JPS63110042U - - Google Patents
Info
- Publication number
- JPS63110042U JPS63110042U JP154587U JP154587U JPS63110042U JP S63110042 U JPS63110042 U JP S63110042U JP 154587 U JP154587 U JP 154587U JP 154587 U JP154587 U JP 154587U JP S63110042 U JPS63110042 U JP S63110042U
- Authority
- JP
- Japan
- Prior art keywords
- angled surface
- carrier
- holding
- semiconductor
- suction hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000012050 conventional carrier Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Warehouses Or Storage Devices (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP154587U JPS63110042U (de) | 1987-01-08 | 1987-01-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP154587U JPS63110042U (de) | 1987-01-08 | 1987-01-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63110042U true JPS63110042U (de) | 1988-07-15 |
Family
ID=30779552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP154587U Pending JPS63110042U (de) | 1987-01-08 | 1987-01-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63110042U (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003077988A (ja) * | 2001-09-06 | 2003-03-14 | Nitto Denko Corp | 半導体ウエハのマウント方法およびこれに用いるカセット |
-
1987
- 1987-01-08 JP JP154587U patent/JPS63110042U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003077988A (ja) * | 2001-09-06 | 2003-03-14 | Nitto Denko Corp | 半導体ウエハのマウント方法およびこれに用いるカセット |
JP4748901B2 (ja) * | 2001-09-06 | 2011-08-17 | 日東電工株式会社 | 半導体ウエハのマウント方法およびこれに用いるカセット |
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