JPS63123592A - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JPS63123592A JPS63123592A JP26806486A JP26806486A JPS63123592A JP S63123592 A JPS63123592 A JP S63123592A JP 26806486 A JP26806486 A JP 26806486A JP 26806486 A JP26806486 A JP 26806486A JP S63123592 A JPS63123592 A JP S63123592A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- solder
- rosin
- gel
- org
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 39
- 239000006071 cream Substances 0.000 title claims abstract description 20
- 230000004907 flux Effects 0.000 claims abstract description 29
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 12
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 12
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 11
- 239000012190 activator Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 13
- 239000003960 organic solvent Substances 0.000 claims description 6
- 239000006023 eutectic alloy Substances 0.000 claims description 5
- 230000006866 deterioration Effects 0.000 abstract description 5
- 239000002245 particle Substances 0.000 abstract description 5
- 230000005496 eutectics Effects 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract 6
- 238000004898 kneading Methods 0.000 abstract 2
- ICXXXLGATNSZAV-UHFFFAOYSA-N butylazanium;chloride Chemical compound [Cl-].CCCC[NH3+] ICXXXLGATNSZAV-UHFFFAOYSA-N 0.000 abstract 1
- 239000004359 castor oil Substances 0.000 abstract 1
- 235000019438 castor oil Nutrition 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 8
- 239000013543 active substance Substances 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000010587 phase diagram Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- -1 amine hydrochloride Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔（既要〕
高密度集積素子を表面実装等するさいに用いるクリーム
はんだの改良に係り、その経時的劣化を解消するため、
クリームはんだ中におけるアミン類塩酸塩（活性剤）及
びはんだ粉末間の酸化反応を抑止させた複数相のフラッ
クス媒体を形成して。[Detailed Description of the Invention] [(Already required)] In order to improve the cream solder used when surface mounting high-density integrated devices, etc., and to eliminate its deterioration over time,
By forming a multi-phase flux medium that suppresses the oxidation reaction between amine hydrochloride (activator) and solder powder in cream solder.
安定なりリーム゛はんだを実現することである。The goal is to realize stable beam soldering.
本発明は、高密度集積素子のはんだ付は実装等に使用さ
れるクリームはんだに関する。The present invention relates to cream solder used for soldering, mounting, etc. of high-density integrated devices.
高密度実装回路基板にＩＣ素子を接続する際１例えば１
．マスクスクリーンを用いてクリームはんだを基板回路
に刷りこみ、これをリフロー炉で加熱してはんだ付けす
ることが行われる。然し、クリームはんだの品質劣化に
より所望のはんだ付けが出来ないことがある。When connecting IC elements to a high-density mounting circuit board 1 For example, 1
．． Cream solder is imprinted onto the circuit board using a mask screen, and soldered by heating it in a reflow oven. However, desired soldering may not be possible due to quality deterioration of cream solder.
本発明は、前記はんだの品質劣化を改善するためのフラ
ックスの組成に係る“。The present invention relates to a flux composition for improving the quality deterioration of the solder.
クリームはんだは１例えばＳｎとｐｂ組成の共晶合金体
を、２００メツシュ以上の粉末とし、これを以下説明す
るロジン、有機溶剤等からなる活性化フラックスと共に
練り込んでペースト状はんだが形成される。はんだ付は
接合面に存在する金属酸化被膜を除去するための活性化
フラックスの一組成として
払成長
前記組成表中、添加された活性剤の例えばアミン類塩酸
塩等は、金属表面のはんだ濡れ性をよ（することによっ
て、はんだ付けを確実にする不可欠の成分であるが、他
方、クリームはんだ自体の経時的品質を低下させて保存
期間を短くすると云う不都合がある。For cream solder, for example, a eutectic alloy of Sn and PB composition is made into a powder of 200 mesh or more, and this is kneaded with an activation flux made of rosin, an organic solvent, etc., which will be explained below, to form a paste-like solder. In soldering, it is used as a component of an activated flux to remove the metal oxide film present on the joint surface. Although it is an essential component for ensuring soldering, it has the disadvantage of reducing the quality of the cream solder itself over time and shortening its shelf life.
クリームはんだの保存期間は、保存温度や前記フランク
ス組成により、またはんだ組成によって異なり一概に云
えないが、少な（とも６力月程度の保存期間が必要であ
る。The storage period of cream solder varies depending on the storage temperature, the Franks composition, and the solder composition, so it cannot be stated unconditionally, but a storage period of about 6 months is required.
しかしながら従来のクリームはんだは、保存期間中、フ
ランクス組成に含まれる活性剤とはんだ粉末が化学的に
反応することによってはんだが酸化物粉末に変質し、前
記リフロー加熱によるはんだ付は処理時において、所望
のはんだ付けを行うに必要な溶融球が形成されず問題が
ある。However, with conventional cream solder, during the storage period, the active agent contained in the Franks composition and the solder powder chemically react, resulting in the solder changing into oxide powder. There is a problem in that the molten ball necessary for soldering is not formed.
〔問題点を解決するための手段〕
ロジン系フラックス中に含まれる活性剤と、はんだ粉末
との化学的酸化反応を抑止するため、添付図に示す如く
″ 有機溶剤に難溶のロジンと少なくとも活性剤を含む
第一のゲル状フラックス２と、活性剤を含まない有機溶
剤に易溶のロジンを主成分とする第二のゲル状フラック
ス３からなる複数相のロジン系フラックス媒体を用い、
これに例えばすず・鉛等の共晶合金組成のはんだ粉末１
を加えて練り込んでクリームはんだを形成したことであ
る。[Means for solving the problem] In order to suppress the chemical oxidation reaction between the activator contained in the rosin-based flux and the solder powder, as shown in the attached figure, rosin, which is poorly soluble in organic solvents, and at least an active Using a multi-phase rosin-based flux medium consisting of a first gel-like flux 2 containing an active agent and a second gel-like flux 3 containing rosin as a main component that does not contain an active agent and is easily soluble in an organic solvent,
For example, solder powder 1 having a eutectic alloy composition such as tin and lead.
was added and kneaded to form cream solder.
添付図はクリームはんだの相状態図で９図中１は共晶合
金組成のはんだ粉末粒子である。The attached figure is a phase diagram of cream solder, and 1 in 9 figures is a solder powder particle having a eutectic alloy composition.
ゲル状ならびにゾル状の複数相組成からなる第一のゲル
状フラックスは、常温において、含まれる活性剤は有機
溶剤への溶解を抑止させるものである。しかし第一のゲ
ル状フラックスに用いるロジンはその軟化温度が８０℃
程度であるため、リフロー加熱時には液相となり、第二
のゲル状フラックス中に溶解してはんだ付は接合面の金
属酸化被膜を除去するに有効である。The first gel-like flux, which has a multi-phase composition of gel-like and sol-like compositions, has an activator contained therein that inhibits dissolution in organic solvents at room temperature. However, the softening temperature of the rosin used for the first gel flux is 80°C.
Therefore, it becomes a liquid phase during reflow heating and is dissolved in the second gel-like flux, and soldering is effective in removing the metal oxide film on the joint surface.
このため従来２問題とされた保存期間中にクリームはん
だが劣化することがなく、従って、はんだ付けの電気的
機械的接続性能が安定となる。Therefore, the cream solder does not deteriorate during the storage period, which was two problems in the past, and therefore, the electrical and mechanical connection performance of soldering becomes stable.
以下９本発明のクリームはんだを形成する第一のゲル状
フラックスと第二のゲル状フラックスの組成実施例につ
いて説明する。Examples of compositions of the first gel flux and the second gel flux forming the cream solder of the present invention will be described below.
・二のゾル状フラックス３それぞれを混合容積比略１：
５ の割合で混合攪拌するを示す。・Mix each of the two sol-like fluxes at a volume ratio of approximately 1:
It shows mixing and stirring at a ratio of 5.
更に前記混合攪拌液に共晶はんだの例えば、錫Ｓｎと鉛
Ｐｂ （３８％）組成の共晶はんだ粒子１（粒子径、２
００メツシユまたはそれ以上）を添加しる。前記複数相
の第一のゲル状フラックスｌ中の活性剤は、常温におい
て該第−のゲル状フラックスにくるまれる形態となる。Furthermore, eutectic solder particles 1 (particle size, 2
00 mesh or more). The active agent in the multi-phase first gel-like flux 1 is in the form of being wrapped in the second gel-like flux at room temperature.
従って、従来あったような遊離活性剤とはんだ粉末との
接触反応が大幅に抑止されることになる。Therefore, the contact reaction between the free activator and the solder powder, which has conventionally occurred, is significantly suppressed.
前記実施例は９通常の５ｎ−Ｐｂ系共晶はんだを取り上
げて説明しているが１本発明のフラックスはこれと限る
必要はなく例えば近時の低融点組成の他の共晶合金に適
用するも構わない。Although the above-mentioned embodiments have been described using ordinary 5n-Pb eutectic solder, the flux of the present invention need not be limited to this, and can be applied to other eutectic alloys with recent low melting point compositions, for example. I don't mind.
前記本発明のクリームはんだによれば、従来の保存期間
中におけるクリーム中の活性成分によるはんだ粒の酸化
反応による劣化が抑止されることから、ステンレスマス
ク等によるはんだペーストの印刷性、印刷後のはんだ付
は性が共に向上するため接続の信頼性もよくなる。According to the cream solder of the present invention, the deterioration due to the oxidation reaction of the solder particles due to the active ingredients in the cream during the conventional storage period is suppressed, so the printability of the solder paste with a stainless steel mask etc. and the solder after printing are improved. The reliability of the connection also improves as the connection performance improves.
添付図は本発明クリームはんだの相状態図。 図中、１ははんだ粉末。 ２はゲル状フラックス。 The attached figure is a phase diagram of the cream solder of the present invention. In the figure, 1 is solder powder. 2 is gel-like flux.
Claims (1)
ジンと少なくとも活性剤を含む第一のゲル状フラックス
（２）と、有機溶剤に易溶のロジンを主成分とする第二
のゾル状フラックス（３）とからなる複数相のフラック
ス中に練り込んでなることを特徴とするクリームはんだ
。A first gel-like flux (2) containing a solder powder (1) having a eutectic alloy composition and at least an activator and a rosin which is hardly soluble in an organic solvent, and a second gel flux (2) whose main component is a rosin which is easily soluble in an organic solvent. A cream solder characterized by being kneaded into a multi-phase flux consisting of a sol-like flux (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26806486A JPS63123592A (en) | 1986-11-11 | 1986-11-11 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26806486A JPS63123592A (en) | 1986-11-11 | 1986-11-11 | Cream solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63123592A true JPS63123592A (en) | 1988-05-27 |
Family
ID=17453386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26806486A Pending JPS63123592A (en) | 1986-11-11 | 1986-11-11 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63123592A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2380964A (en) * | 2001-09-04 | 2003-04-23 | Multicore Solders Ltd | Lead-free solder paste |
| JP2010534139A (en) * | 2007-07-23 | 2010-11-04 | ヘンケル リミテッド | Solder flux |
| JP2013173156A (en) * | 2012-02-24 | 2013-09-05 | Mitsubishi Materials Corp | Method for producing solder paste, and the solder paste produced by the same |
-
1986
- 1986-11-11 JP JP26806486A patent/JPS63123592A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2380964A (en) * | 2001-09-04 | 2003-04-23 | Multicore Solders Ltd | Lead-free solder paste |
| GB2380964B (en) * | 2001-09-04 | 2005-01-12 | Multicore Solders Ltd | Lead-free solder paste |
| JP2010534139A (en) * | 2007-07-23 | 2010-11-04 | ヘンケル リミテッド | Solder flux |
| JP2013173156A (en) * | 2012-02-24 | 2013-09-05 | Mitsubishi Materials Corp | Method for producing solder paste, and the solder paste produced by the same |
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