JPS6311739Y2 - - Google Patents
Info
- Publication number
- JPS6311739Y2 JPS6311739Y2 JP16745279U JP16745279U JPS6311739Y2 JP S6311739 Y2 JPS6311739 Y2 JP S6311739Y2 JP 16745279 U JP16745279 U JP 16745279U JP 16745279 U JP16745279 U JP 16745279U JP S6311739 Y2 JPS6311739 Y2 JP S6311739Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- transistor
- board
- printed
- transistors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16745279U JPS6311739Y2 (fr) | 1979-12-03 | 1979-12-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16745279U JPS6311739Y2 (fr) | 1979-12-03 | 1979-12-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5684358U JPS5684358U (fr) | 1981-07-07 |
| JPS6311739Y2 true JPS6311739Y2 (fr) | 1988-04-05 |
Family
ID=29678309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16745279U Expired JPS6311739Y2 (fr) | 1979-12-03 | 1979-12-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6311739Y2 (fr) |
-
1979
- 1979-12-03 JP JP16745279U patent/JPS6311739Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5684358U (fr) | 1981-07-07 |
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