JPS63114041U - - Google Patents

Info

Publication number
JPS63114041U
JPS63114041U JP611787U JP611787U JPS63114041U JP S63114041 U JPS63114041 U JP S63114041U JP 611787 U JP611787 U JP 611787U JP 611787 U JP611787 U JP 611787U JP S63114041 U JPS63114041 U JP S63114041U
Authority
JP
Japan
Prior art keywords
integrated circuit
external leads
hybrid integrated
circuit boards
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP611787U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP611787U priority Critical patent/JPS63114041U/ja
Publication of JPS63114041U publication Critical patent/JPS63114041U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す断面図、第2図
は本実施例の補強部材を示す平面図、第3図は従
来例を示す断面図である。 1,2……第1及び第2の混成集積回路基板、
3,4……第1及び第2の外部リード、5……枠
体、6……補強部材、7……孔。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view showing a reinforcing member of this embodiment, and FIG. 3 is a sectional view showing a conventional example. 1, 2...first and second hybrid integrated circuit boards,
3, 4...first and second external leads, 5...frame, 6...reinforcement member, 7...hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路素子が設けられた第1及び第2の混成集積
回路基板と、該第1及び第2の混成集積回路基板
の同一側辺から同一方向に突出された第1及び第
2の外部リードと、前記第1及び第2の混成集積
回路基板を対向して離間配置する枠体とからなる
混成集積回路において、前記第1及び第2の外部
リードの先端が夫々千鳥状となる様に曲折し、前
記千鳥状に配置した前記第1及び第2の外部リー
ドの先端部に対応した孔を有した補強部材を前記
第1及び第2の外部リードに挿入して位置規制す
ることを特徴とする混成集積回路。
first and second hybrid integrated circuit boards provided with circuit elements; first and second external leads protruding in the same direction from the same side of the first and second hybrid integrated circuit boards; In a hybrid integrated circuit comprising a frame body in which the first and second hybrid integrated circuit boards are arranged facing each other and spaced apart, the tips of the first and second external leads are respectively bent in a staggered manner, A hybrid device characterized in that reinforcing members having holes corresponding to the tips of the first and second external leads arranged in a staggered manner are inserted into the first and second external leads to regulate their positions. integrated circuit.
JP611787U 1987-01-20 1987-01-20 Pending JPS63114041U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP611787U JPS63114041U (en) 1987-01-20 1987-01-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP611787U JPS63114041U (en) 1987-01-20 1987-01-20

Publications (1)

Publication Number Publication Date
JPS63114041U true JPS63114041U (en) 1988-07-22

Family

ID=30788331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP611787U Pending JPS63114041U (en) 1987-01-20 1987-01-20

Country Status (1)

Country Link
JP (1) JPS63114041U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528468A (en) * 1975-07-09 1977-01-22 Hitachi Ltd Circuit elements

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528468A (en) * 1975-07-09 1977-01-22 Hitachi Ltd Circuit elements

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