JPS63118234U - - Google Patents

Info

Publication number
JPS63118234U
JPS63118234U JP1987008401U JP840187U JPS63118234U JP S63118234 U JPS63118234 U JP S63118234U JP 1987008401 U JP1987008401 U JP 1987008401U JP 840187 U JP840187 U JP 840187U JP S63118234 U JPS63118234 U JP S63118234U
Authority
JP
Japan
Prior art keywords
pad
pellet
semiconductor device
lead terminal
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987008401U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0543478Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987008401U priority Critical patent/JPH0543478Y2/ja
Publication of JPS63118234U publication Critical patent/JPS63118234U/ja
Application granted granted Critical
Publication of JPH0543478Y2 publication Critical patent/JPH0543478Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP1987008401U 1987-01-22 1987-01-22 Expired - Lifetime JPH0543478Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987008401U JPH0543478Y2 (https=) 1987-01-22 1987-01-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987008401U JPH0543478Y2 (https=) 1987-01-22 1987-01-22

Publications (2)

Publication Number Publication Date
JPS63118234U true JPS63118234U (https=) 1988-07-30
JPH0543478Y2 JPH0543478Y2 (https=) 1993-11-02

Family

ID=30792742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987008401U Expired - Lifetime JPH0543478Y2 (https=) 1987-01-22 1987-01-22

Country Status (1)

Country Link
JP (1) JPH0543478Y2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013541308A (ja) * 2010-10-29 2013-11-07 クゥアルコム・インコーポレイテッド パッケージインダクタンス補償型調整可能キャパシタ回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013541308A (ja) * 2010-10-29 2013-11-07 クゥアルコム・インコーポレイテッド パッケージインダクタンス補償型調整可能キャパシタ回路

Also Published As

Publication number Publication date
JPH0543478Y2 (https=) 1993-11-02

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