JPS6311947B2 - - Google Patents
Info
- Publication number
- JPS6311947B2 JPS6311947B2 JP5996581A JP5996581A JPS6311947B2 JP S6311947 B2 JPS6311947 B2 JP S6311947B2 JP 5996581 A JP5996581 A JP 5996581A JP 5996581 A JP5996581 A JP 5996581A JP S6311947 B2 JPS6311947 B2 JP S6311947B2
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- heat
- film
- methacrylate
- during polymerization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010894 electron beam technology Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 18
- 239000002985 plastic film Substances 0.000 claims description 18
- 238000006116 polymerization reaction Methods 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 17
- 229920006255 plastic film Polymers 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 19
- 150000001875 compounds Chemical class 0.000 description 11
- -1 polyethylene Polymers 0.000 description 9
- 238000007639 printing Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000002023 wood Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 239000011120 plywood Substances 0.000 description 5
- 239000004800 polyvinyl chloride Substances 0.000 description 5
- 229920000915 polyvinyl chloride Polymers 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 238000007646 gravure printing Methods 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- 229920006257 Heat-shrinkable film Polymers 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052602 gypsum Inorganic materials 0.000 description 2
- 239000010440 gypsum Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000009816 wet lamination Methods 0.000 description 2
- UUGXDEDGRPYWHG-UHFFFAOYSA-N (dimethylamino)methyl 2-methylprop-2-enoate Chemical compound CN(C)COC(=O)C(C)=C UUGXDEDGRPYWHG-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- KAJBSGLXSREIHP-UHFFFAOYSA-N 2,2-bis[(2-sulfanylacetyl)oxymethyl]butyl 2-sulfanylacetate Chemical compound SCC(=O)OCC(CC)(COC(=O)CS)COC(=O)CS KAJBSGLXSREIHP-UHFFFAOYSA-N 0.000 description 1
- JJBFVQSGPLGDNX-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)COC(=O)C(C)=C JJBFVQSGPLGDNX-UHFFFAOYSA-N 0.000 description 1
- KGPXEVIKDFHEEZ-UHFFFAOYSA-N 2-(dibenzylamino)ethyl prop-2-enoate Chemical compound C=1C=CC=CC=1CN(CCOC(=O)C=C)CC1=CC=CC=C1 KGPXEVIKDFHEEZ-UHFFFAOYSA-N 0.000 description 1
- DRHKEFCJMRVURM-UHFFFAOYSA-N 2-(diethylamino)propyl prop-2-enoate Chemical compound CCN(CC)C(C)COC(=O)C=C DRHKEFCJMRVURM-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- NIAGUSHJWAMKBZ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound CC(=C)C(O)=O.NC1=NC(N)=NC(N)=N1 NIAGUSHJWAMKBZ-UHFFFAOYSA-N 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- GAKWESOCALHOKH-UHFFFAOYSA-N 4-methoxybutyl prop-2-enoate Chemical compound COCCCCOC(=O)C=C GAKWESOCALHOKH-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- KYLIZBIRMBGUOP-UHFFFAOYSA-N Anetholtrithion Chemical group C1=CC(OC)=CC=C1C1=CC(=S)SS1 KYLIZBIRMBGUOP-UHFFFAOYSA-N 0.000 description 1
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000896 Ethulose Chemical class 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical class CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000001859 Ethyl hydroxyethyl cellulose Chemical class 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 240000007049 Juglans regia Species 0.000 description 1
- 235000009496 Juglans regia Nutrition 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 244000086363 Pterocarpus indicus Species 0.000 description 1
- 235000009984 Pterocarpus indicus Nutrition 0.000 description 1
- 240000002871 Tectona grandis Species 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- RUDUCNPHDIMQCY-UHFFFAOYSA-N [3-(2-sulfanylacetyl)oxy-2,2-bis[(2-sulfanylacetyl)oxymethyl]propyl] 2-sulfanylacetate Chemical compound SCC(=O)OCC(COC(=O)CS)(COC(=O)CS)COC(=O)CS RUDUCNPHDIMQCY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000001913 cellulose Chemical class 0.000 description 1
- 229920002678 cellulose Chemical class 0.000 description 1
- 235000010980 cellulose Nutrition 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- MHCLJIVVJQQNKQ-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O MHCLJIVVJQQNKQ-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 235000019326 ethyl hydroxyethyl cellulose Nutrition 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012939 laminating adhesive Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- RRIRDEGJVLRWPO-UHFFFAOYSA-N methyl 2-methylprop-2-eneperoxoate 2-methylprop-2-enoic acid Chemical class CC(=C)C(=O)O.CC(=C)C(=O)OOC RRIRDEGJVLRWPO-UHFFFAOYSA-N 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000120 polyethyl acrylate Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 235000020234 walnut Nutrition 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
本発明は凹部を有する化粧材の製造法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a decorative material having recesses.
工業的に化粧材を製造するには、合板、石こう
ボード、鉄板、バルブセメント板等の基材に写真
製版等の方法により天然の岩石や木目、人工の織
物等の模様或いは抽象模様を模した印刷版を用い
て印刷した化粧シートを貼着するか、若しくは直
接基材に印刷して製造する方法が一般的である。 To manufacture decorative materials industrially, patterns of natural rock, wood grain, artificial textiles, etc. or abstract patterns are imitated on base materials such as plywood, gypsum board, iron plates, valve cement boards, etc. using methods such as photolithography. A common method for manufacturing is to attach a decorative sheet printed using a printing plate or to print directly onto a base material.
かかる化粧材においては前記したように写真製
版の技術を用いるときは単に模様、色彩の観点で
見れば、本物と見間違うだけの化粧材を得ること
は容易であるが、表面の凹凸感および触感、光の
反射の度合、深み等を単なる印刷技術のみで再現
するのはむずかしい。 For such decorative materials, when using photolithographic technology as described above, it is easy to obtain decorative materials that can be mistaken for the real thing from the perspective of just patterns and colors, but the texture and texture of the surface It is difficult to reproduce the degree of light reflection, depth, etc. using mere printing technology.
本発明と同一の出願人は先に、熱収縮性プラス
チツクフイルムに感熱性模様を設けた後、熱線を
照射することにより、該感熱性模様に相当する部
分のプラスチツクフイルムが溶融し開孔するか或
いは凹みを生じる現象を利用した化粧材の製造法
を発明したが、かかる製造法は凹部を有する化粧
材を工業的に製造することができるものの、凹部
の色彩が黒色に限定され、その他の色ではほとん
ど凹みが生じないか、或いは僅かな凹みしか生じ
ないものであり、このため通常天然物においても
暗色調に仕上げることの多いウオールナツトやロ
ーズウツドなどの木目を疑似的に再現する際には
適しているが、チークではやゝ不適であり、白木
や木目以外の淡色模様については不適であり、そ
の用途範囲が制限されるという欠点を有してい
る。 The same applicant as the present invention first provided a heat-sensitive pattern on a heat-shrinkable plastic film, and then irradiated it with heat rays to melt the plastic film in the portion corresponding to the heat-sensitive pattern and form holes. Alternatively, they invented a method for manufacturing decorative materials that utilizes the phenomenon of creating dents, but although this manufacturing method allows for the industrial production of decorative materials with recesses, the color of the recesses is limited to black, and other colors cannot be produced. It has almost no dents, or only slight dents, so it is suitable for reproducing the simulated grain of wood such as walnut and rosewood, which are usually finished in dark tones even in natural products. However, it is somewhat unsuitable for teak, unsuitable for plain wood and light-colored patterns other than wood grain, and has the disadvantage that its range of applications is limited.
本発明者は、以上のような欠点に鑑み研究を重
ねた結果、熱収縮性プラスチツクフイルムに重合
時に熱を発する電子線硬化性組成物からなる模様
を設けて電子線を照射すると、前記の重合時に熱
を発する電子線硬化性組成物からなる模様におい
て電子線硬化性組成物が重合する際の発熱により
隣接する熱収縮性プラスチツクフイルムが溶融・
軟化・収縮し、凹部を生じる現象を見出し、該現
象に基づいて本発明を完成させたものである。 As a result of repeated research in view of the above-mentioned drawbacks, the present inventor found that when a heat-shrinkable plastic film is provided with a pattern made of an electron beam curable composition that emits heat during polymerization and irradiated with an electron beam, the above-mentioned polymerization occurs. In a pattern made of an electron beam curable composition that sometimes emits heat, the heat generated when the electron beam curable composition polymerizes causes the adjacent heat-shrinkable plastic film to melt.
The present invention was completed based on the discovery of a phenomenon in which the material softens and contracts, resulting in concave portions.
以下に本発明について詳細に説明する。 The present invention will be explained in detail below.
本発明における熱収縮性プラスチツクフイルム
としてはポリエチレン架橋フイルム、改質ポリエ
チレンフイルム、ポリプロピレンフイルム、改質
ポリプロピレンフイルム、ポリスチレンフイル
ム、ポリ塩化ビニルフイルム、ポリメタクリル酸
メチルフイルム、ポリエステルフイルム、ポリ塩
化ビニリデンフイルム、塩酸ゴムフイルム等のフ
イルムのうち成膜時に延伸したもの或いは成膜後
延伸してなるフイルムを用いることができるがこ
れらには限定されない。又延伸されている方向は
縦(成膜方向)、横(成膜方向と直角の方向)の
いずれでもよく、両方でもよい。これら熱収縮性
プラスチツクフイルムの厚みは任意に選択出来る
が、あまり薄いと、厚み以上の凹みの深さは得ら
れないことから好ましくなく、厚過ぎる場合には
経済的な問題があることは勿論、化粧材としての
性能、例えば折り曲げの容易さ、燃焼性及び取扱
い作業適性等が悪化することを考慮すると10μm
〜0.5mmが好ましいと考えられる。 The heat-shrinkable plastic film used in the present invention includes polyethylene crosslinked film, modified polyethylene film, polypropylene film, modified polypropylene film, polystyrene film, polyvinyl chloride film, polymethyl methacrylate film, polyester film, polyvinylidene chloride film, and hydrochloric acid film. A film such as a rubber film that is stretched during film formation or a film that is stretched after film formation can be used, but is not limited thereto. Further, the stretching direction may be either vertical (film forming direction), horizontal (direction perpendicular to the film forming direction), or both. The thickness of these heat-shrinkable plastic films can be selected arbitrarily, but if it is too thin, the depth of the recess cannot be obtained beyond the thickness, which is undesirable, and if it is too thick, there are, of course, economic problems. Considering that the performance as a decorative material, such as ease of bending, flammability, and handling suitability, will deteriorate, the thickness of 10 μm
~0.5 mm is considered preferable.
上記した熱収縮性プラスチツクフイルムは単独
で用いてもよいが、他の適当な基体と複合してあ
つてもよく、かかる基体としては紙又は板紙、合
成紙、プラスチツクフイルム又はシート、布、ゴ
ム、鉄或いはアルミニウム等の金属箔ないし板、
合板、パーチクルボード、石こうボード、パルプ
セメント板などの基体を用いることができ、又、
それらの基体と前記熱収縮性プラスチツクフイル
ムとを複合する方法としては公知の、ドライラミ
ネート、ウエツトラミネート、セミウエツトラミ
ネート、エクストルージヨンコーテイングを利用
したラミネート、熱融着などの方法を使用するこ
とができ、更に2層或いは多層にしてもよい。 The heat-shrinkable plastic film described above may be used alone or in combination with other suitable substrates, such as paper or paperboard, synthetic paper, plastic film or sheet, cloth, rubber, Metal foil or plate of iron or aluminum,
Substrates such as plywood, particle board, gypsum board, pulp cement board, etc. can be used;
Known methods such as dry lamination, wet lamination, semi-wet lamination, lamination using extrusion coating, and heat fusion may be used to combine these substrates and the heat-shrinkable plastic film. Furthermore, it may be made into two layers or multiple layers.
次に本発明における重全時に熱を発する電子線
硬化性組成物からなる模様を形成するための重合
時に熱を発する電子線硬化性組成物としては、重
合時に熱を発する電子線硬化性化合物に染料又は
顔料からなる着色剤、界面活性剤、可塑剤、無機
質充填剤、安定剤等を加えて混練してなるものを
用いることができる。重合時に熱を発する電子線
硬化性化合物としては、分子中にエチレン性不飽
和結合を有するプレポリマーもしくはオリゴマー
例えば不飽和ポリエステル類、ポリエステルアク
リレート、エポキシアクリレート、ウレタンアク
リレート、ポリエーテルアクリレート、ポリオー
ルアクリレート、メラミンアクリレートなどの各
種アクリレート類、ポリエステルメタクリレー
ト、エポキシメタクリレート、ウレタンメタクリ
レート、ポリエーテルメタクリレート、ポリオー
ルメタクリレート、メラミンメタクリレートなど
の各種メタクリレート類などの一種または二種以
上と、分子中にエチレン性不飽和結合を有するモ
ノマー、例えば、スチレン、α−メチルスチレン
等のスチレン系モノマー類;アクリル酸メチル、
アクリル酸2−エチルヘキシル、アクリル酸メト
キシエチル、アクリル酸ブトキシエチル、アクリ
ル酸ブチル、アクリル酸メトキシブチル、アクリ
ル酸フエニル等のアクリル酸エステル類;メタク
リル酸メチル、メタクリル酸エチル、メタクリル
酸プロピル、メタクリル酸メトキシエチル、メタ
クリル酸エトキシチチル、メタクリル酸フエニ
ル、メタクリル酸ラウリル等のメタクリル酸エス
テル類;アクリルアミド、メタクリルアミド等の
不飽和カルボン酸アミド;アクリル酸2−(N、
N−ジメチルアミノ)エチル、メタクリル酸2−
(N、N−ジメチルアミノ)エチル、アクリル酸
2−(N、N−ジベンジルアミノ)エチル、メタ
クリル酸(N、N−ジメチルアミノ)メチル、ア
クリル酸2−(N、N−ジエチルアミノ)プロピ
ル等の不飽和酸の置換アミノアルコールエステル
類;エチレングリコールジアクリレート、プロピ
レングリコールジアクリレート、ネオペンチルグ
リコールジアクリレート、1,6−ヘキサンジオ
ールジアクリレート、ジエチレングリコールジア
クリレート、トリエチレングリコールジアクリレ
ート、ジプロピレングリコールジアクリレート、
エチレングリコールジメタクリレート、プロピレ
ングリコールジメタクリレート、ジエチレングリ
コールジメタクリレート等の多官能性化合物、及
び/又は分子中に2個以上のチオール基を有する
ポリチオール化合物例えばトリメチロールプロパ
ントリチオグリコレート、トリメチロールプロパ
ントリチオプロピオネート、ペンタエリスリトー
ルテトラチオグリコレートなどを一種又は何種か
混合して用いることが出来る。 Next, in the present invention, the electron beam curable composition that generates heat during polymerization for forming a pattern made of an electron beam curable composition that generates heat during polymerization is an electron beam curable compound that generates heat during polymerization. A material obtained by kneading a coloring agent such as a dye or a pigment, a surfactant, a plasticizer, an inorganic filler, a stabilizer, etc. can be used. Examples of electron beam-curable compounds that emit heat during polymerization include prepolymers or oligomers having ethylenically unsaturated bonds in the molecule, such as unsaturated polyesters, polyester acrylates, epoxy acrylates, urethane acrylates, polyether acrylates, polyol acrylates, and melamine. One or more of various acrylates such as acrylate, various methacrylates such as polyester methacrylate, epoxy methacrylate, urethane methacrylate, polyether methacrylate, polyol methacrylate, and melamine methacrylate, and a monomer having an ethylenically unsaturated bond in the molecule. , for example, styrenic monomers such as styrene and α-methylstyrene; methyl acrylate,
Acrylic acid esters such as 2-ethylhexyl acrylate, methoxyethyl acrylate, butoxyethyl acrylate, butyl acrylate, methoxybutyl acrylate, phenyl acrylate; methyl methacrylate, ethyl methacrylate, propyl methacrylate, methoxy methacrylate Methacrylic acid esters such as ethyl, ethoxytityl methacrylate, phenyl methacrylate, lauryl methacrylate; unsaturated carboxylic acid amides such as acrylamide and methacrylamide; acrylic acid 2-(N,
N-dimethylamino)ethyl, methacrylic acid 2-
(N,N-dimethylamino)ethyl, 2-(N,N-dibenzylamino)ethyl acrylate, (N,N-dimethylamino)methyl methacrylate, 2-(N,N-diethylamino)propyl acrylate, etc. Substituted amino alcohol esters of unsaturated acids of acrylate,
Polyfunctional compounds such as ethylene glycol dimethacrylate, propylene glycol dimethacrylate, diethylene glycol dimethacrylate, and/or polythiol compounds having two or more thiol groups in the molecule, such as trimethylolpropane trithioglycolate, trimethylolpropane trithio Propionate, pentaerythritol tetrathioglycolate, etc. can be used alone or in combination.
又、前記した重合時に熱を発する電子線硬化性
化合物は通常、印刷適性が必ずしも良好でないの
で、そのような場合には、重合時に熱を発する電
子線硬化性化合物に可溶な化合物を添加すること
も差支えなく、かかる化合物としては、エチルセ
ルロース、エチルヒドロキシエチルセルロース、
セルロースアセテートプロピオネート、酢酸セル
ロース等のセルロース誘導体、ポリスチレン、ポ
リαメチルスチレンなどのスチレン樹脂及びスチ
レン共重合樹脂、ポリメタクリル酸メチル、ポリ
メタクリル酸エチル、ポリアクリル酸エチル、ポ
リアクリル酸ブチルなどの、アクリル又はメタク
リル樹脂の単独又は共重合樹脂、ロジン、ロジン
変性マレイン酸樹脂、ロジン変性フエノール樹
脂、重合ロジンなどのロジンエステル樹脂、ポリ
酢酸ビニル樹脂、クマロン樹脂、ビニルトルエン
樹脂、塩化ビニル樹脂、ポリエステル樹脂、ポリ
ウレタン樹脂、ブチラール樹脂、更にはこれらの
ものを何種類か混合したもの等の中から適宜選択
して用いるとよい。 Furthermore, since the above-mentioned electron beam curable compounds that emit heat during polymerization usually do not necessarily have good printability, in such cases, a soluble compound is added to the electron beam curable compounds that emit heat during polymerization. Such compounds may include ethylcellulose, ethylhydroxyethylcellulose,
Cellulose derivatives such as cellulose acetate propionate and cellulose acetate, styrene resins and styrene copolymer resins such as polystyrene and polyα-methylstyrene, polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polybutyl acrylate, etc. , acrylic or methacrylic resin alone or copolymer resin, rosin, rosin-modified maleic acid resin, rosin-modified phenolic resin, rosin ester resin such as polymerized rosin, polyvinyl acetate resin, coumaron resin, vinyl toluene resin, vinyl chloride resin, polyester It is preferable to appropriately select and use resins, polyurethane resins, butyral resins, and mixtures of several types of these resins.
上記した重合時に熱を発する電子線硬化性組成
物を用いて、前記の熱収縮性プラスチツクフイル
ムに模様を設ける方法としては、公知の印刷方法
であるグラビア印刷法、オフセツトグラビア印刷
法、オフセツト印刷法、スクリーン印刷法、凸版
印刷法等が使用できる。 Methods of forming patterns on the heat-shrinkable plastic film using the electron beam curable composition that generates heat during polymerization include known printing methods such as gravure printing, offset gravure printing, and offset printing. method, screen printing method, letterpress printing method, etc. can be used.
又、上記の重合時に熱を発する電子線硬化性組
成物からなる模様のほかに通常のインキ組成物か
らなる模様を設けてもよく、この場合に使用され
る通常のインキ組成物とは、公知のビヒクルとし
て前記の重合時に熱を発する電子線硬化性化合物
に可溶な化合物として列記したもののなかから適
宜選択して用い、これらのビヒクルに染料又は顔
料からなる着色剤、界面活性剤、可塑剤、無機質
充填剤、安定剤、溶剤等を適宜混練してなるもの
を用いればよく、又、上記した通常のインキ組成
物からなる模様を熱収縮性プラスチツクフイルム
に印刷する方法としては、前記した重合時に熱を
発する電子線硬化性組成物からなる模様を熱収縮
性プラスチツクフイルムに設ける方法と同様の方
法を用いることができる。 Furthermore, in addition to the above pattern made of an electron beam curable composition that generates heat during polymerization, a pattern made of a normal ink composition may be provided. As the vehicle, the compounds listed above as soluble in the electron beam curable compound that generates heat during polymerization are appropriately selected and used. , an inorganic filler, a stabilizer, a solvent, etc. may be appropriately kneaded.Also, as a method for printing a pattern made of the above-mentioned ordinary ink composition on a heat-shrinkable plastic film, the above-mentioned polymerization method can be used. A method similar to the method used to provide a heat-shrinkable plastic film with a pattern made of an electron beam curable composition that sometimes generates heat can be used.
なお、重合時に熱を発する電子線硬化性組成物
からなる模様および通常のインキからなる模様を
熱収縮性プラスチツクフイルムに設ける際に設け
る順序としては、いずれの模様を先に設けてもよ
く、又、これらの模様を熱収縮性フイルムの同一
面に印刷しても表裏に分けてもよい。 Note that when providing a pattern made of an electron beam curable composition that emits heat during polymerization and a pattern made of ordinary ink on a heat-shrinkable plastic film, either pattern may be provided first, or These patterns may be printed on the same side of the heat-shrinkable film or may be printed on the front and back sides.
更に又、前記したように熱収縮性フイルムを前
記した他の適当な基体と複合して用いる際には、
重合時に熱を発する電子線硬化性組成物からなる
模様および通常のインキからなる模様のいずれか
一方又は両方を、予め前記した他の基体に設けて
から模様の上に熱収縮性フイルムを密着させても
差支えない。 Furthermore, as mentioned above, when using the heat-shrinkable film in combination with the other suitable substrate mentioned above,
Either or both of a pattern made of an electron beam curable composition that emits heat during polymerization and a pattern made of ordinary ink is provided on the other substrate described above in advance, and then a heat-shrinkable film is closely attached onto the pattern. There is no problem.
上記のようにして熱収縮性プラスチツクフイル
ムに重合時に熱を発する電子線硬化性組成物から
なる模様を設けて印刷物を作製した後、該印刷物
に電子線を照射するが、このときに用いる電子線
としては、コツクロフトワルトン型、バンデグラ
フ型、共振変圧器型、絶縁コア変圧器型、直線
型、ダイナミトロン型、高周波型等の各種電子線
加速機から放出され、50〜1000KeV、好ましく
は100〜300KeVの範囲のエネルギーを持つ電子
線が用いられる。印刷紙を連続的に走行させつ
つ、通常はリニアフイラメントから連続したカー
テン状の電子線を照射すればよく、このようにし
て電子線を照射することにより、印刷物上の重合
時に熱を発生する電子線硬化性組成物からなる模
様中の重合時に熱を発する電子線硬化性化合物を
重合硬化させ、その際に発する熱により該模様に
隣接せる部分の前記熱収縮性プラスチツクフイル
ムが溶融・軟化・収縮して凹部を生じる。なお電
子線照射は前記印刷物の基材が熱収縮性プラスチ
ツクフイルム単独であるときはそのままで行なつ
ても、更に前記したように他の基体と複合すると
きは複合する前に行なつても、又、複合した後に
行なつても、いずれの方法でもよく、更に又、前
記のいずれかの方法により照射した後、別の基体
と複合することも差支えなく、このような基体と
しては、前記した基体のうちから再び適宜選択し
て用いることが出来る。 After producing a printed matter by providing a heat-shrinkable plastic film with a pattern made of an electron beam curable composition that emits heat during polymerization as described above, the printed matter is irradiated with an electron beam. It is emitted from various electron beam accelerators such as Kotscroft-Walton type, Van de Graaff type, resonant transformer type, insulated core transformer type, linear type, dynamitron type, and high frequency type, and is 50 to 1000 KeV, preferably 100 to An electron beam with an energy in the range of 300 KeV is used. While the printing paper is running continuously, it is usually sufficient to irradiate a continuous curtain-shaped electron beam from a linear filament. By irradiating the electron beam in this way, the electrons that generate heat during polymerization on the printed matter An electron beam curable compound that emits heat during polymerization in a pattern made of a radiation curable composition is polymerized and cured, and the heat generated at that time melts, softens, and shrinks the heat-shrinkable plastic film in the portion adjacent to the pattern. and create a recess. Incidentally, when the base material of the printed matter is a heat-shrinkable plastic film alone, the electron beam irradiation can be carried out as it is, or when it is composited with another base material as described above, it can be performed before the composite. In addition, any method may be used to carry out the irradiation after compositing, and furthermore, it may be irradiated by any of the above methods and then compositing with another substrate. It is possible to use an appropriate selection from among the substrates.
又、通常、化粧材の仕上げの目的で表面に保護
層を設けることが行なわれているが、本発明にお
いてもそのような保護層を設けてもよく、合成樹
脂等を適宜溶剤に希釈したもの等を表面に塗布す
るなどの方法をとるか、或いは電子線硬化性組成
物からなる塗料を用いて塗装し、電子線照射によ
り硬化させてもよい。 Further, although a protective layer is usually provided on the surface of decorative materials for the purpose of finishing, such a protective layer may also be provided in the present invention, and synthetic resin etc. diluted with an appropriate solvent may be used. Alternatively, a coating material made of an electron beam curable composition may be used and cured by electron beam irradiation.
本発明の凹部を有する化粧材の製造法によれ
ば、印刷と同調した凹部を容易に付与することが
でき、しかも熱線におけるごとく凹部の色彩が黒
色に限定されることなく自由に選択できる利点を
有し、あらゆる木目に同調した凹部が形成できる
ことは勿論、木目以外の模様、特に淡色の模様に
ついても印刷に同調した凹部を形成することがで
き、本発明による凹部を有する化粧材は壁面材、
床材、天井材等の建材用途、家具・TVキヤビネ
ツト等の表面化粧用途、包装材料、雑貨等の用途
に供することができる。 According to the method for manufacturing a decorative material having recesses of the present invention, recesses that are in sync with printing can be easily provided, and the color of the recesses is not limited to black as in the case of heat rays, but can be freely selected. Of course, it is possible to form recesses that match the printing of any type of wood grain, and it is also possible to form recesses that match the printing of patterns other than wood grain, especially light-colored patterns.
It can be used for building materials such as flooring and ceiling materials, surface decoration for furniture and TV cabinets, packaging materials, miscellaneous goods, etc.
以下、本発明について実施例を用いて更に詳し
く説明する。 Hereinafter, the present invention will be explained in more detail using Examples.
実施例 1
厚み50μm半硬質透明な熱収縮性ポリ塩化ビニ
ルフイルムに塩化ビニル/酢酸ビニル共重合樹脂
をバインダーとするグラビアインキの各色を用
い、グラビア印刷法にてオーク(樫)の木目模様
を印刷した後、該木目模様に同調して導管部の模
様を下記白色インキを用いグラビア印刷法にて印
刷した。Example 1 Oak wood grain pattern was printed on a semi-rigid transparent heat-shrinkable polyvinyl chloride film with a thickness of 50 μm using the gravure printing method using each color of gravure ink containing vinyl chloride/vinyl acetate copolymer resin as a binder. After that, a pattern of the conduit portion was printed using the following white ink using a gravure printing method in synchronization with the wood grain pattern.
1,6−ヘキサンジオールジアクリレート
100重量部
ポリ酢酸ビニル(積水化学製エスニールC−2)
20 〃
酸化チタン 30 〃
しかる後、印刷機の乾燥ゾーンに設けられたカ
ーテン状電子線を発生する電子線源により、O2
濃度300PPm以下の窒素気流中で加速電圧
150KV、照射電流10mA、照射線量10Mradの電
子線を照射したところ、導管部が凹んだ化粧シー
トを得、更にこの化粧シートを塩ビ/アクリル系
エマルジヨン型接着剤を用いて合板に貼着し、化
粧板を得た。1,6-hexanediol diacrylate
100 parts by weight polyvinyl acetate (Sekisui Chemical Ethnyl C-2)
20 〃 Titanium oxide 30 〃 Thereafter, O 2
Accelerating voltage in a nitrogen stream with a concentration of 300PPm or less
When irradiated with an electron beam of 150 KV, irradiation current of 10 mA, and irradiation dose of 10 Mrad, a decorative sheet with conduit portions was obtained. This decorative sheet was then adhered to plywood using a PVC/acrylic emulsion type adhesive to create a decorative sheet. Got the board.
実施例 2
実施例1で用いたのと同様なフイルム、インキ
を用いフイルムの裏面にに印刷した後、厚み
100μmのオーク(樫)木肌色の着色半硬質ポリ
塩化ビニルシートとウレタン系ドライラミネート
用接着剤を用いて貼り合わせ養生した後、実施例
1と同一条件で電子線をフイルム側から照射し、
導管部の凹んだシートを得、実施例1と同様に合
板に貼着し、化粧板を得た。Example 2 After printing on the back side of the film using the same film and ink as used in Example 1, the thickness was
After bonding and curing using a 100 μm oak skin-colored colored semi-rigid polyvinyl chloride sheet and a urethane dry laminating adhesive, an electron beam was irradiated from the film side under the same conditions as in Example 1.
A sheet with a recessed conduit portion was obtained and adhered to plywood in the same manner as in Example 1 to obtain a decorative board.
実施例 3
実施例1で用いたのと同じフイルムを30g/m2
の薄葉紙に塩ビ/アクリル系エマルジヨンにより
ウエツトラミネートしてなる複合シートに以下実
施例1と同様にして導管部が凹んだ化粧シートを
得、実施例1と同様に合板に貼着し、化粧板を得
た。Example 3 The same film used in Example 1 was used at 30 g/m 2
A composite sheet made by wet-laminating thin paper with PVC/acrylic emulsion was used in the same manner as in Example 1 to obtain a decorative sheet with recessed conduit portions, and was attached to plywood in the same manner as in Example 1 to form a decorative sheet. I got it.
Claims (1)
重合時に熱を発する電子線硬化性組成物からなる
模様を設け印刷物を作製する工程と、該印刷物に
電子線を照射する工程とからなる凹部を有する化
粧材の製造法。1. A decorative material having recesses, which comprises at least the steps of preparing a heat-shrinkable plastic film with a pattern made of an electron beam curable composition that emits heat during polymerization to produce a printed matter, and irradiating the printed matter with an electron beam. manufacturing method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5996581A JPS57174209A (en) | 1981-04-21 | 1981-04-21 | Production of decorative sheet having recessed part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5996581A JPS57174209A (en) | 1981-04-21 | 1981-04-21 | Production of decorative sheet having recessed part |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57174209A JPS57174209A (en) | 1982-10-26 |
JPS6311947B2 true JPS6311947B2 (en) | 1988-03-16 |
Family
ID=13128384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5996581A Granted JPS57174209A (en) | 1981-04-21 | 1981-04-21 | Production of decorative sheet having recessed part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57174209A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01257537A (en) * | 1988-04-08 | 1989-10-13 | Hitachi Ltd | Sleeve inner face grooving machine for fluid bearing |
US5407708B1 (en) * | 1994-01-27 | 1997-04-08 | Grace W R & Co | Method and apparatus for applying radiation curable inks in a flexographic printing system |
-
1981
- 1981-04-21 JP JP5996581A patent/JPS57174209A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57174209A (en) | 1982-10-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4268261B2 (en) | Cosmetic material and method for producing the same | |
JP4858053B2 (en) | Decorative sheet | |
JPH11333985A (en) | Warpage preventing decorative material | |
JP4289527B2 (en) | Cosmetic material | |
JPS6311947B2 (en) | ||
JP2008087155A (en) | Decorative sheet | |
JP3016034B2 (en) | Cosmetic material sheet and manufacturing method thereof | |
JP4440431B2 (en) | Cosmetic material | |
JP2893770B2 (en) | Manufacturing method of decorative sheet | |
JP2006123543A (en) | Decorative sheet | |
JP2001199028A (en) | Decorative material | |
JP2000351178A (en) | Decorative material | |
JP3201775B2 (en) | Manufacturing method of decorative sheet | |
JP4447092B2 (en) | Cosmetic sheet and cosmetic material | |
JPH0479835B2 (en) | ||
JP2967148B2 (en) | Cosmetic material sheet and manufacturing method thereof | |
JPH02108539A (en) | Decorative material | |
JPH068391A (en) | Decorative sheet and production thereof | |
JPH1128799A (en) | Decorative sheet and its manufacture | |
JP3024182B2 (en) | Decorative sheet and method for producing the same | |
JP2883989B2 (en) | Cosmetic material manufacturing method | |
JPS644832B2 (en) | ||
JPH0141505B2 (en) | ||
JP5218360B2 (en) | Manufacturing method of cosmetic material | |
JPH0155991B2 (en) |