JPS63111407A - Profile measuring instrument - Google Patents

Abstract

PURPOSE:To obtain the cold-temperature profile of a body to be measured by correcting plate thickness data with temperature profile data by kinds of bodies to be measured from a temperature distribution generating means. CONSTITUTION:A radiation thermometer 10 measures the breadthwise temperature distribution of the body 4 to be measured and a temperature processing part 22 obtains temperature profile data on the body 4 to be measured. A profile arithmetic part 20 has a plate thickness conversion part 21, the temperature processing part 22, a display processing part 23, a radiation control part 24, and a system control part 25 which controls the whole of the profile arithmetic part 20, and receives a digitized electric signal corresponding to the intensity of radiation from a data collection part 5 and performs temperature compensation to finds the profile of the body 4 to be measured. The plate thickness data obtained by transmitting the radiation through the body 4 to be measured is corrected with temperature profile data to obtain the cold-temperature profile of the body 4 to be measured.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an improvement of a profile measuring device that continuously measures the cross-sectional shape of a metal plate or the like using radiation.

(Conventional technology) FIG. 7 is a configuration diagram of a conventional profile measuring device.

This device has a radiation source 2 on the top of a C frame 1,
A multi-channel detector 3 configured by arranging a plurality of radiation detection elements is provided at a position facing the radiation source 2.

A metal object (for example, a steel plate from a rolling line) is placed between the radiation source 2 and the multi-channel detector 3.
4 and irradiates with radiation. At this time, the radiation transmitted through the metal body 4 is detected by each detection element of the multi-channel detector 3, and an electric signal corresponding to the intensity of the radiation is transmitted to the data collection unit 5rtc. This data collection section 5 converts the electric signal of each element into a digital signal and sends it to the profile calculation section 6.
Convert to thickness profile data. Note that this glofield data is displayed on the cRT display device 7 or the like.

Now, the glofield date obtained in this way is
For example, a steel plate that has been rolled on a rolling line will have a so-called crown shape as shown in FIG. The range a corresponds to the center part of the metal plate 4, and the range b corresponds to the edge part of the metal plate 4. In addition,
W is 6B in the board width direction, and HVi is 6B in the board thickness direction. By the way, metal plate.

The profile of the edge portion 4 is an important factor in improving the quality of metal plate products, and it is necessary to suppress the crown shape of the edge portion. For these reasons, it is necessary to continuously measure the profile of the edge portion using the apparatus shown in FIG. 7 to determine its thickness.

Now, since the metal plate (steel plate) 4 measured by such an apparatus is in the process of hot rolling, it is necessary to convert this into a cold profile value. This conversion is executed in the profile calculation section 6, and this process is referred to as temperature correction. Well, the cold thickness Tc is TC=(1+2(!-△t) x Tm・”
(1), where α is the coefficient of linear expansion of the steel plate, △t
is the hot temperature minus the cold temperature (room temperature), and Tm is the measured thickness at the hot temperature. In principle, the above-mentioned device does not measure the density of the metal plate 4, and if the temperature rises and the density decreases, the measured value will also become a small value. Therefore, in order to obtain the cold profile value from equation (1), it is necessary to perform an addition correction in the direction of increase in thickness.

Therefore, in the apparatus shown in Fig. 7, hot temperature - cold temperature △
In order to obtain t, for example, the temperature at a certain position on the metal plate 4 is measured using a radiation thermometer. However, the temperature distribution at the edges of the metal plate 4 is different from that at the center, and is not uniform; the closer to the edges, the lower the temperature is. The tab υ shows a temperature profile in the width direction of the metal plate 4.

Therefore, if the profile is determined by measuring Δt only at a certain position and substituting it into the equation (1), high accuracy cannot be expected, especially for edge portions.

(Problem to be Solved by the Invention) In this way, in the conventional device, Δt, which is used to determine the cold value from the hot measurement value, is the temperature at a certain position on the metal plate 4. There is a problem in that the profile of the edge portion, which is one of the factors for improvement, cannot be measured with high precision.

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, it is an object of the present invention to provide a profile measuring device that can accurately correct edge portions and measure profiles with high precision.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a method for obtaining hot plate thickness data by irradiating radiation onto a plate-shaped object in a high temperature state and receiving an intensity signal of the transmitted radiation. A conversion means, a thermometer that measures the temperature distribution in the width direction of the object to be measured, and a temperature distribution generator that receives the temperature signal output from the thermometer and creates and stores temperature profile data for each type of object to be measured. and a profile calculation means for correcting plate thickness data with temperature profile data stored in a temperature distribution creation means to obtain a cold profile of the object to be measured. I'm using a device.

(Function) By providing such means, the temperature distribution creation means receives the temperature signal output from the thermometer and creates temperature profile data for each type of object to be measured, while the profile calculation The means corrects plate thickness data obtained by transmitting radiation through the object to be measured using the temperature profile data to obtain a cold profile of the object to be measured.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings. Note that the same parts as in FIG. 7 are given the same reference numerals, and detailed explanation thereof will be omitted.

FIG. 1 is a configuration diagram of a profile measuring device.

A radiation thermometer 10 is provided at a position close to the radiation source 2 on the top of the C frame 1 . The radiation temperature sensor 10 measures the temperature distribution in the width direction of the object 4 to be measured as shown in FIG. As shown in FIG. 4, electric signals xi, x2 . 4, which outputs X3... for each channel. Note that the temperature measurement with the radiation thermometer 10 is performed every predetermined sampling period i.
It will be held in Therefore, the temperature signal output from the radiation thermometer 10 is represented by t(x, i).

On the other hand, the profile calculation section 20 has a function of receiving an electrical signal corresponding to the digitized radiation intensity from the data collection section 5, performing temperature correction, and obtaining the profile of the object to be measured 4. It has a system control section 25 that controls the board thickness conversion section 21, temperature processing section 22, display processing section 23, radiation control section 24, and profile calculation section 20 as a whole. The plate thickness converting unit 21 receives each electrical signal from the data collecting unit 5 and calculates plate thickness data Tm (x) for each channel. Note that the channels of the multi-channel 8 device 3 and the channels of the radiation thermometer 10 match. The temperature processing section 22 has a function of receiving temperature signals for each channel of the radiation thermometer 10, creating and storing temperature profile data for each of 40 types of objects to be measured.

Specifically, it has a configuration as shown in FIG.

The temperature signal of each channel from the radiation thermometer 10 is A/D (
The signals are converted into digital signals by an analog/digital converter 3o, and sequentially sent to one memory 32 through an adder 31 having two input terminals. Then, the digital temperature signal is further sent from the first memory 32 to the second memory 33 and stored therein, and is again sent to the adder 31.
is sent to the other input terminal. As a result, the first memory 32 stores S(x, i) obtained by sequentially adding the temperature signal t(x, i), and the second memory 33 stores 1 sun! The configuration is such that S(x, 1-1) before the ring is stored. Therefore, in the adder 31, 8(x, 1) = t(X, i) - 8(x, 1-1) Note that i=x, 2, 3..., N.

calculations are performed. The divider 34 divides S(x, i) stored in the first memory 32 by N when the number of shinglings reaches N times according to the control signal from the sequence controller 35 to obtain average temperature profile data. t(x)
This is what we seek. Well, average temperature profile
(x) is t (x)=S(x, N)/N. The temperature profile data t(x) obtained in this manner is stored in a separate memory (not shown) depending on the type and thickness of the four-piece steel plate to be measured. Figure 5 shows the various types of copper plates AJ, A2, ... and the plate thicknesses ■, ■, stored in the mesori.
Each average temperature profile data (Dl,
D2. ...K1...Pl...) is a diagram schematically showing. Note that 36 and 37 are the first memory 32, respectively.
, Al in the address controller of the second memory 33.

Further, the display processing section 23 receives the plate thickness data Tm(x) from the &thickness conversion section 21, and corrects this plate thickness data Tm(x) using the temperature profile data stored in the temperature processing section 22. Then, the cold profile of the object to be measured 4 is obtained by calculating the above-mentioned equation (1). Note that this profile is displayed on the display device 40. The radiation control unit 24 controls opening and closing of the shutter of the radiation source 2.

Next, the operation of the apparatus configured as described above will be explained. First, before measuring the profile of the object 4 to be measured, temperature profile data for each type and thickness of the object 4 to be measured is obtained. This can be obtained as follows. The object to be measured 4 is passed through the line for generating temperature profile data. At this time, the radiation thermometer 10 detects the temperature in the width direction of the object to be measured 4 at every predetermined sampling period and outputs a temperature signal for each channel. This temperature signal is sent to the temperature processing section 22, first converted into a digital signal by the A/D converter 30, and passed through the adder 3 to the first memory 3.
2 and stored. Then, the added value at the time of the current sampling is sent to the second mesori 3 and further sent to the adder 31. Accordingly, the adder 31 adds the temperature signal at the current sampling time and the temperature signal at the next sampling time, and sends the result to the first memory 32. Such an addition operation is performed for each sampling, and the added value is sequentially increased to 1.
It is stored in the memory 32. Then, when the number of samplings reaches N, the divider 34 divides the added value in the first memory 32 by N under the control of the sequence controller 35, and calculates the average temperature Gron 4-k 7''-t ( In this way, the above operations are performed for each type and each plate thickness of the object to be measured 4 to obtain temperature profile data as shown in FIG. 5. Note that 8(x, The initial value setting of O) was omitted. Also, t(x) and △t(
The difference from
Since the hot temperature is higher than the room temperature, △t (x) =
t (x). Well, if you can't ignore it, go to step (1).
Temperature correction may be performed after the second calculation is completed.

Now, the profile measurement is performed as follows. When the object to be measured 4 flows into the line, the radiation source 2 irradiates the object to be measured 4 with radiation under the control of the radiation control section 24 . As a result, the radiation passes through the object to be measured 4 and reaches the multi-channel detector 3. The multi-channel detector 3 outputs an electrical signal at a level corresponding to the amount of radiation incident from each detection element. These electrical signals are sent to the data collection section 5, digitized for each channel, and sent to the plate thickness conversion section 21. This plate thickness converter 21 receives the digital signal for each channel and converts the plate thickness data T as shown in FIG.
Convert to m(x).

Incidentally, instructions regarding the type and thickness of the object to be measured 4 currently flowing through the line are input to the system control unit 25. Therefore, the system control unit 25 generates temperature profile data t(x) corresponding to the type and thickness of the steel plate.
is read out from the temperature processing section 22 and sent to the display processing section 23. Now, this display processing unit 23 receives plate thickness data Tm(x) from the plate thickness conversion unit 21, and converts it into Tm of equation (1).
and temperature profile data as △t(
X) and calculates the profile of the object to be measured 4 in the cold state by processing this equation (1). Then, the obtained profile of the edge portion is further converted into a position in the board width direction in the display processing section 23, and
is linearly converted into a value that takes into account the screen size and displayed on the display device 40 (FIG. 6).

In this way, in the above-mentioned embodiment, temperature profile data corresponding to 40 types of objects to be measured and the plate thickness are created in response to the temperature signal output from the radiation thermometer 10, and on the other hand, radiation is applied to the object to be measured 4. The plate thickness data obtained through the transmission is corrected using temperature profile data to measure the measured object 4.
Since we tried to obtain the cold profile of 1.
Completely different from the case of temperature measurement at a point, the object to be measured 4
The entire profile in the zero width direction, especially the edge portion, can be measured with high precision. Since the temperature profile data is obtained by calculating the average value rather than the data for one location in the width direction, it eliminates the influence of errors caused by errors in the radiation thermometer 10 or by moisture, oil, etc. existing in the space. be able to. In addition, since it is stored as temperature profile data t (x), it takes only a short time to obtain the profile of the object to be measured 4, and by providing a separate memory for this temperature profile data, it is possible to demand. It has the advantage of being able to learn. Further, this temperature correction is performed every time the plate thickness is measured.

Note that the present invention is not limited to the above-mentioned embodiment, and can be modified without departing from the spirit thereof.

〔Effect of the invention〕

As described in detail above, according to the present invention, it is possible to provide a profile measuring device that can perform highly accurate profile measurement by accurately correcting edge portions.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram showing an embodiment of the profile measuring device according to the present invention, Figs. 2 and 3 are diagrams for explaining the action of the radiation thermometer, and Fig. 4 is a temperature treatment in the device of the present invention. 5 is a schematic diagram showing temperature profile data in the device of the present invention, FIG. 6 is a diagram for explaining the action of the device of the present invention, and FIGS. 7 and 8 are diagrams showing the conventional device. It is a figure for explaining. □ 1... C frame, 2... Radiation source, 3... Multi-channel detector, 4... Measured object, 5... Data collection section, 20... Profile calculation section, 21. ... Board thickness conversion section, 22... Temperature processing section, 23... Display processing section,
24... Radiation control unit, 25... System control unit,
30... A/D converter, 31... Adder, 32...
・First memory. 33... Second memory, 34... Divider, 40...
Display device. Applicant's representative Patent attorney Takeshi Suzue Arabesque 2, Figure 3, Figure 4, Figure 5, Figure 6, Figure 8

Claims (1)

[Claims] plate thickness conversion means for irradiating radiation onto a plate-shaped object in a high temperature state and receiving an intensity signal of the transmitted radiation to obtain hot plate thickness data; and a temperature distribution in the width direction of the object to be measured. a thermometer for measuring the temperature, a temperature distribution creation means for creating and storing temperature profile data for each type of the object to be measured in response to a temperature signal output from the thermometer, and a temperature distribution creation means for creating and storing the temperature profile data for each type of the object to be measured; 1. A profile measuring device comprising: profile calculation means for determining a cold profile of the object to be measured by correcting it using temperature profile data stored in the means.