JPS63114220A - Chip bonding device - Google Patents

Abstract

PURPOSE:To reduce the time for heating and hardening an adhesive agent after a chip is tentatively fixed on a substrate, by preheating a jig, a substrate, and the adhesive agent with a preheater while a jig is positioned at a chip supply device and chips are supplied on a substrate. CONSTITUTION:The title equipment is provided with the followings. A coater 4 of adhesive agent spreads an adhesive agent on the chip arrangement position of a substrate 8 retained on a jig 2 along a transferring path 1 of the jig 2 which retains the substrate 8 and the chip 15 regulating their positions. A chip supply device 5 supplies a chip 15 at a specified position on the substrate 8. A heating oven 6 heats and hardens the adhesive agent between the substrate 8 and chip 15 whose positions are regulated on the jig 2, and finally fixes the chip 15 on the substrate 8. A preheater 19 preheats the jig 2 positioned at the chip supply equipment 5. When supplying the chip 15 is finished, and the chip 15 and the substrate 8 are into the oven 6 together with the jig 2, in order that the jig 2, the substrate 8, and the adhesive agent are preheated, the heating of the adhesive agent is quickly progressed up to a hardening temperature. Thereby, time necessary for hardening the adhesive agent in the heating oven can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a chip bonding apparatus, and more particularly to a chip bonding apparatus that holds and bonds a substrate and a chip with a jig.

Conventional technology Conventionally, for example, as an apparatus for bonding image sensors arranged in a straight line on a substrate, the substrate to which a chip is to be bonded is configured to be intermittently moved by a transfer device, and is placed on a substrate coated with an adhesive in advance. The chips are supplied from the chip supply unit and temporarily fixed, then the substrate is moved intermittently by the length of the chip to temporarily fix the next chip, this operation is repeated to temporarily fix the chips in a straight line, and then The chip was permanently fixed to the substrate by placing the substrate in a heating furnace and curing the adhesive.

However, the bonding apparatus described above has a problem in that it is difficult to accurately arrange the chips in a straight line. Therefore, in order to solve this problem, the present applicant first developed the tiS4 diagram and! As shown in Figure ll's5, the substrate 41
While supplying the chip 42 onto the top using the suction means 43,
Adjust the position of the supplied chip 12 using the first and f\S2 positioning claws, +4.45, ``-downward stop, and hand force positioning claws t6, 17, etc. We proposed a method for temporarily fixing the material, then curing the adhesive and permanently fixing it.

Problems to be Solved by the Invention In order to perform bonding by adjusting the position of the chip on the substrate as described above, a jig for positioning and holding the substrate and the chip is used, and this jig must be moved intermittently. Apply adhesive to the substrate held by a jig, supply the chip onto it, adjust its position with a positioning claw, and temporarily fix it.
After that, it is best to insert the jig into a heating furnace to harden the adhesive and permanently fix it.

However, since the amount of heat generated by the Imabari bar is large, even if the substrate or chip is heated, the heat escapes to the jig, and it takes time to raise the temperature to the curing temperature of the adhesive.
There is a problem that it takes a lot of time for the adhesive to harden, which reduces productivity.In order to improve productivity, it is necessary to increase the size of the heating furnace to secure heating time, resulting in excessive equipment costs. There was a problem with becoming.

It is also possible to use an ultraviolet curable adhesive instead of a thermosetting adhesive as the adhesive, but since the adhesive between the substrate and the chip cannot be irradiated with ultraviolet rays, it takes time for the reaction to occur. become. In addition, conductive adhesives are often used to prevent the chips from being charged with static electricity, but the current situation is that there are no suitable UV-curable and conductive adhesives.

In view of the above-mentioned conventional problems, the present invention uses a jig to position and hold the chip and the substrate, and shortens the heating and curing time of the adhesive after the chip is supplied onto the substrate and temporarily fixed. The purpose of the present invention is to provide a chip bonding device that can perform the following steps.

Means for Solving the Problems In order to achieve the above object, the chip bonding apparatus according to the present invention is provided with a transfer path for a jig that positions and holds the substrate and the chip, and along this transfer path, the jig is moved along the transfer path. An adhesive applicator applies adhesive to the chip arrangement position of the substrate held on the jig, a chip supply device supplies the chip to a predetermined position on the substrate, and an adhesive is applied between the substrate and the chip whose position is regulated on the jig. A heating furnace is provided to heat and harden the adhesive to permanently fix the chip to the substrate, and a preheater is provided to preheat a jig located in the chip supply device.

According to the above structure of the present invention, while the jig is located in the chip supply device and chips are being supplied to the substrate, the jig, the substrate, and the adhesive are preheated by the preheater. . Therefore, when the chip supply is completed and the chips and substrate are inserted into the heating furnace together with the jig to heat the adhesive, the adhesive can be quickly heated to the curing temperature of the adhesive, and the adhesive in the heating furnace can be heated quickly. Curing time can be shortened. Therefore, the productivity of chip bonding can be improved while using a small heating furnace.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 3.

f:lS1 In the figure, 1 is a transfer path for intermittently transferring a jig 2 that can position and hold a substrate and a chip, and the jig 2 is supplied from one end 1a of this transfer path 1,
The other end 1b is discharged, and the one end 1al is refluxed and used for circulation. Along this transfer path 1, from one end 1a side, a substrate supply device 3, an adhesive coating device 4,
A chip supply device 5, a heating furnace 6, and a substrate take-out device 7 are provided.

The substrate supply device 3 and the adhesive coating device 4 are arranged on both sides of the transfer path 1. The substrate supply device 3 supplies the substrate 8 to a predetermined position of the jig 2, and
The position is regulated by a positioning means provided on the jig 2. Further, the adhesive application device F14 includes a container 9 containing adhesive.
and a transfer device 10 that moves back and forth between the container D'J and the substrate 8. It is configured to be applied on top. As the adhesive, an epoxy adhesive containing paste is used as a thermosetting adhesive having conductivity.

The chip supply device 5 is composed of a jig constituting a part of the transfer path 1, a support section 11, a position adjustment section 12, a chip supply section 13, and a transfer means 1.t. The chip supply unit 13 is configured by placing a tray 16 containing a large number of chips 15 in an array on an X-Y table 17 so that the chips 15 can be sequentially delivered to the transfer means 14. The position regulating section 12 has a chip 15.
is configured to be held by positioning claws for accurate positioning. The jig support section 11 is composed of a movable table 18 that supports the jig supplied along the transfer route 1. It is constructed so that it can be moved intermittently by the length of the chip, and has grooves r & so that its position can also be adjusted in the chip supply direction perpendicular to this. Furthermore, a preheater 19 is disposed on the movable table 18 to preheat the jig 2 and substrate 8 placed and supported thereon, and the jig 2 and substrate 8 are heated to about 150°C ± 10°C. It is configured to be heated. The transfer means 14 is a retractable member extending from the elevating body 20 so as to transfer chips 15 from the chip supply section 13 to the position regulating section 12 and simultaneously from the position regulating section 12 to the jig support section 11. Two chip suction parts 22 are provided on the shaft 21.

The heating furnace 6 is configured to heat the substrate 8 and adhesive on the jig 2 to about 300° C. for 30 seconds while transferring the jig 2. Further, the substrate ejecting device 'a7 is configured to release the substrate 8 held on the jig 2 and take it out.

Next, the structure of the jig JA2 will be explained with reference to FIGS. 2 and 3. The upper surface of the jig main body 23 is configured as a substrate mounting surface, and one side edge of the substrate 8 contacts the negative side of the jig main body 23. A plate 24 is fixed, and a suppression plate 25 is disposed on the other side so as to be movable in the distance direction with respect to the regulating plate 24. This pressing plate 2
5 is urged toward the regulation plate 24 by a tension spring 26, and is configured to regulate the position of the substrate 8 between the regulation plate 24 and the suppression plate 25. Further, a first position regulating claw 27 is disposed on one side of the jig body 23 so as to be rotatable around a horizontal pivot pin 28, and a second position regulating claw 29 is disposed on the pressing plate 25. is arranged to be movable in the distance direction with respect to the first position regulating claw 27, and these first and second position regulating claws 27
．． The chip 15 is positioned between 29 and 29. The first position regulating claw 27 is biased by a compression spring 30 interposed between it and the jig main body 23 so that its tip comes into pressure contact with the upper surface of the substrate 8, and the second position regulating claw 27 is biased toward the first position regulating pawl 27 by a compression spring 31 interposed between it and the suppression plate 25.

In the above configuration, from -Q1a of transfer path 1 to jig 2
When the substrate 8 is supplied, it is first transferred to the substrate supply device 3, where the substrate 8 is supplied onto the jig 2, and its position is regulated between the regulation plate 24 and the suppression plate 25 of the jig 2. Retained. Next, the adhesive coating device 4 applies adhesive to the position where the chip 15 of the base @8 is to be bonded by a transfer method. Next, the jig 2 is placed on the movable table 18 of the jig support section 11 in the chip supply device 5. When the movable table 18 is positioned at a predetermined position, the chip 15 is supplied to one end of the substrate 8, and the position is adjusted and temporarily fixed by the first and second position adjustment claws 27, 29, and then the chip 15 is temporarily fixed. After the movable table 18 moves by the length of one chip, the next chip 15 is supplied and temporarily fixed, and by repeating this operation, a predetermined number of child chips 15 are arranged in a straight line on the board 8 and temporarily fixed. Ru. During this chip supply process, the jig 2 and the substrate 8 are heated by the preheater 19.
The adhesive is preheated to about 150° C. through the wafer and temporarily cured. Next, the jig 2 is inserted into the heating furnace 6 from the jig support 11, and is heated to 300°C while passing through the heating furnace 6.
The adhesive is heated for approximately 30 seconds to fully cure the adhesive and complete chip bonding. Thereafter, the substrate 8 to which the chip 15 has been bonded is taken out by the substrate take-out device 7, and the empty jig 2 is returned to one end 1aj of the transfer path 1.

It should be noted that the present invention is not limited to the above-mentioned embodiment. For example, in the above-mentioned embodiment, the preheating heater 19 is arranged on the movable table 18 of the chip supply device 5, and preheating is performed only in the chip supply process. However, it is also possible to perform preheating from the point at which the substrate supply device 3 or the adhesive coating device 4 is located. Alternatively, a preheating heater may be provided in the jig, and when the jig is set in a chip supply device or the like, the preheating heater may be energized. Moreover, the present invention allows each l! ! ! - Applicable to bonding to i-board.

Effects of the Invention According to the chip bonding apparatus of the present invention, while the chips are being supplied onto the substrate, the jig, the substrate, and the adhesive are preheated by the preheating heater, so that the supply of the chips is completed. When inserting the chip and the substrate together with the jig into the heating furnace and heating the adhesive, the adhesive can be quickly heated to the curing temperature, reducing the curing time of the adhesive in the heating furnace.
I? Can be reduced to L.

Therefore, inexpensive equipment'f! using a small heating furnace! l″C
h. It has the effect of improving the productivity of chip bonding.

[Brief explanation of the drawing]

Figures 1 to 3 show an embodiment of the present invention, with Figure 1 being an overall perspective view, Figure 2 being a perspective view of a jig on a movable table, and P
Figure IIJ3 is a cross-sectional view taken along the line ■--■ in Figure f52, Figure 4 is a perspective view of the conventional example, and Figure 5 is a cross-sectional view taken along the line V--■ in Figure 4. 1...Transfer path 2...Jig 4...Adhesive applicator 5...Chip supply Device 6... Heating furnace 8... Substrate 15... Chip 19... Preheating heater. Toshio Nakao, one idiot Figure 2 Figure 3

Claims (1)

[Claims] Along the transfer path of a jig that positions and holds the substrate and chips, there is an adhesive applicator that applies adhesive to the chip placement position of the substrate held on the jig, and an adhesive applicator that applies adhesive to the chip placement position on the substrate held on the jig. and a heating furnace for heating and curing the adhesive to permanently fix the chip to the substrate, and a preheating heater for preheating a jig located in the chip supplying device. Chip bonding equipment featuring: