JPS63113377A - Lead connection for superconductive thin film coil - Google Patents
Lead connection for superconductive thin film coilInfo
- Publication number
- JPS63113377A JPS63113377A JP25935786A JP25935786A JPS63113377A JP S63113377 A JPS63113377 A JP S63113377A JP 25935786 A JP25935786 A JP 25935786A JP 25935786 A JP25935786 A JP 25935786A JP S63113377 A JPS63113377 A JP S63113377A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- lead
- film coil
- hole
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 28
- 239000002887 superconductor Substances 0.000 claims description 15
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 238000004804 winding Methods 0.000 claims description 2
- 239000010453 quartz Substances 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract 3
- 238000005476 soldering Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 2
- 241000238366 Cephalopoda Species 0.000 description 1
- 229910020012 Nb—Ti Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Measuring Magnetic Variables (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
この発明は、スキッド（ＳＱＵＩＤ）ｍ力計のピックア
ップコイル、入力コイル等に使用される超伝導薄膜コイ
ルのリード線接続方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a method for connecting lead wires of superconducting thin film coils used as pickup coils, input coils, etc. of SQUID force meters.
（ロ）従来の技術
スキッド磁力計のピックアップコイル、入力コイル等は
、従来、超伝導線をボビン等に巻回したものが使用され
ている。(b) Conventional technology The pick-up coil, input coil, etc. of a skid magnetometer have conventionally been made by winding superconducting wire around a bobbin or the like.
一方、常温下で使用する一般的なコイルには、基板上に
コイルパターンを薄膜形成した薄膜コイルも使用されて
いる。On the other hand, thin film coils in which a coil pattern is formed in a thin film on a substrate are also used as general coils used at room temperature.
（ハ）発明が解決しようとする問題点
スキッド磁力計においても、小型化、コスト低減等の達
成のため、ピックアップコイル、入力コイル等に薄膜コ
イルを使用できれば好都合である。(c) Problems to be Solved by the Invention In skid magnetometers as well, it would be advantageous if thin film coils could be used for pickup coils, input coils, etc. in order to achieve miniaturization, cost reduction, etc.
しかしながら、スキッド磁力計用の薄膜コイルとなると
、コイルパターンを超伝導体で形成し、またコイルパタ
ーンに接続するリード線（信号線）も超伝導線が使用さ
れるため、コイルパターンとリード線を接続するのに、
通常のハンダ付では接着されず、超音波ハンダでは付着
力が弱く、また、単なる圧着でもやはり付着力が弱く、
容易かつ強固に接続できる方法がないという問題があっ
た。However, when it comes to thin film coils for skid magnetometers, the coil pattern is formed from a superconductor, and the lead wire (signal wire) connected to the coil pattern is also a superconducting wire. To connect,
Normal soldering does not bond, ultrasonic soldering has weak adhesion, and simple crimping also has weak adhesion.
There was a problem in that there was no way to connect easily and firmly.
この発明は、上記に鑑み、超伝導用の薄膜コイルのパタ
ーンと超伝導リード線を容易かつ強固に接続し得る超伝
導薄膜コイルのリード線接続方法を提供することを目的
としている。In view of the above, an object of the present invention is to provide a lead wire connection method for a superconducting thin film coil that can easily and firmly connect a superconducting thin film coil pattern and a superconducting lead wire.
（ニ）問題点を解決するための手段及び作用この発明の
超伝導薄膜コイルのリード線接続方法は、基板のリード
線を接続する部分に予めスルーホールを設けておき、基
板上にパターンを超伝導体で薄膜形成する際に、合わせ
てスルーホール面にも超伝導体薄膜を形成しておき、こ
のスルーホールに超伝導リード線を挿通し、その後、こ
の挿通部に超伝導体を圧着して、超伝導リード線を超伝
導薄膜コイルに接続するようにしている。(d) Means and effect for solving the problems In the method for connecting lead wires of a superconducting thin film coil according to the present invention, a through hole is provided in advance in the portion of the substrate where the lead wires are to be connected, and a through hole is formed in advance in the portion of the substrate where the lead wires are connected. When forming a thin conductor film, a superconductor thin film is also formed on the through-hole surface, a superconducting lead wire is inserted into this through-hole, and then a superconductor is crimped onto this insertion part. The superconducting lead wire is connected to the superconducting thin film coil.
このリード線接続方法では、スルーホールに超伝導リー
ド線を挿通し、その挿通部に超伝導体を圧接するのみで
、リード線を簡易に接続でき、また接続後はスルーホー
ルに超伝導リード線が挿通され、その挿通部を埋込む形
で超伝導体が圧接されるので、リード線を強固に接続す
ることができる。With this lead wire connection method, the superconducting lead wire can be easily connected by simply inserting the superconducting lead wire into the through hole and pressing the superconductor into the insertion part. is inserted, and the superconductor is pressed into contact with the insertion portion by embedding it, so that the lead wire can be firmly connected.
（ホ）実施例
以下、実施例により、この発明をさらに詳細に説明する
。(E) Examples The present invention will be explained in more detail with reference to Examples below.
第２図は、この発明が実施される超伝導薄膜コイルの平
面図である。この超伝導薄膜コイル１は、石英基板２の
上面に、Ｎ ｂ −Ｔ ｉ等の超伝導体の薄膜コイルパ
ターン３と、リードパターン４が形成されており、薄膜
コイルパターン３の両端にスルーホール５．６が、また
リードパターン４の両端にスルーホール７．８がそれぞ
れ形成されており、これらスルーホール５．６．７．８
の表面にも、ｆｍｌＰ！コイルパターン３及びリードパ
ターン４と同様に、超伝導薄膜がそれぞれ形成されてい
る。FIG. 2 is a plan view of a superconducting thin film coil in which the present invention is implemented. This superconducting thin film coil 1 has a thin film coil pattern 3 made of a superconductor such as Nb-Ti and a lead pattern 4 formed on the upper surface of a quartz substrate 2, and through holes are provided at both ends of the thin film coil pattern 3. 5.6, and through holes 7.8 are formed at both ends of the lead pattern 4, and these through holes 5.6.7.8
Also on the surface of fmlP! Similar to the coil pattern 3 and lead pattern 4, superconducting thin films are formed respectively.
この超伝導薄膜コイル１を、例えばピックアップコイル
として使用する場合は、スルーホール６とスルーホール
８を石英基板２の裏面より超伝導線であるリード線９で
接続すると共に、スルーホール５．７に外部接続のため
のリード線が接続される。When using this superconducting thin film coil 1 as a pickup coil, for example, connect the through holes 6 and 8 with a lead wire 9, which is a superconducting wire, from the back surface of the quartz substrate 2, and connect the through holes 5.7 to the through holes 5.7. Lead wires for external connections are connected.
スルーホール７を例に取り、超伝導体のリード線１０を
接続した場合の拡大断面図を、第１図に示している。リ
ード線１０の先端がスルーホール７に挿通された後、鉛
等の超伝導体１１をスルーホール７の挿通部に圧接して
、リード線１０を薄膜リードパターン４に接続固定して
いる。Taking the through hole 7 as an example, FIG. 1 shows an enlarged cross-sectional view when a superconductor lead wire 10 is connected. After the tip of the lead wire 10 is inserted into the through hole 7, a superconductor 11 such as lead is pressed against the insertion portion of the through hole 7, and the lead wire 10 is connected and fixed to the thin film lead pattern 4.
次に、第３図乃至第６図を参照して、薄膜コイル１にリ
ード線を接続する方法について説明する。Next, a method for connecting lead wires to the thin film coil 1 will be explained with reference to FIGS. 3 to 6.
先ず、石英基板２に薄膜コイルパターン３及びリードパ
ターン４を蒸着形成する前に、各スルーホール５．６．
７．８を形成しておく （第３図参照）。この石英基板
２に各スルーホール５．６．７．８を形成した状態で、
次に、超伝導体により薄膜コイルパターン３及びリード
パターン４を、各スルーホール５．６及び７．８が始点
と終点となるように蒸着形成する。この際に、第４図に
示すように、各スルーホール５．６．７．８にも超伝導
薄膜５ａ、６ａ、７ａ、８ａを形成する。この超伝導薄
膜のうち、外部リード線を接続するスルーホール５．７
は、第５図（ａ）に拡大図を示すように、超伝導薄膜７
ａ （５ａ）がスルーホールの上面より下面に達する壁
面に形成される。これに対し、石英基板２の裏面で薄膜
コイルパターン３とリードパターン４を接続するスルー
ホール６．８については、第５図（ｂ）に示すように、
スルーホールの超伝導薄膜６ａ、８ａの形成は、表面及
びスルーホール壁面のみならず、裏面にも跨がって形成
するようになっている。First, before forming the thin film coil pattern 3 and lead pattern 4 on the quartz substrate 2 by vapor deposition, each through hole 5, 6, .
7.8 (see Figure 3). With each through hole 5, 6, 7, 8 formed in this quartz substrate 2,
Next, a thin film coil pattern 3 and a lead pattern 4 are formed using a superconductor by vapor deposition such that the through holes 5.6 and 7.8 are the starting and ending points. At this time, as shown in FIG. 4, superconducting thin films 5a, 6a, 7a, and 8a are also formed in each of the through holes 5, 6, 7, and 8. In this superconducting thin film, through holes 5 and 7 connect external lead wires.
As shown in the enlarged view in FIG. 5(a), the superconducting thin film 7
a (5a) is formed on the wall surface reaching the lower surface from the upper surface of the through hole. On the other hand, as for the through hole 6.8 connecting the thin film coil pattern 3 and lead pattern 4 on the back surface of the quartz substrate 2, as shown in FIG. 5(b),
The superconducting thin films 6a and 8a of the through-hole are formed not only on the front surface and the wall surface of the through-hole, but also on the back surface.
以上のようにして、各スルーホール５．６．７．８に超
伝導薄膜５ａ、６ａ、７ａ、８ａを形成した後、この薄
膜コイル１に外部リード線１０を接続する場合、第６図
に示すように、例えばスルーホール７にリード線１０を
挿通し、その後、このリード線挿通部の上方より鉛等の
超伝導体１１を圧接し、嵌込む態様でリード線１０を固
着する（超音波ハンダ）。これにより、最終的に、第１
図に示す如（、リード線がスルーホールに接続固定され
ることになる。After forming the superconducting thin films 5a, 6a, 7a, 8a in each through hole 5.6.7.8 as described above, when connecting the external lead wire 10 to this thin film coil 1, as shown in FIG. As shown, for example, a lead wire 10 is inserted into a through hole 7, and then a superconductor 11 made of lead or the like is pressed from above the lead wire insertion part, and the lead wire 10 is fixed in such a manner that it is fitted (ultrasonic solder). As a result, the first
As shown in the figure, the lead wire is connected and fixed to the through hole.
（へ）発明の効果
この発明によれば、予め基板にスルーホールを形成して
おき、基板上に超伝導薄膜パターンを形成する際に、ス
ルーホールにも同様に超伝導薄膜を形成し、リード線を
外部より接続する場合に、このスルーホールにリード線
を挿通ずると共に、挿通孔に上部より超伝導体を圧接固
定して接続するものであるから、圧接力により、リード
線を強固に固着することができる。また、固着に際して
は、リード線を挿通し、後は超音波ハンダするのみであ
るから、比較的簡単に接続することができる。(F) Effects of the Invention According to the present invention, through holes are formed in advance on a substrate, and when forming a superconducting thin film pattern on the substrate, a superconducting thin film is also formed in the through holes, and the leads are When connecting a wire from the outside, the lead wire is inserted through this through hole, and the superconductor is pressed into the insertion hole from above to make the connection, so the lead wire is firmly fixed by the pressure welding force. can do. Further, when fixing, all that is required is to insert the lead wire and perform ultrasonic soldering, so the connection can be made relatively easily.
第１図は、この発明によって接続されたり−ドー線接続
部の拡大断面図、第２図は、この発明が実施される超伝
導薄膜コイルの平面図、第３図は、同超伝導薄膜コイル
を形成する前の基板にスルーホールを設けた状態の第２
図■−■線で切断した断面図、第４図は、同基板の超伝
導薄膜を形成した状態を示す断面図、第５図（ａ）は、
第４図Ａ部分の拡大断面図、第５図（ｂ）は、第４図Ｂ
部分の拡大断面図、第６図は、スルーホールにリード線
を接続する場合の断面図である。
１：超伝導薄膜コイル、 ２：基板、
３：薄膜コイルパターン、４：リードパターン、５・６
・７・８ニスルーホール、
１０：リード線、 １１：超伝導体。
特許出願人 株式会社島津製作所代理人
弁理士 中 村 茂 信第１図
第２図FIG. 1 is an enlarged cross-sectional view of a wire connection section connected according to the present invention, FIG. 2 is a plan view of a superconducting thin film coil in which the present invention is implemented, and FIG. 3 is a plan view of the same superconducting thin film coil. The second plate with through holes provided in the substrate before forming the
Figure 4 is a cross-sectional view taken along line ■-■, Figure 4 is a cross-sectional view showing the same substrate with a superconducting thin film formed, and Figure 5(a) is
Figure 4 is an enlarged sectional view of part A, Figure 5 (b) is Figure 4B
FIG. 6, which is an enlarged sectional view of a portion, is a sectional view when a lead wire is connected to a through hole. 1: Superconducting thin film coil, 2: Substrate, 3: Thin film coil pattern, 4: Lead pattern, 5/6
・7・8 varnished through holes, 10: Lead wire, 11: Superconductor. Patent applicant: Shimadzu Corporation Agent
Patent Attorney Shigeru Nakamura Figure 1 Figure 2
Claims (1)
で薄膜形成されてなる超伝導薄膜コイルの、各パターン
に超伝導体からなるリード線を接続するためのリード線
接続方法であって、 前記基板のリード線を接続する部分に予めスルーホール
を設けておき、前記基板上に前記パターンを薄膜形成す
る際に、合わせて前記スルーホール面にも超伝導薄膜を
形成しておき、このスルーホールにリード線を挿通し、
その後、この挿通部に超伝導体を圧着して前記リード線
を超伝導薄膜コイルに接続するようにした超伝導薄膜コ
イルのリード線接続方法。(1) A lead wire connection method for connecting a lead wire made of a superconductor to each pattern of a superconducting thin film coil in which an electrode pattern and a winding pattern are formed as a thin film of a superconductor on a substrate, A through hole is provided in advance in a portion of the substrate to which a lead wire is connected, and when forming a thin film of the pattern on the substrate, a superconducting thin film is also formed on the surface of the through hole. Insert the lead wire into the through hole,
Thereafter, a superconductor is crimped onto the insertion portion to connect the lead wire to the superconducting thin film coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25935786A JPH077045B2 (en) | 1986-10-30 | 1986-10-30 | Lead wire connection method for superconducting thin film coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25935786A JPH077045B2 (en) | 1986-10-30 | 1986-10-30 | Lead wire connection method for superconducting thin film coil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63113377A true JPS63113377A (en) | 1988-05-18 |
| JPH077045B2 JPH077045B2 (en) | 1995-01-30 |
Family
ID=17332989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25935786A Expired - Lifetime JPH077045B2 (en) | 1986-10-30 | 1986-10-30 | Lead wire connection method for superconducting thin film coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH077045B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5099162A (en) * | 1987-07-22 | 1992-03-24 | Canon Kabushiki Kaisha | Coil of superconducting material for electric appliance and motor utilizing said coil |
-
1986
- 1986-10-30 JP JP25935786A patent/JPH077045B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5099162A (en) * | 1987-07-22 | 1992-03-24 | Canon Kabushiki Kaisha | Coil of superconducting material for electric appliance and motor utilizing said coil |
| US5389908A (en) * | 1987-07-22 | 1995-02-14 | Canon Kabushiki Kaisha | Coil of superconducting material for electric appliance and motor utilizing said coil |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH077045B2 (en) | 1995-01-30 |
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