JPS63122971A - Test terminal contact mechanism of electrostatic withstand voltage tester - Google Patents

Abstract

PURPOSE:To obtain a contact mechanism which allows positive and easy contact, by providing a piston crank mechanism with a link adapted to cause a circular arc motion at the tip of a test terminal in addition to a slide mechanism of the test terminal. CONSTITUTION:As a slider 26 is driven linearly to the left, the tip of a terminal base 25 advances to the left with a rotary arm 30 turning counterclockwise centered on a pivot 29 and the rotary arm 30 upright gets turned to the left. At this point, the tip of a test terminal 24 lowers onto a lead terminal 22 of a flat package type IC 21 advancing from a high position to contact it. In short, the test terminal 24 gets in contact with the top of the terminal 22 slantly from above and when slidden slightly, the terminal 24 is forced to rub the terminal 22 with increase in the contact pressure to contact the top of the terminal 22 by pressing. Thus, the terminal 24 breaks an insulating material such as oxide film formed on the surface of the terminal 22 thereby enabling electric contacting positive.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a test terminal contact mechanism for an electrostatic breakdown voltage tester, and in particular to a test terminal contact mechanism for an electrostatic breakdown voltage evaluation device to a lead terminal of a flant package type IC under test. This relates to the contact mechanism of the test terminal.

(Prior Art) Conventionally, as a technology in this field, Japanese Patent Application No. 1982-82394 proposed by the present applicant can be mentioned.

The configuration will be explained below using figures.

FIG. 3 is a schematic configuration diagram of the electrostatic withstand voltage testing apparatus, and FIG. 4 is an explanatory diagram of the operation of the test terminal contact mechanism of the electrostatic withstanding voltage testing apparatus.

In these figures, an electrostatic withstand voltage test device 1 includes an application electrode 3 that applies a DC high voltage to the package of an IC 2 to charge it, and a discharge electrode 3 that contacts a predetermined lead terminal of the IC 2 to generate a discharge. It is equipped with a rod 4 and a terminal 5a that contacts all the lead terminals of rc2 and completely removes a minute amount of charge remaining in the circuit of IC2 after completion of discharge. Further, the application electrode 3 is connected to a DC high voltage generator 6.

The discharge rod 4 has a slide mechanism etc. using a motor as a driving source, and can be moved onto any lead terminal by movement in the X-Y direction, and can be moved onto a desired lead terminal by movement in the Z direction (up and down movement). It is possible to make contact with and separate from.

Further, this discharge rod 4 is connected to an equivalent impedance means 7, whereby the discharge from the IC 2 can be adjusted.

The terminal 5a is fixed to the terminal block 5b.
move with In addition, these terminals 5a are connected to the ground potential, and are prepared in at least the same number as the lead terminals of IC2, and by moving in the direction of IC2, it is possible to contact all the lead terminals (the fourth Further, the terminal 5a is configured so that it can be switched to the tester 9 using a switch 8 or the like in addition to the ground potential.

FIG. 4 is an explanatory diagram of the operation of the IC test terminal contact mechanism in the conventional electrostatic withstand voltage testing apparatus.

In this case, as shown in FIG. 3, the IC 2 of the DIP type sample is fixed by a holding mechanism (not shown) on the application electrode 3 that applies a DC high voltage. Therefore, when a high voltage is applied to the application electrode 3, charges are generated in the package of the IC2. In this state, as shown in FIG. 4(a), the discharge rod 4 is lowered and brought into contact with the lead terminal IO of the IC 2 to cause discharge. After this, in order to remove all the minute charges remaining in the circuit of IC2, as shown in Fig. 4(b).
As shown in FIG. 2, the terminal 5a used for static elimination and testing is moved to the left so that the terminal 5a contacts all the lead terminals of the IC2. That is, the terminal 5a is fixed to the terminal block 5b, and the terminal block 5b is supported by the slider 11, so that the base can be slid. This mechanism realizes contact between the lead terminal 10 of the IC and the terminal 5a. When the entire load inside the IC is removed, the discharge rod 4 is raised and the terminal 5a is opened. When the sequence of 0 or more is completed, the previous terminal 5a functions as a terminal of the tester by switching by the relay circuit, and the test starts. . Thereafter, the same operation was performed on the lead terminals of the IC one after another for evaluation.

In addition, in this specification, the terminal used for the test including the above-mentioned static elimination is called a test terminal.

(Problem to be Solved by the Invention) However, the sliding mechanism of the test terminal of the above-mentioned device cannot be used when testing an IC with lead terminals extending parallel to the package surface, such as a flat package IC. It is difficult to contact the terminal with the lead terminal of the IC, and it is thinner than the lead terminal of a DIP type IC, so even if contact is made, there are problems such as bending the lead terminal.

The present invention eliminates the above-mentioned problems, eliminates poor contact and bending of the lead terminals when contacting the lead terminals of the test IC with the test terminals, and provides an electrostatic withstand voltage testing device that can perform reliable and easy contact. The purpose of this invention is to provide a test terminal contact mechanism.

(Means for Solving the Problems) The present invention provides a contact mechanism for a test terminal that performs an electrostatic withstand voltage test by bringing the test terminal into contact with a lead terminal having a flat surface of a device containing an IC under test. In addition to the slide mechanism for the test terminal, a piston/crank mechanism is provided with a link that causes the tip of the test terminal to move in an arc.

(Function) According to the present invention, since it is configured as described above, the conventional D
Compared to the method of pressing the test terminal against the side surface of the lead terminal bent in the vertical direction as in the case of IP type IC, the test terminal is pressed from the diagonal upper surface of the lead terminal extending horizontally from the puff cage of flat package type IC ( contact). That is, after fixing the flat package type IC to the application electrode, a link is used to perform circular arc movement from a linear movement that brings the test terminal into contact. In other words, the test terminal is lifted upward just in front of the lead terminal, and then the tip of the test terminal is lowered diagonally from above onto the top surface of the lead terminal, and its elastic force increases the contact pressure while rubbing the top of the lead terminal. ), it is possible to ensure the contact between the lead terminal of the flat IC and the test terminal, and also to prevent the lead terminal from bending during contact.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is an explanatory diagram of the operation of a test terminal contact mechanism of an electrostatic withstand voltage tester showing an embodiment of the present invention, and FIG. 2 is a schematic configuration diagram of an electrostatic withstand voltage tester showing an embodiment of the present invention.

In FIG. 2, 20 is an electrostatic withstand voltage tester, 21 is a flat package type IC 122, and its =1-"C lead terminal, 23 is an application electrode, 24 is a test terminal provided at the tip of the terminal block, and 25 is a test terminal provided at the tip of the terminal block. a terminal block that fixes the test terminal;
26 is a slider, 27 is a pivot, and the other parts are the same as those explained in FIG. 3.

As shown in this figure, in this embodiment, a test terminal 24 is brought into contact with and separated from a lead terminal 22 extending horizontally from a flat package type IC 21.

Hereinafter, the test terminal contact mechanism of this electrostatic withstand voltage tester will be explained in detail using FIG. 1.

In FIG. 1, an elastic test terminal 24 is provided at the tip of the terminal block 25, and a slider 26 that slides on the fixed part is moved by a pivot 27 provided at the bottom of the rear end of the terminal block 25. It is linked to the terminal block 25. Further, a pivot 28 is provided at the lower end of the terminal block 25. On the other hand, a pivot 29 is provided on the fixed part, and the pivot 29 and the pivot 28 are linked by a rotating arm 30. That is, when the slider 26 is driven in a linear direction, the tip of the terminal block 25 having the test terminal 24 moves in an arc due to the link mechanism, that is, the piston crank mechanism.

Next, the operation of this test terminal contact mechanism will be explained.

First, as shown in FIG. 1(a), the slider 26
When the terminal block 25 is driven linearly to the left, the tip of the terminal block 25 is rotated counterclockwise by the rotating arm 30 about the pivot 29 and advances to the left.

Furthermore, when the slider 26 is driven linearly to the left, the rotating arm 3° stands upright, as shown in FIG. 1(b), and in this state, the front end of the terminal block 25 is It becomes the highest position, and naturally the test terminal 24 also moves to the highest position. Further, when the slider 26 is linearly driven to the left, the rotating arm 30 is moved as shown in FIG. 1(c).
changes from an upright position to a rotated position to the left. At this time, the tip of the test terminal 24 advances from a high position and descends onto the lead terminal 22 of the flat package type IC 21 to come into contact with it.

In other words, the test terminal 24 moves in an arc shape and comes into contact with the lead terminal 22 from diagonally above, and when a slight slide is added, the test terminal 24 is rubbed against the lead terminal 22 while increasing the contact pressure, and the lead terminal 24 is rubbed against the lead terminal 22 with increasing contact pressure. Press contact is made on the terminal 22. At this time, the test terminal 24 breaks the insulating material such as the oxide film formed on the surface of the lead terminal 22, thereby making it possible to establish reliable electrical contact.

In the above example, for ease of explanation, lO
Although a pin flat package type IC is shown, it goes without saying that the present invention can also be applied to a flat package type IC 1 with high density leads extending in all directions, for example, a 20 to 120 pin flat package type IC.

FIG. 5 is a partial perspective view of an electrostatic withstand voltage testing apparatus for a 64-bin flat package type IC.

In this figure, 31 is a 64-pin flat package IC (pin spacing 0.8n+) as a specimen, 32 is its lead terminal, 33 is a terminal block, 34 is a test terminal provided at the tip, and 35 is a slider. , 36 is a guide groove of the slider, and 37 is a drive rod connected to the slider.

As shown in this figure, the slider 35 is connected to the drive rod 37.
Due to the propulsion, the tip of the test terminal 34 moves in an arcuate trajectory as described above, and the flat package type I
It contacts the lead terminal 32 of C31 from diagonally above and presses against it.

Next, FIG. 6 is a partial perspective view of an electrostatic withstand voltage testing apparatus in which the test terminal contact mechanism according to the present invention is applied to testing an IC card in which an IC is installed.

As shown in this figure, a test terminal 45 provided at the tip of a terminal block 44 comes into contact with an electrode 42 serving as a lead terminal of an IC card 41 and is grounded. On the other hand, a discharge rod 43 having a rounded tip is lowered from directly above, and an electrostatic withstand voltage test is performed.

Particularly in the case of planar electrodes such as IC cards, there is a problem in that it is difficult to contact the test terminal from the side, but according to the present invention, this problem can be skillfully solved.

Furthermore, the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

(Effects of the Invention) As described above in detail, according to the present invention, a piston-crank mechanism is provided so that the tip of the test terminal can move in an arc in the Z-axis direction. , I
The test terminal can be rubbed on the lead terminal in a pressed state to obtain an ideal electrical contact without bending the lead terminal having a flat part of the device containing the C.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram of the operation of the test terminal contact mechanism of an electrostatic withstand voltage tester showing an embodiment of the present invention, Fig. 2 is a schematic configuration diagram of an electrostatic withstand voltage tester showing an embodiment of the present invention, and Fig. 3 1 is a schematic configuration diagram of a conventional electrostatic withstand voltage test device, FIG. 4 is an explanatory diagram of the operation of the test terminal contact tafJI of the electrostatic withstand voltage test device, and FIG. 5 is an electrostatic withstand voltage test device for a 64-bin flat package type IC. FIG. 6 is a partial perspective view of an electrostatic withstand voltage testing apparatus in which the test terminal contact mechanism according to the present invention is applied to an IC card test. 20... Electrostatic withstand voltage test device, 21... Flat package type IC, 22... Lead terminal of flat type pan cage IC, 23... Application electrode, 24.34.45.
...Test terminal, 25, 33.44...Terminal block, 26.
35...Slider, 27°28, 29...Pivot, 30...Rotating arm, 31...64-bin flat package type IC132...64-bin flat package type IC lead terminal, 36 ... Slider guide groove, 37 ... Drive rod, 41 ... IC card, 42
...Bow C card electrode, 43...discharge rod.

Claims (1)

[Scope of Claims] A test terminal contact mechanism in which an electrostatic withstand voltage test is performed by bringing a test terminal into contact with a lead terminal having a flat surface of a device containing an IC under test, which includes: (a) a test having elasticity at the tip; (b) The test terminal side of the pivots is supported by a fixed part via a link, and the other pivot is supported by a slider that moves linearly. A test terminal contact mechanism for an electrostatic withstand voltage test device, characterized in that a piston-crank mechanism is connected.