JPS63119554A - パツケ−ジの放熱構造 - Google Patents

パツケ−ジの放熱構造

Info

Publication number
JPS63119554A
JPS63119554A JP61265195A JP26519586A JPS63119554A JP S63119554 A JPS63119554 A JP S63119554A JP 61265195 A JP61265195 A JP 61265195A JP 26519586 A JP26519586 A JP 26519586A JP S63119554 A JPS63119554 A JP S63119554A
Authority
JP
Japan
Prior art keywords
circuit board
heat radiating
heat dissipation
radiating block
compound layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61265195A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0573266B2 (enrdf_load_stackoverflow
Inventor
Yukio Yamaguchi
幸雄 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61265195A priority Critical patent/JPS63119554A/ja
Priority to DE8787301651T priority patent/DE3766384D1/de
Priority to US07/018,408 priority patent/US4781244A/en
Priority to EP87301651A priority patent/EP0236065B1/en
Publication of JPS63119554A publication Critical patent/JPS63119554A/ja
Publication of JPH0573266B2 publication Critical patent/JPH0573266B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP61265195A 1986-02-25 1986-11-07 パツケ−ジの放熱構造 Granted JPS63119554A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP61265195A JPS63119554A (ja) 1986-11-07 1986-11-07 パツケ−ジの放熱構造
DE8787301651T DE3766384D1 (de) 1986-02-25 1987-02-25 Fluessigkeitskuehlungssystem fuer integrierte schaltungschips.
US07/018,408 US4781244A (en) 1986-02-25 1987-02-25 Liquid cooling system for integrated circuit chips
EP87301651A EP0236065B1 (en) 1986-02-25 1987-02-25 Liquid cooling system for integrated circuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61265195A JPS63119554A (ja) 1986-11-07 1986-11-07 パツケ−ジの放熱構造

Publications (2)

Publication Number Publication Date
JPS63119554A true JPS63119554A (ja) 1988-05-24
JPH0573266B2 JPH0573266B2 (enrdf_load_stackoverflow) 1993-10-14

Family

ID=17413863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61265195A Granted JPS63119554A (ja) 1986-02-25 1986-11-07 パツケ−ジの放熱構造

Country Status (1)

Country Link
JP (1) JPS63119554A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993016882A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
WO1993016883A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
US6025993A (en) * 1992-05-20 2000-02-15 Seiko Epson Corporation Cartridge for electronic devices
KR100421028B1 (ko) * 2002-05-11 2004-03-04 삼성전자주식회사 프린터용 급지 장치
US7804688B2 (en) 1992-05-20 2010-09-28 Seiko Epson Corporation Apparatus including processor

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993016882A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
WO1993016883A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
US5437041A (en) * 1992-02-26 1995-07-25 Seiko Epson Corporation Device and method for exerting force on circuit mounted on board through opening of the board to facilitate the thermal conduction between circuit and housing
US5615085A (en) * 1992-02-26 1997-03-25 Seiko Epson Corporation Temperature control for add-on electronic devices
US7345883B2 (en) 1992-05-20 2008-03-18 Seiko Epson Corporation Processing device
US6404639B1 (en) 1992-05-20 2002-06-11 Seiko Epson Corporation Cartridge for electronic devices
US6515864B2 (en) 1992-05-20 2003-02-04 Seiko Epson Corporation Cartridge for electronic devices
US6608753B2 (en) 1992-05-20 2003-08-19 Seiko Epson Corporation Cartridge for electronic devices
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
US6845014B2 (en) 1992-05-20 2005-01-18 Seiko Epson Corporation Cartridge for electronic devices
US7035108B2 (en) 1992-05-20 2006-04-25 Seiko Epson Corporation Information processing device
US6025993A (en) * 1992-05-20 2000-02-15 Seiko Epson Corporation Cartridge for electronic devices
US7359202B2 (en) 1992-05-20 2008-04-15 Seiko Epson Corporation Printer apparatus
US7583505B2 (en) 1992-05-20 2009-09-01 Seiko Epson Corporation Processor apparatus
US7804688B2 (en) 1992-05-20 2010-09-28 Seiko Epson Corporation Apparatus including processor
KR100421028B1 (ko) * 2002-05-11 2004-03-04 삼성전자주식회사 프린터용 급지 장치

Also Published As

Publication number Publication date
JPH0573266B2 (enrdf_load_stackoverflow) 1993-10-14

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