って、金属はもちろん、セラ
ミック、ガラス等、広範な材料の切断加工が行なえるも
ので、最近、その導入が盛んである。Conventional configuration and its problems In laser processing, a laser beam with excellent directivity and focusing properties is focused onto a minute spot with high energy density using a focusing lens, and this spot is then This is thermal processing performed by irradiating the workpiece. Therefore, it is possible to cut a wide range of materials, including not only metals but also ceramics and glass, and has recently been increasingly introduced.
レーザ切断加工においては、種々のパラメータが存在す
るが、中でも、レーザスポットと、被加物との位置関係
は、レーザ加工の品質、能力に大きな影響がある事は、
良く知られている。There are various parameters in laser cutting processing, but among them, the positional relationship between the laser spot and the workpiece has a great influence on the quality and ability of laser processing.
well known.
第1図において、1はレーザ発振器(図示せず)より放
射されたレーザビーム、2はこのレーザビームを、微小
なスポットに集光するだめの集光レンズ、3はこの集光
レンズによって形成されたレーザスポットである。4は
板状の被加工物である。In Fig. 1, 1 is a laser beam emitted from a laser oscillator (not shown), 2 is a condensing lens for condensing this laser beam onto a minute spot, and 3 is a laser beam formed by this condensing lens. It is a laser spot. 4 is a plate-shaped workpiece.
レーザスポット3の位置が、被加工物40表面6より上
にある場合、もしくは下にある場合の切断加工の加工品
質は、実験によれば、レーザスポット3の位置が、表面
6上にある場合に比べて、いずれの場合も悪く、従って
、多くの場合、レーザスポット3は、被加工物4のちょ
うど表面6上に位置する様にして加工が行表われる。According to experiments, when the position of the laser spot 3 is above or below the surface 6 of the workpiece 40, the processing quality of the cutting process is as follows: When the position of the laser spot 3 is above the surface 6 In both cases, the laser spot 3 is located exactly on the surface 6 of the workpiece 4 during processing.
その時の被加工物4の加工部の断面を第2図に示1゜第
2図に示す如く、切断部の幅は、レーザスポット3が照
射された表面6において広く、被加工物4の下面6に向
うに従い狭くなる。また下面6においては、ドロス7の
付着が認められる。The cross section of the processed part of the workpiece 4 at that time is shown in FIG. 2. As shown in FIG. It gets narrower towards 6. Further, on the lower surface 6, adhesion of dross 7 is observed.
この様に、切断部の形状が、テーパ状になる理由は、切
断部の温度分布を反暎したものと思われる。すなわち、
被加工物4の下面6に向うに従い、レーザ加工時におけ
る被加工物4内における温度が、熱伝導により低下する
ためと考えられる。また、ドロス7が付着する理由も、
下面6近くにおいては、切断部において被加工物が十分
に蒸発せずに、その一部が溶融状態から凝固するためで
あると考えられる。The reason why the shape of the cut portion becomes tapered in this way is thought to be due to the temperature distribution of the cut portion. That is,
This is considered to be because the temperature inside the workpiece 4 during laser processing decreases as it approaches the lower surface 6 of the workpiece 4 due to heat conduction. Also, the reason why dross 7 adheres is
This is considered to be because the workpiece is not sufficiently evaporated at the cut portion near the lower surface 6, and a portion of the workpiece solidifies from a molten state.
一方、加工の観点からは、寸法精度、加工品質を良好に
保つためには、この切断部のテーパ形状、ならびにドロ
スの付着は、はなはだ、不都合なものである。On the other hand, from the viewpoint of processing, the tapered shape of the cut portion and the adhesion of dross are extremely inconvenient in order to maintain good dimensional accuracy and processing quality.
従来、この様々不都合を解決するために、種々な検討が
行なわれてきた。Conventionally, various studies have been made to solve these various disadvantages.
例えば、被加工物の下面6に、更に別の板材を密着させ
てレーザ加工を行なう事でドロスの付着は、かなり低減
される事が見出されてはいるが、余分な材料を必要とし
、現実的ではない。For example, it has been found that the adhesion of dross can be considerably reduced by performing laser processing with another plate material in close contact with the lower surface 6 of the workpiece, but this requires extra material. It's not realistic.
発明の目的
本発明は、この様な不都合を解決するために行々われだ
もので、そのために、簡単なレーザ加工用の光学装置を
提供することを目的とする。OBJECTS OF THE INVENTION The present invention has been made to solve these inconveniences, and for this purpose, it is an object of the present invention to provide a simple optical device for laser processing.
発明の構成
本発明は、レーザビームの集光用のレンズと一つの回転
板で構成され、この回転板は、レーザビ=1に対しほぼ
透明な材料からなる板状の部材を・ ;:9前記回転板
の回転中心の捷わりに、回転方向に並べて構成されたも
のである。Structure of the Invention The present invention is composed of a lens for condensing a laser beam and one rotating plate, and this rotating plate is a plate-shaped member made of a substantially transparent material with respect to laser beam=1. Instead of the center of rotation of the rotary plate, they are arranged side by side in the direction of rotation.
61\一
実施例の説明
転板18は、図示の通り、光軸9に対し、はぼ直交状態
で配置されている。第4図は、回転板18のA矢視図で
あり、回転中心10のまわりに、レーザビームに対しほ
ぼ透明な材料からなる板状の部材11が、回転方向12
の方向に並べられている。なお部材11の材料としては
、レーザビームに対しほぼ透明でかつ屈折率が空気と異
なるものであればよく、例えばYAGレーザに対しては
ガラスを、炭酸ガスレーザに対してはZn5eを用いれ
ば良い。13.14は、各々の板状部材11の外周をつ
なぐリング、および円板で、各部材11は、リング13
9円板14に接着材で固定されている。各部材11の間
には、空間16が設けられている。61\Description of an Embodiment As shown in the figure, the turning plate 18 is arranged approximately perpendicular to the optical axis 9. FIG. 4 is a view of the rotary plate 18 in the direction of arrow A, in which a plate-shaped member 11 made of a material that is almost transparent to the laser beam is arranged around the rotation center 10 in the rotation direction 12.
are arranged in the direction of The material of the member 11 may be any material as long as it is substantially transparent to the laser beam and has a refractive index different from that of air; for example, glass may be used for a YAG laser, and Zn5e may be used for a carbon dioxide laser. 13.14 is a ring and a disk connecting the outer periphery of each plate member 11, and each member 11 is connected to the ring 13.
9 is fixed to the disc 14 with an adhesive. A space 16 is provided between each member 11.
さて、第3図に示す通り、前記の様に構成された回転板
18が、レーザビームの光軸9とほぼ直62、−
交した状態で回転する結果、レーザビーム1は、回転板
18の部材11と空間16とを交互に通過した場合のレ
ーザビーム16は、空間部16を通過する場合のレーザ
ビーム17に比べ、レーザスポット位置が−(n−1)
tだけ下に来る。そこで、被加工物の板厚をTとすると
、部材11の板厚をnT−とする事により、レーザビー
ム1617−1
のスポット位置の間隔は、ちょうどTとなる。すなわち
、この光学装置を用いる事により、レーザビームスポッ
トが、被加工物の上面と下面の位置に交互に形成されて
加工が行なわれてゆく結果、被加工物の下面での温度も
十分に上昇し、加工部 ′の切断幅は、従来に比べて一
様なものとなり、またドロスもほとんど生じない。Now, as shown in FIG. 3, as a result of the rotating plate 18 configured as described above being rotated in a state substantially perpendicular to the optical axis 9 of the laser beam, the laser beam 1 is The laser beam 16 when passing through the member 11 and the space 16 alternately has a laser spot position of -(n-1) compared to the laser beam 17 when passing through the space 16.
It comes down by t. Therefore, if the thickness of the workpiece is T, then by setting the thickness of the member 11 to nT-, the interval between the spot positions of the laser beam 1617-1 becomes exactly T. In other words, by using this optical device, the laser beam spot is formed alternately on the upper and lower surfaces of the workpiece, and as a result, the temperature on the lower surface of the workpiece increases sufficiently. However, the cutting width of the processed part' is more uniform than in the past, and almost no dross is generated.
下表に、従来の加工と、この実施例の光学系を用いた場
合の加工との比較を示す。これからも分かる通り、この
装置は大なる効果を有するもので、工業上、大なる効果
を発揮するものである。The table below shows a comparison between conventional processing and processing using the optical system of this example. As can be seen from this, this device has great effects and is of great benefit in industry.
材料SPCto、5mm
発明の効果
れて加工が行なわれてゆく結果、被加工物の下面での温
度も十分に上昇し、加工部の切断幅は、従来に比べて一
様なものとなり、ドロスもほとんど生じない。Material SPCto, 5mm As a result of the invention, the temperature at the bottom of the workpiece increases sufficiently, the cutting width of the processed part becomes more uniform than before, and there is less dross. Almost never occurs.
第1図は従来例におけるレーザ加工用光学装置の原理図
、第2図は同装置で加工された被加工物の新型面図、第
3図は本発明の一実施例におけるレーザ加工用光学装置
の原理図、第4図は第3図の入方向から見た図、第6図
は同装置説明のだめの図である。
18・・・・・・回転板、8・・印・モータ、9・・・
・・・光軸、10・・・・・・回転中心、11・旧・・
板状部材、13・川・・リング、14・・・・・・円板
。
代理人の氏名 弁理士 中 尾 敏 男 はが1名第1
図
第3図
第4図Fig. 1 is a principle diagram of a conventional laser processing optical device, Fig. 2 is a new side view of a workpiece processed with the same device, and Fig. 3 is a laser processing optical device according to an embodiment of the present invention. 4 is a view seen from the entrance direction of FIG. 3, and FIG. 6 is a diagram for explaining the device. 18... Rotating plate, 8... mark motor, 9...
...Optical axis, 10... Center of rotation, 11 Old...
Plate member, 13・River...Ring, 14...Disc. Name of agent: Patent attorney Toshio Nakao (1st person)
Figure 3 Figure 4
Claims (1)
めの集光レンズと、この集光レンズによって形成される
レーザスポットとの間に、前記レーザビームの光軸にほ
ぼ直交させて、モータ等により駆動される回転板が配置
されており、かつ、この回転板は、前記レーザビームに
対しほぼ透明で屈折率が空気と異なる材料から成る複数
個の板状の部材を、前記回転板の回転中心のまわりに、
回転方向に一定の間隔だけ互いに離して並べられて構成
されたものであり、更に、前記板状の部材の屈折率nと
板厚tは、被加工物の板厚Tとは、(n−1)鴇Tの関
係が成立する様に構成された、レーザ加工用光学装置。Between a condensing lens for condensing a laser beam emitted from a laser oscillator and a laser spot formed by this condensing lens, the lens is driven by a motor or the like so as to be substantially perpendicular to the optical axis of the laser beam. A rotary plate is disposed, and the rotary plate holds a plurality of plate-shaped members made of a material that is substantially transparent to the laser beam and has a refractive index different from that of air, at a center of rotation of the rotary plate. around,
They are arranged so as to be spaced apart from each other by a certain distance in the rotational direction, and further, the refractive index n and the plate thickness t of the plate-shaped member are such that the plate thickness T of the workpiece is (n- 1) An optical device for laser processing configured so that the relationship of T is established.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59114941A JPS60257986A (en) | 1984-06-04 | 1984-06-04 | Optical device for laser beam machining |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59114941A JPS60257986A (en) | 1984-06-04 | 1984-06-04 | Optical device for laser beam machining |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60257986A true JPS60257986A (en) | 1985-12-19 |
Family
ID=14650438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59114941A Pending JPS60257986A (en) | 1984-06-04 | 1984-06-04 | Optical device for laser beam machining |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60257986A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6899984B2 (en) | 2002-05-31 | 2005-05-31 | Samsung Electronics Co., Ltd. | Linked dihydrazone-based charge transport compounds |
US6964833B2 (en) | 2002-05-31 | 2005-11-15 | Samsung Electronics Co., Ltd. | Linked dihydrazone-based charge transport compounds |
CN102990230A (en) * | 2012-12-12 | 2013-03-27 | 京东方科技集团股份有限公司 | Laser cutting machine |
-
1984
- 1984-06-04 JP JP59114941A patent/JPS60257986A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6899984B2 (en) | 2002-05-31 | 2005-05-31 | Samsung Electronics Co., Ltd. | Linked dihydrazone-based charge transport compounds |
US6964833B2 (en) | 2002-05-31 | 2005-11-15 | Samsung Electronics Co., Ltd. | Linked dihydrazone-based charge transport compounds |
CN102990230A (en) * | 2012-12-12 | 2013-03-27 | 京东方科技集团股份有限公司 | Laser cutting machine |
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