JPS63121692A - Method for activating base material of ic lead frame - Google Patents
Method for activating base material of ic lead frameInfo
- Publication number
- JPS63121692A JPS63121692A JP26704086A JP26704086A JPS63121692A JP S63121692 A JPS63121692 A JP S63121692A JP 26704086 A JP26704086 A JP 26704086A JP 26704086 A JP26704086 A JP 26704086A JP S63121692 A JPS63121692 A JP S63121692A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- lead frame
- soln
- alloy
- alkali
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims description 9
- 230000003213 activating effect Effects 0.000 title claims description 5
- 239000000956 alloy Substances 0.000 claims abstract description 12
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims abstract description 4
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000176 sodium gluconate Substances 0.000 claims abstract description 4
- 235000012207 sodium gluconate Nutrition 0.000 claims abstract description 4
- 229940005574 sodium gluconate Drugs 0.000 claims abstract description 4
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 claims abstract description 4
- 239000007864 aqueous solution Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 4
- 229910052700 potassium Inorganic materials 0.000 claims description 4
- 239000011591 potassium Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000003518 caustics Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000002585 base Substances 0.000 abstract description 16
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 abstract description 13
- 239000003513 alkali Substances 0.000 abstract description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract description 6
- 238000005868 electrolysis reaction Methods 0.000 abstract description 6
- 230000003749 cleanliness Effects 0.000 abstract description 4
- 235000011118 potassium hydroxide Nutrition 0.000 abstract description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 abstract description 3
- 229910000990 Ni alloy Inorganic materials 0.000 abstract description 2
- 239000002253 acid Substances 0.000 abstract description 2
- 235000011121 sodium hydroxide Nutrition 0.000 abstract description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 230000004913 activation Effects 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 5
- 241001363516 Plusia festucae Species 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 229940072033 potash Drugs 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000015320 potassium carbonate Nutrition 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4835—Cleaning, e.g. removing of solder
Abstract
Description
【発明の詳細な説明】
［発明の利用分野］
本発明は、ＩＣリードフレーム基材の活性化方法に関す
るものであり、特に４２アロイ材のリードフレーム基材
表面に金スポットメッキを施すために必要な活性化処理
である新規な前処理方法に関するものである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a method for activating an IC lead frame base material, and in particular to a method for activating an IC lead frame base material, which is particularly necessary for applying gold spot plating to the surface of a lead frame base material made of 42 alloy material. The present invention relates to a novel pretreatment method that is an activation treatment.
［従来技術］
従来、４２アロイ材によるリードフレーム基材表面に金
スポットメッキを施すための活性化処理としでは、４２
アロイ材によるリードフレーム基材表面を脱脂処理及び
酸洗い（化学的研磨）をしたのち、５〜５０容量％、か
っ液温１０〜４０℃の塩酸に５〜３０秒間浸漬すること
により活性化処理としていた。そしてその後、アルカリ
により中和し、次いでメッキを施していた。[Prior art] Conventionally, activation treatment for applying gold spot plating to the surface of a lead frame base material made of 42 alloy material has been performed using 42 alloy.
After degreasing and pickling (chemical polishing) the surface of the lead frame base material made of alloy material, it is activated by immersing it in 5-50% by volume hydrochloric acid at a temperature of 10-40°C for 5-30 seconds. It was. After that, it was neutralized with alkali and then plated.
［発明が解決しようとする問題点］
近年、ＩＣリードフレームに対する品質規格は、年々厳
しくなっており、特に清浄度（（１−１Ｓ０２−の上限
値）の規格は、各社で導入されている。そしてこれらの
規格値を満足するためには、後処理での洗浄を強化して
この清浄度を高めるだけではなく、特に塩酸は、活性な
発煙性であり、作業室内の大気を極度に悪化させてしま
うので、作業室内の大気の清浄化をはかるためにメッキ
作業室内でのｃｕ−１ｓｏ２−を含む薬品の使用をやめ
ることも必要となってきた。[Problems to be Solved by the Invention] In recent years, quality standards for IC lead frames have become stricter year by year, and in particular, standards for cleanliness ((upper limit of 1-1S02-)) have been introduced by each company. In order to meet these standard values, it is necessary not only to increase the cleanliness level by strengthening cleaning in post-processing, but also to avoid the use of hydrochloric acid, which is an active smoke-emitting agent and can extremely deteriorate the atmosphere in the work room. Therefore, it has become necessary to stop using chemicals containing cu-1so2- in the plating workroom in order to purify the atmosphere within the workroom.
［問題点を解決するための手段及び作用］本発明は、上
述した従来技術であるＩＣリードフレーム基材のための
活性化処理において問題視されていた塩酸を使用せずに
、この活性化処理を行い、２次的に表面清浄度の高いリ
ードフレームを供給することができる新規な方法を提供
することを目的とするものである。すなわち本発明は、
４２アロイ材のＩＣリードフレーム基材に金メッキを施
すため、該基材表面を活性化する方法において、該基材
を青化カリ、苛性カリ、ＥＤＴＡナトリウム、グルコン
酸ナトリウムの少なくとも１つを含む水溶液中で陰極電
解処理することを特徴とする上記基材の活性化方法であ
る。[Means and effects for solving the problems] The present invention provides an activation treatment without using hydrochloric acid, which has been regarded as a problem in the above-mentioned prior art activation treatment for IC lead frame substrates. It is an object of the present invention to provide a novel method that can perform this and secondarily supply a lead frame with high surface cleanliness. That is, the present invention
In order to apply gold plating to an IC lead frame base material made of a 42 alloy material, the base material is placed in an aqueous solution containing at least one of potassium cyanide, caustic potassium, sodium EDTA, and sodium gluconate. This is a method for activating the base material, characterized in that the substrate is subjected to cathodic electrolytic treatment.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
まず本発明の方法が適用される４２アロイ材のＩＣリー
ドフレーム基材に金メッキを施すプロセスについて説明
すると、基材としての例えばＦｅ−４２％Ｎｉ合金から
なる４２アロイ材をＩＣリードフレームの形状に裁断加
工し、これを苛性ソーダ等のアルカリの５０ ｇ／（ｌ
の水溶液中での陰極電解により脱脂処理を行う。次いで
過酸化水素水等の酸の液中に浸漬して化学研磨を行い、
その後苛性カリ等のアルカリの１％程度の水溶液に浸漬
してアルカリ中和する。First, to explain the process of gold plating a 42 alloy IC lead frame base material to which the method of the present invention is applied, the 42 alloy base material, for example, made of Fe-42%Ni alloy, is shaped into an IC lead frame. It is cut into pieces and treated with 50 g/(l) of alkali such as caustic soda.
Degreasing is performed by cathodic electrolysis in an aqueous solution. Next, chemical polishing is performed by immersing it in an acid solution such as hydrogen peroxide solution.
Thereafter, it is immersed in an aqueous solution of about 1% alkali such as caustic potash to neutralize the alkali.
本発明の活性化処理は、この中和工程の後に行われるの
である。本発明によれば、このように前処理された基材
は、青化カリ、苛性カリ、ＥＤＴＡナトリウム、グルコ
ン酸ナトリウムの少なくとも１つを含む水溶液中で陰極
電解され、活性化される。各々の水溶液の濃度は、いず
れも１．０〜３００ ｇ／Ｄ程度であり、これらの水溶
液は、単独で、あるいは２種以上を組み合わせた組成の
ものが使用される。処理浴液の温度は、１〜８０℃、処
理時間は１〜３００秒間、陰極電解の電流密度は０．１
〜１００Ａ／ｄｍ２である。陰極電解の技術は、従来公
知であり、本発明を実施するため以上のような条件のも
とに利用することができる。The activation treatment of the present invention is performed after this neutralization step. According to the invention, the thus pretreated substrate is activated by cathodic electrolysis in an aqueous solution containing at least one of cyanide potash, caustic potash, sodium EDTA, and sodium gluconate. The concentration of each aqueous solution is approximately 1.0 to 300 g/D, and these aqueous solutions may be used alone or in combination of two or more. The temperature of the treatment bath liquid was 1 to 80°C, the treatment time was 1 to 300 seconds, and the current density of cathode electrolysis was 0.1
~100A/dm2. The technique of cathodic electrolysis is conventionally known and can be used under the above conditions to carry out the present invention.
上記のごとき本発明の活性化処理が施されたのち、４２
アロイ材の基材には、金スポットメッキが施される。After the activation treatment of the present invention as described above, 42
Gold spot plating is applied to the alloy base material.
［実施例］
次に本発明をその実施例によってより具体的に説明する
。[Examples] Next, the present invention will be explained in more detail with reference to Examples.
短冊状に打抜加工した４２アロイ材のリードフレーム基
材に脱脂、化学研磨、アルカリ中和の各処理を施し、さ
らに本発明による骨化カリウム５０ ｇ／ＩＩ 、苛性
カリウム５０ｇ／ρとした水溶液（液温４０℃）を収容
し、電流密度２Ａ／ｄｍ２で通電しである処理浴槽に２
０秒間通して陰極洗浄の活性化処理を施し、最後に基材
の処理面に対して金スポットメッキを施して所望のＩＣ
リードフレームを作成した。この実施例においては、従
来技術にあったような問題は生じなかった。A 42 alloy lead frame base material punched into a strip shape was subjected to degreasing, chemical polishing, and alkali neutralization, and an aqueous solution containing 50 g/II of ossified potassium and 50 g/ρ of caustic potassium according to the present invention was prepared. (liquid temperature: 40°C) and energized at a current density of 2 A/dm2.
Activation treatment of cathode cleaning is performed for 0 seconds, and finally gold spot plating is applied to the treated surface of the base material to form the desired IC.
Created a lead frame. In this embodiment, the problems encountered in the prior art did not occur.
［発明の効果］
本発明によれば、従来技術によるごとき塩酸を使用しな
いので、清浄度の高いＩＣリードフレームが製造でき、
かつその作業環境を汚染することがないという実用上大
きな効果が奏せられる。[Effects of the Invention] According to the present invention, since hydrochloric acid as in the prior art is not used, an IC lead frame with high purity can be manufactured.
Moreover, it has a great practical effect of not contaminating the working environment.
Claims (1)
すため、該基材表面を活性化する方法において、該基材
を青化カリ、苛性カリ、ＥＤＴＡナトリウム、グルコン
酸ナトリウムの少なくとも１つを含む水溶液中で陰極電
解処理することを特徴とする上記基材の活性化方法In order to apply gold plating to an IC lead frame base material made of a 42 alloy material, the base material is placed in an aqueous solution containing at least one of potassium cyanide, caustic potassium, sodium EDTA, and sodium gluconate. A method for activating the above-mentioned substrate, characterized by cathodic electrolytic treatment with
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26704086A JPS63121692A (en) | 1986-11-10 | 1986-11-10 | Method for activating base material of ic lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26704086A JPS63121692A (en) | 1986-11-10 | 1986-11-10 | Method for activating base material of ic lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63121692A true JPS63121692A (en) | 1988-05-25 |
Family
ID=17439208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26704086A Pending JPS63121692A (en) | 1986-11-10 | 1986-11-10 | Method for activating base material of ic lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63121692A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0414852A1 (en) * | 1989-03-14 | 1991-03-06 | Motorola, Inc. | Method for improving the adhesion of a plastic encapsulant to copper containing leadframes |
| CN103484909A (en) * | 2013-10-08 | 2014-01-01 | 昆山纯柏精密五金有限公司 | Pretreatment method for iron-based hardware electroplating |
-
1986
- 1986-11-10 JP JP26704086A patent/JPS63121692A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0414852A1 (en) * | 1989-03-14 | 1991-03-06 | Motorola, Inc. | Method for improving the adhesion of a plastic encapsulant to copper containing leadframes |
| EP0414852A4 (en) * | 1989-03-14 | 1993-01-20 | Motorola, Inc. | Method for improving the adhesion of a plastic encapsulant to copper containing leadframes |
| CN103484909A (en) * | 2013-10-08 | 2014-01-01 | 昆山纯柏精密五金有限公司 | Pretreatment method for iron-based hardware electroplating |
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