JP3232628B2 - Electronic component mounting method - Google Patents
Electronic component mounting methodInfo
- Publication number
- JP3232628B2 JP3232628B2 JP05514992A JP5514992A JP3232628B2 JP 3232628 B2 JP3232628 B2 JP 3232628B2 JP 05514992 A JP05514992 A JP 05514992A JP 5514992 A JP5514992 A JP 5514992A JP 3232628 B2 JP3232628 B2 JP 3232628B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- electronic component
- circuit board
- transferred
- mounting method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Description
【０００１】[0001]
【産業上の利用分野】本発明は、接着剤を用いて回路基
板の所定位置に電子部品を仮固定する工程を有する電子
部品の実装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component having a step of temporarily fixing the electronic component at a predetermined position on a circuit board using an adhesive.
【０００２】[0002]
【従来の技術】従来から、回路基板に電子部品を実装す
る場合、回路基板の接合電極上にはクリーム半田を電子
部品固定位置には接着剤を塗布しておき、所定の位置に
電子部品を搭載し接着剤により仮固定した後、回路基板
をリフロー炉に送り込んでクリーム半田を溶融し、半田
付けしていた。2. Description of the Related Art Conventionally, when an electronic component is mounted on a circuit board, cream solder is applied on a bonding electrode of the circuit board at an electronic component fixing position, and the electronic component is mounted on a predetermined position. After being mounted and temporarily fixed with an adhesive, the circuit board was sent to a reflow furnace to melt the cream solder and solder.
【０００３】図２は従来の電子部品の実装方法に使用す
る接着剤供給装置の斜視図である。図２に示すように、
接着剤供給装置本体（以後本体という）１１に設置され
たＸＹロボット１２にヘッド１３が装着されており、こ
のヘッド１３の先端部に接着剤を充填したバレル１４が
装着されている。このバレル１４に空気を送り込むとバ
レル１４の先端に取り付けたノズル１５から接着剤が押
し出され、搬送コンベア１６によって搬送されてきた基
板１７の所定の位置に接着剤が塗布される。すなわち、
接着剤が塗布される位置はＸＹロボット１２によって決
まり、位置決めされた後ヘッド１３が降下してノズル１
５の先端が回路基板１７に接触する。接触と同時に電気
的に制御された開閉バルブ１８が開いてバレル１４内に
空気を送り込む。接着剤が塗布された後、ヘッド１３は
上昇し、次の位置に移動する。接着剤の塗布状態は、空
気の圧力、開閉バルブ１８の開放時間、ノズル１５の先
端の温度などの微妙な変化で大きな影響を受ける。FIG. 2 is a perspective view of an adhesive supply device used in a conventional electronic component mounting method. As shown in FIG.
A head 13 is mounted on an XY robot 12 installed in an adhesive supply device main body (hereinafter referred to as a main body) 11, and a barrel 14 filled with an adhesive is mounted on the tip of the head 13. When air is sent into the barrel 14, the adhesive is pushed out from a nozzle 15 attached to the tip of the barrel 14, and the adhesive is applied to a predetermined position of the substrate 17 transported by the transport conveyor 16. That is,
The position where the adhesive is applied is determined by the XY robot 12, and after positioning, the head 13 descends and the nozzle 1
5 comes into contact with the circuit board 17. Upon contact, the electrically controlled opening and closing valve 18 opens to pump air into the barrel 14. After the adhesive is applied, the head 13 moves up and moves to the next position. The application state of the adhesive is greatly affected by subtle changes such as the air pressure, the opening time of the on-off valve 18, and the temperature of the tip of the nozzle 15.
【０００４】回路基板の全ての箇所に接着剤を塗布した
後、回路基板を次の電子部品装着工程へ移動し、電子部
品を装着し、接着剤を硬化し、半田付け工程を経て完成
となる。After the adhesive is applied to all parts of the circuit board, the circuit board is moved to the next electronic component mounting step, the electronic components are mounted, the adhesive is cured, and the circuit board is completed through a soldering step. .
【０００５】[0005]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、回路基板に接着剤を塗布する際にヘッド
が高速で上下動、水平移動するためにノズルから吐出し
た接着剤が髭状に所定位置以外の領域以外に塗布された
り、回路基板の電極部に塗布されて半田付け不良を発生
させる等の課題を有していた。また接着剤の糸曵きを改
善するために粘度特性の検討を行っているが、接着剤塗
布タクトの高速化にともない上記の問題点の発生率は増
大する傾向にある。However, in the above-mentioned conventional configuration, when applying the adhesive to the circuit board, the adhesive ejected from the nozzles in the form of a beard is required to move up and down and horizontally at a high speed. There has been a problem that it is applied to an area other than the position, or is applied to an electrode portion of a circuit board to cause poor soldering. Further, the viscosity characteristics are being studied to improve the threading of the adhesive, but the incidence of the above-mentioned problems tends to increase as the tact time of the adhesive application increases.
【０００６】本発明は上記の従来の課題を解決するもの
で、回路基板に接着剤を塗布するときの塗布条件、塗布
タクト等に影響されず、安定した接着剤の供給を行う工
程を有する電子部品の実装方法を提供することを目的と
する。SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and has an electronic step having a step of supplying an adhesive stably without being affected by application conditions, application tact, and the like when applying an adhesive to a circuit board. An object of the present invention is to provide a component mounting method.
【０００７】[0007]
【課題を解決するための手段】回路基板に接着剤を転写
し、かつ実装すべき電子部品に接着剤を塗布し、回路基
板の装着位置に前記電子部品を位置合せした後、前記電
子部品と回路基板とを仮固定し更に前記接着剤を硬化し
て前記電子部品と回路基板とを固定するに際し、前記電
子部品に塗布された接着剤が前記回路基板に転写した接
着剤の反応開始剤を含有する、あるいは前記回路基板に
転写された接着剤が前記電子部品に塗布された接着剤の
反応開始剤を含有する、あるいは両方の反応開始剤を含
有するものである。 Means for Solving the Problems Transferring an adhesive to a circuit board
Adhesive on the electronic components to be mounted and
After aligning the electronic component to the mounting position of the board,
Temporarily fixing the child component and the circuit board, and then curing the adhesive
When fixing the electronic component and the circuit board by
The adhesive applied to the child component is transferred to the circuit board by the adhesive.
Contains a reaction initiator for the adhesive, or to the circuit board
The transferred adhesive is the adhesive of the adhesive applied to the electronic component.
Contains initiator or both initiators
Have
【０００８】[0008]
【作用】この構成によって、回路基板の所定の位置に所
定量の接着剤を正確に塗布することができ、電子部品の
半田付け不良を無くすことができる。According to this configuration, a predetermined amount of adhesive can be accurately applied to a predetermined position of the circuit board, and defective soldering of electronic components can be eliminated.
【０００９】[0009]
【実施例】以下本発明の一実施例における電子部品の実
装方法について、図１（ａ）〜（ｆ）に示すフローチャ
ートを参照しながら説明する。まず図１（ａ）に示すよ
うに、接着剤１を離型シート２の上に均一な薄い膜状に
形成する。離型シート２の上方には支持板３があり、そ
の支持板３には転写ピン４が取り付けられている。この
転写ピン４は回路基板５上の接着剤１の塗布位置および
その数量に対応して取り付けられており、転写ピン４の
径は接着剤１の塗布径の１／２程度が望ましい。なお６
は回路基板５の上に形成された電子部品を接続するため
の電極である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for mounting an electronic component according to an embodiment of the present invention will be described below with reference to the flowcharts shown in FIGS. First, as shown in FIG. 1A, an adhesive 1 is formed on a release sheet 2 into a uniform thin film. A support plate 3 is provided above the release sheet 2, and a transfer pin 4 is attached to the support plate 3. The transfer pins 4 are attached corresponding to the application position and the number of the adhesive 1 on the circuit board 5, and the diameter of the transfer pin 4 is desirably about １ ／ of the application diameter of the adhesive 1. 6
Are electrodes for connecting electronic components formed on the circuit board 5.
【００１０】次に図１（ｂ）に示すように、支持板３が
下降するとともに転写ピン４が離型シート２に当たった
時点で離型シート２も同様に下降する。離型シート２が
予め設定された高さにまで下降した時点で停止させ、支
持板２をさらに押し下げて転写ピン４で離型シート２の
裏面を押す。転写ピン４により押された離型シート２は
変形し、接着剤１が回路基板５に接触する。接着剤１が
回路基板５の表面に粘着した状態で支持板３と離型シー
ト２を上昇させると、図１（ｃ）に示すように接着剤１
の一部は離型シート２から離脱して回路基板５に転写さ
れることになる。２回目以降はその都度離型シート２を
少しずらせることによって、同様にして接着剤１を転写
することができる。なお離型シート２に形成する接着剤
１の膜厚は２０μｍ〜１００μｍが適切であった。Next, as shown in FIG. 1B, at the time when the transfer pins 4 hit the release sheet 2, the release sheet 2 also descends. When the release sheet 2 is lowered to a preset height, the sheet is stopped, the support plate 2 is further pressed down, and the back surface of the release sheet 2 is pressed by the transfer pins 4. The release sheet 2 pressed by the transfer pins 4 is deformed, and the adhesive 1 contacts the circuit board 5. When the support plate 3 and the release sheet 2 are raised in a state where the adhesive 1 is adhered to the surface of the circuit board 5, as shown in FIG.
Is detached from the release sheet 2 and is transferred to the circuit board 5. After the second time, the adhesive 1 can be transferred in the same manner by slightly shifting the release sheet 2 each time. Note that the thickness of the adhesive 1 formed on the release sheet 2 was appropriately 20 μm to 100 μm.
【００１１】次に図１（ｄ）に示すように、接着剤７が
塗布された電子部品９を装着ヘッド８で吸着し、回路基
板５上の装着位置に位置合わせする。次に図１（ｅ）に
示すように、装着ヘッド８を下降させて電子部品９を回
路基板５に仮固定する。次に図１（ｆ）に示すように、
ヒータ１０で加熱し接着剤１および接着剤７を硬化して
回路基板５に電子部品９を固定する。Next, as shown in FIG. 1D, the electronic component 9 to which the adhesive 7 has been applied is sucked by the mounting head 8 and aligned with the mounting position on the circuit board 5. Next, as shown in FIG. 1E, the mounting head 8 is lowered to temporarily fix the electronic component 9 to the circuit board 5. Next, as shown in FIG.
The electronic component 9 is fixed to the circuit board 5 by heating with the heater 10 to cure the adhesive 1 and the adhesive 7.
【００１２】図１のフローチャートでは省略したが、回
路基板５上の電極６には予めクリーム半田が塗布されて
おり、図１（ｆ）の工程を経た回路基板５はリフロー炉
へ送り込まれて電子部品９が半田付けされる。Although not shown in the flowchart of FIG. 1, cream solder is applied to the electrodes 6 on the circuit board 5 in advance, and the circuit board 5 that has undergone the process of FIG. The component 9 is soldered.
【００１３】以上の工程において使用する接着剤として
はエポキシ樹脂またはアクリレート樹脂を主成分とする
接着剤が適しており、回路基板５側と電子部品９側で異
なる接着剤を使用することが望ましい。アクリレート樹
脂接着剤はアクリル基またはメタアクリル基のいずれか
を有する化合物の１種以上からなる樹脂組成物を主成分
とし、その熱反応開始剤としてクメンハイドロパーオキ
サイド、t-ブチルパーオキシベンゾエート、過酸化ベン
ゾイル、過酸化アセチルまたはt-ブチルパーオキシ３・
５トリメチルシクロヘキサン等の有機過酸化物を用い、
この熱反応開始剤をエポキシ樹脂接着剤に分散してお
く。一方エポキシ樹脂接着剤はビスフェノールＡ、ビス
フェノールＦまたはノボラック系を主骨格とする２官能
または３官能の樹脂組成物を主成分とし、その熱反応開
始剤としてはイミダゾール化合物またはアミン化合物を
用い、この熱反応開始剤をアクリレート樹脂接着剤に分
散しておく。またそれぞれの接着剤には炭酸カルシウム
やケイ酸化合物等の無機フィラーを混入している。この
ように一方の樹脂接着剤に他方の樹脂接着剤用熱反応開
始剤を混入しておくことにより、両方の樹脂接着剤が混
ざり合ってはじめて熱反応が開始されることになり、樹
脂接着剤のポットライフが長くなる。As the adhesive used in the above steps, an adhesive containing an epoxy resin or an acrylate resin as a main component is suitable, and it is desirable to use different adhesives on the circuit board 5 side and the electronic component 9 side. The acrylate resin adhesive mainly contains a resin composition composed of at least one compound having either an acrylic group or a methacryl group, and its thermal reaction initiator is cumene hydroperoxide, t-butylperoxybenzoate, peroxide, or the like. Benzoyl oxide, acetyl peroxide or t-butylperoxy 3.
5 Using an organic peroxide such as trimethylcyclohexane,
This thermal reaction initiator is dispersed in the epoxy resin adhesive. On the other hand, the epoxy resin adhesive is mainly composed of a bifunctional or trifunctional resin composition having a main skeleton of bisphenol A, bisphenol F or novolak, and an imidazole compound or an amine compound is used as a thermal reaction initiator. The reaction initiator is dispersed in the acrylate resin adhesive. In addition, each of the adhesives contains an inorganic filler such as calcium carbonate or a silicate compound. In this way, by mixing the one resin adhesive with the other resin adhesive thermal reaction initiator, the thermal reaction is started only when both resin adhesives are mixed, and the resin adhesive Pot life becomes longer.
【００１４】また離型シート２には紙に離型材を含侵さ
せたものやシリコンゴム等が適している。The release sheet 2 is preferably made of paper impregnated with a release material, silicone rubber, or the like.
【００１５】[0015]
【発明の効果】以上のように本発明は、表面に接着剤が
塗布された離型シートの裏面から転写ピンで押し接着剤
を突出させて回路基板に接着剤を転写する工程を設ける
ことにより、回路基板の所定の位置に所定量の接着剤を
精度良く供給することができ、電子部品の半田付け不良
を無くすことができる優れた電子部品の実装方法を実現
できるものである。As described above, the present invention provides a step of transferring the adhesive to the circuit board by pressing the adhesive with a transfer pin and projecting the adhesive from the back surface of the release sheet having the surface coated with the adhesive. In addition, it is possible to provide an excellent electronic component mounting method that can supply a predetermined amount of adhesive to a predetermined position of a circuit board with high accuracy and eliminate soldering defects of the electronic component.
【図１】本発明の一実施例における電子部品の実装方法
のフローチャートFIG. 1 is a flowchart of an electronic component mounting method according to an embodiment of the present invention.
【図２】従来の電子部品の実装方法に使用する接着剤供
給装置の斜視図FIG. 2 is a perspective view of an adhesive supply device used in a conventional electronic component mounting method.
１ 接着剤 ２ 離型シート ４ 転写ピン ５ 回路基板 ６ 回路基板上の電極 ９ 電子部品 Reference Signs List 1 adhesive 2 release sheet 4 transfer pin 5 circuit board 6 electrode on circuit board 9 electronic component
フロントページの続き (72)発明者 宮川 秀規 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭59−113690（ＪＰ，Ａ) 特開 昭62−275733（ＪＰ，Ａ) 特開 平１−276695（ＪＰ，Ａ) 特開 平３−36788（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/34 H05K 13/04 Continuation of the front page (72) Inventor Hideki Miyagawa 1006 Kazuma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (56) References JP-A-59-113690 (JP, A) JP-A-62-275733 (JP) , A) JP-A 1-276695 (JP, A) JP-A 3-36788 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 3/34 H05K 13/04
Claims (3)
べき電子部品に接着剤を塗布し、回路基板の装着位置に
前記電子部品を位置合せした後、前記電子部品と回路基
板とを仮固定し更に前記接着剤を硬化して前記電子部品
と回路基板とを固定するに際し、前記電子部品に塗布さ
れた接着剤が前記回路基板に転写した接着剤の反応開始
剤を含有することを特徴とする電子部品の実装方法。An adhesive is transferred and mounted on a circuit board.
Apply adhesive to the electronic components that should be
After aligning the electronic component, the electronic component and the circuit board are aligned.
A board is temporarily fixed, and the adhesive is hardened.
When fixing the electronic component, the
Reaction of the adhesive transferred from the adhesive onto the circuit board
A mounting method of an electronic component, characterized by containing an agent .
べき電子部品に接着剤を塗布し、回路基板の装着位置に
前記電子部品を位置合せした後、前記電子部品と回路基
板とを仮固定し更に前記接着剤を硬化して前記電子部品
と回路基板とを固定するに際し、前記回路基板に転写さ
れた接着剤が前記電子部品に塗布された接着剤の反応開
始剤を含有することを特徴とする電子部品の実装方法。2. An adhesive is transferred to a circuit board and mounted.
Apply adhesive to the electronic components that should be
After aligning the electronic component, the electronic component and the circuit board are aligned.
A board is temporarily fixed, and the adhesive is hardened.
When fixing the circuit board and the
Reacts with the adhesive applied to the electronic component.
An electronic component mounting method comprising an initiator .
べき電子部品に接着剤を塗布し、回路基板の装着位置に
前記電子部品を位置合せした後、前記電子部品と回路基
板とを仮固定し更に前記接着剤を硬化して前記電子部品
と回路基板とを固定するに際し、前記電子部品に塗布さ
れた接着剤が前記回路基板に転写した接着剤の反応開始
剤を含有するとともに前記回路基板に転写された接着剤
が前記電子部品に塗布された接着剤の反応開始剤を含有
することを特徴とする電子部品の実装方法。3. An adhesive is transferred to a circuit board and mounted.
Apply adhesive to the electronic components that should be
After aligning the electronic component, the electronic component and the circuit board are aligned.
A board is temporarily fixed, and the adhesive is hardened.
When fixing the electronic component, the
Reaction of the adhesive transferred from the adhesive onto the circuit board
Adhesive containing an agent and transferred to the circuit board
Contains a reaction initiator of the adhesive applied to the electronic component
A method for mounting an electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05514992A JP3232628B2 (en) | 1992-03-13 | 1992-03-13 | Electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05514992A JP3232628B2 (en) | 1992-03-13 | 1992-03-13 | Electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05259627A JPH05259627A (en) | 1993-10-08 |
| JP3232628B2 true JP3232628B2 (en) | 2001-11-26 |
Family
ID=12990705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05514992A Expired - Fee Related JP3232628B2 (en) | 1992-03-13 | 1992-03-13 | Electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3232628B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10258800A1 (en) * | 2002-12-16 | 2004-07-08 | Siemens Ag | Method and device for applying an adhesive layer to flat components, placement device for loading flat components |
| DE10258798A1 (en) * | 2002-12-16 | 2004-07-22 | Siemens Ag | Method and device for partially applying adhesive to electronic components, mounting device for mounting components |
| AT513747B1 (en) | 2013-02-28 | 2014-07-15 | Mikroelektronik Ges Mit Beschränkter Haftung Ab | Assembly process for circuit carriers and circuit carriers |
| JP6450923B2 (en) * | 2013-12-20 | 2019-01-16 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting system, electronic component mounting method, and electronic component mounting apparatus |
-
1992
- 1992-03-13 JP JP05514992A patent/JP3232628B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05259627A (en) | 1993-10-08 |
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