JPS63109457U - - Google Patents
Info
- Publication number
- JPS63109457U JPS63109457U JP1987000254U JP25487U JPS63109457U JP S63109457 U JPS63109457 U JP S63109457U JP 1987000254 U JP1987000254 U JP 1987000254U JP 25487 U JP25487 U JP 25487U JP S63109457 U JPS63109457 U JP S63109457U
- Authority
- JP
- Japan
- Prior art keywords
- insulating tube
- lead wire
- circuit board
- printed circuit
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 210000000078 claw Anatomy 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の第１の実施例の構成を示す斜
視図、第２図は本考案の第１の実施例の構成を示
す断面図、第３図は本考案の第２の実施例の構成
を示す斜視図、第４図は本考案の第２の実施例の
構成を示す断面図、第５図は本考案におけるホル
ダの切り出し製法を示す斜視図である。
１……装置、２……コネクタ、３……リード線
、４……ホルダ、５……係合溝、６……係止片、
７……絶縁チユーブ、８……心線、１０……プリ
ント基板、１１……取付孔、１２……係合爪、１
３……係止孔。
Fig. 1 is a perspective view showing the structure of the first embodiment of the invention, Fig. 2 is a sectional view showing the structure of the first embodiment of the invention, and Fig. 3 is the second embodiment of the invention. FIG. 4 is a cross-sectional view showing the structure of a second embodiment of the present invention, and FIG. 5 is a perspective view showing a cutting method of the holder according to the present invention. DESCRIPTION OF SYMBOLS 1... Device, 2... Connector, 3... Lead wire, 4... Holder, 5... Engagement groove, 6... Locking piece,
7... Insulating tube, 8... Core wire, 10... Printed circuit board, 11... Mounting hole, 12... Engaging claw, 1
3...Latching hole.
Claims (1)
ト基板のランドに半田付けして接続するリード線
の接続構造において、合成樹脂製のホルダに複数
の係合溝を所定間隔で互いに平行に形成し、前記
リード線の絶縁チユーブが前記係合溝に嵌入され
、かつ該絶縁チユーブの端部から突出する前記心
線が前記プリント基板の取付孔に挿通されて前記
ランドに半田付けされてなることを特徴とするリ
ード線の接続構造。 In a lead wire connection structure in which the end of a core wire covered with an insulating tube is connected to a land on a printed circuit board by soldering, a plurality of engagement grooves are formed in a synthetic resin holder parallel to each other at predetermined intervals. The insulating tube of the lead wire is fitted into the engaging groove, and the core wire protruding from the end of the insulating tube is inserted into the mounting hole of the printed circuit board and soldered to the land. Characteristic lead wire connection structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987000254U JPS63109457U (en) | 1987-01-07 | 1987-01-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987000254U JPS63109457U (en) | 1987-01-07 | 1987-01-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63109457U true JPS63109457U (en) | 1988-07-14 |
Family
ID=30777058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987000254U Pending JPS63109457U (en) | 1987-01-07 | 1987-01-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63109457U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007149762A (en) * | 2005-11-24 | 2007-06-14 | Yazaki Corp | Connection structure of electronic component |
-
1987
- 1987-01-07 JP JP1987000254U patent/JPS63109457U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007149762A (en) * | 2005-11-24 | 2007-06-14 | Yazaki Corp | Connection structure of electronic component |
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