JPS63115227U - - Google Patents
Info
- Publication number
- JPS63115227U JPS63115227U JP695287U JP695287U JPS63115227U JP S63115227 U JPS63115227 U JP S63115227U JP 695287 U JP695287 U JP 695287U JP 695287 U JP695287 U JP 695287U JP S63115227 U JPS63115227 U JP S63115227U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- microwave integrated
- package
- terminal member
- base body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
Description
第１図は本考案にかかるセラミツク端子部材の
構成の一例を示す斜視図、第２図は本考案マイク
ロ波集積回路用パツケージの構成の一例を示す斜
視図、第３Ａ図および第３Ｂ図は従来のマイクロ
波集積回路用パツケージの構成の２例をそれぞれ
示す斜視図である。
１，３１……金属基体、３１Ａ……段差部、２
，３２……金属枠体、２Ａ，３２Ａ，３２Ｂ……
枠壁、３……マイクロ波集積回路増幅器、４……
高周波入出力端子、４Ａ，４Ｂ，５Ａ……マイク
ロストリツプ基板、５……バイアス電圧供給用端
子、６……（線路または表面）導体、７……絶縁
体、８Ａ……ボンデイングワイヤ、８Ｂ……金リ
ボン、９……蓋部材、１０……ねじ孔、１１……
リード線、２１Ａ，２１Ｂ……セラミツク基板、
５０……セラミツク端子部材。
FIG. 1 is a perspective view showing an example of the structure of a ceramic terminal member according to the present invention, FIG. 2 is a perspective view showing an example of the structure of a microwave integrated circuit package of the present invention, and FIGS. 3A and 3B are conventional FIG. 3 is a perspective view showing two examples of the configuration of a package for a microwave integrated circuit. 1, 31... Metal base, 31A... Step portion, 2
, 32...metal frame, 2A, 32A, 32B...
Frame wall, 3... Microwave integrated circuit amplifier, 4...
High frequency input/output terminal, 4A, 4B, 5A... Microstrip board, 5... Bias voltage supply terminal, 6... (line or surface) conductor, 7... Insulator, 8A... Bonding wire, 8B ... Gold ribbon, 9 ... Lid member, 10 ... Screw hole, 11 ...
Lead wires, 21A, 21B...ceramic substrate,
50... Ceramic terminal member.
Claims (1)
基体上に前記マイクロ波集積回路を取り囲んで設
けられた方形の枠体とを有するマイクロ波集積回
路用パツケージにおいて、 少なくとも１条の導体を表面に配置してなるセ
ラミツク基板の複数個を、その各セラミツク基板
において前記少なくとも１条の導体の両端部が露
出するようにして、複数段に積層して一体化した
セラミツク端子部材を、前記基体および枠体に理
設して、前記マイクロ波集積回路との間の接続を
行うようにしたことを特徴とするマイクロ波集積
回路用パツケージ。 (2) 実用新案登録請求の範囲第１項記載のマイ
クロ波集積回路用パツケージにおいて、 前記端子部材のうち、バイアス電圧供給用の端
子部材を、高周波入出力用の端子部材が配設され
た枠壁と交差する方向の枠壁に配設したことを特
徴とするマイクロ波集積回路用パツケージ。[Claims for Utility Model Registration] (1) In a package for a microwave integrated circuit, which has a base body to which a microwave integrated circuit is attached, and a rectangular frame body provided on the base body to surround the microwave integrated circuit. , a plurality of ceramic substrates having at least one conductor arranged on the surface thereof are stacked and integrated in multiple stages, with both ends of the at least one conductor exposed on each ceramic substrate. 1. A package for a microwave integrated circuit, characterized in that a ceramic terminal member is provided on the base body and the frame body for connection to the microwave integrated circuit. (2) In the package for a microwave integrated circuit according to claim 1 of the utility model registration claim, of the terminal members, a terminal member for bias voltage supply is replaced with a frame in which a terminal member for high frequency input/output is arranged. A package for a microwave integrated circuit characterized by being arranged on a frame wall in a direction intersecting the wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP695287U JPH0744023Y2 (en) | 1987-01-22 | 1987-01-22 | Package for microwave integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP695287U JPH0744023Y2 (en) | 1987-01-22 | 1987-01-22 | Package for microwave integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63115227U true JPS63115227U (en) | 1988-07-25 |
| JPH0744023Y2 JPH0744023Y2 (en) | 1995-10-09 |
Family
ID=30789951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP695287U Expired - Lifetime JPH0744023Y2 (en) | 1987-01-22 | 1987-01-22 | Package for microwave integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744023Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009096542A1 (en) * | 2008-01-30 | 2009-08-06 | Kyocera Corporation | Connection terminal, package using the same and electronic device |
-
1987
- 1987-01-22 JP JP695287U patent/JPH0744023Y2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009096542A1 (en) * | 2008-01-30 | 2009-08-06 | Kyocera Corporation | Connection terminal, package using the same and electronic device |
| JP5383512B2 (en) * | 2008-01-30 | 2014-01-08 | 京セラ株式会社 | Connection terminal, package using the same, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0744023Y2 (en) | 1995-10-09 |
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