JPS63119555A - Semiconductor device - Google Patents

Abstract

PURPOSE:To decrease the number of positioning jigs and the number of soldered parts and to make insulating materials thin to the minimum degree as required, by using the insulating materials, which are fixed to a heat radiating metal plate by a flame coating method for electric insulation on between an electric circuit and the heat radiating metal plate. CONSTITUTION:Insulating materials 10a and 10b, which are fixed on a heat radiating metal plate 1 by a flame coating method, are used for electric insulation between an electric circuit and the heat radiating metal plate 1. At first, a positioning jig is placed on the beat radiating metal plate 1, on which the insulating materials 10 are fixed by the flame coating method. Solders 6c and 6d and electrode plates 3a and 3c are placed in the jig. A positioning jig is further placed thereon, and solders 6e and 6f and semiconductor elements 4a and 4b are placed in the jig. Then, the entire body is heated, and the solders 6c-6f are fused. Thereafter the solders are cooled and fixed. Thus even the thin insulating materials 10 become sufficiently rigid mechanically. Therefore, the insulating materials 10 can be made thin to the minimum degree as required.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to electrical insulation between an electric circuit and a heat-radiating metal plate of a semiconductor device, particularly a power semiconductor device.

[Conventional technology]

FIG. 3 is a sectional view showing a conventional semiconductor device of this type. In FIG. 3, 1 is a heat dissipation metal plate, 2a, 2b are insulating plates, 3a, 3b, 3c are electrode plates for configuring an electric circuit, 4a, 4b are semiconductor elements, 5 is an electrode plate 3a, 3b,
3c and a sealing resin for protecting semiconductor elements 4a and 4b, and 6a to 6f are heat dissipating metal plates 1. Insulating plates 2a, 2b,
This is solder for fixing the electrode plates 3a, 3b, 3c+semiconductor elements 4a, 4b.

Next, the assembly order of this semiconductor device will be explained using FIG. 4. First, the positioning jig 7 is placed on the heat dissipation metal plate 1, and the solder 6a is placed therein.

6b and insulating plates 2a and 2b are placed. Next, place the positioning jig 8 on the positioning jig 7, and place the solder 6c in it.
, 6d and electrode plates 3a, 3c are placed, and further a positioning jig 9 is placed thereon, and solders 6e, 6f and semiconductor elements 4a, 4b are placed therein. Next, the whole is heated to melt the solders 6a to 6f, and then cooled and fixed.

[Problem that the invention seeks to solve]

Conventional semiconductor devices are configured as described above, so
The insulating plates 2a, 2b must be positioned with respect to the heat dissipating metal plate 1 using the positioning jig 7, and the insulating plates 2a, 2b
The problem was that it could not be made very thin in order to maintain its mechanical strength.

The present invention has been made in view of these points, and its purpose is to obtain a semiconductor device in which the number of positioning jigs and soldering parts can be reduced, and the thickness of the insulating material can be made as thin as necessary. There is a particular thing.

[Means for solving problems]

In order to achieve such an object, the present invention provides an electric circuit configured using one or more semiconductor elements, a heat dissipating metal plate electrically insulated and fixed to the electric circuit,
In a semiconductor device having a sealing resin for protecting an electric circuit, an insulating material sprayed and fixed to the heat-radiating metal plate is used for electrical insulation between the electric circuit and the heat-radiating metal plate.

[Effect]

In the present invention, the number of positioning jigs and soldering locations is reduced, and 1! The edge material can be made as thin as necessary.

〔Example〕

An embodiment of a semiconductor device according to the present invention is shown in FIG.

In FIG. 1, 10 is an insulating material.

In FIG. 1, the same or equivalent parts as in FIG. 3 are given the same reference numerals.

Next, the assembly order will be explained using FIG. 2. First, a heat dissipating metal plate 1 on which an insulating material 10 is fixed by thermal spraying.
Place the positioning jig 8 on top of the solder 5c, 5
d and electrode plates 3a, 3c are placed, and further a positioning jig 9 is placed thereon, and solders 6e, 6f and semiconductor elements 4a, 4b are placed therein. Next, the whole is heated to melt the solders 6C to 6f, and then cooled and fixed.

In the above embodiment, the insulating material 10 is fixed to two places on the heat dissipating metal plate 1, but the insulating material 10 may be fixed to one place or three or more places. Further, in the above embodiment, a case is shown in which two semiconductor elements 4a and 4b are used, but any other number may be used.

Moreover, the electric circuit shown in the above embodiment can have any configuration.

〔Effect of the invention〕

As explained above, the present invention uses a heat dissipating metal plate to which an insulating material is fixed by thermal spraying, so that even a thin insulating material can have sufficient mechanical strength. This has the effect of being able to be made thinner, and this also has the effect of eliminating the need for conventional soldering and positioning jigs between the insulating plate and the heat dissipating metal plate.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram showing an embodiment of a semiconductor device according to the present invention, FIG. 2 is an assembly state diagram for explaining the assembly order of the device in FIG. 1, and FIG. 3 is a diagram showing a conventional semiconductor device. The configuration diagram and FIG. 4 are assembly state diagrams for explaining the assembly order of the device of FIG. 3. ■... Heat radiation metal plate, 3a, 3b, 3c... Electrode plate,
4a, 4b... Semiconductor element, 5... Sealing resin, 6C
~6r...Solder, 10...Insulating material.

Claims (1)

[Claims] A semiconductor comprising an electric circuit configured using a single or multiple semiconductor elements, a heat dissipating metal plate electrically insulated and fixed to the electric circuit, and a sealing resin for protecting the electric circuit. 1. A semiconductor device, wherein an insulating material fixed to the heat-radiating metal plate by thermal spraying is used for electrically insulating the electric circuit and the heat-radiating metal plate.