JPS63107530A - Resin sealing mold for multi-molding - Google Patents
Resin sealing mold for multi-moldingInfo
- Publication number
- JPS63107530A JPS63107530A JP25319286A JP25319286A JPS63107530A JP S63107530 A JPS63107530 A JP S63107530A JP 25319286 A JP25319286 A JP 25319286A JP 25319286 A JP25319286 A JP 25319286A JP S63107530 A JPS63107530 A JP S63107530A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- flow path
- molding
- pots
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 23
- 229920005989 resin Polymers 0.000 title claims abstract description 23
- 238000000465 moulding Methods 0.000 title claims abstract description 14
- 238000007789 sealing Methods 0.000 title claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract 2
- 101100298225 Caenorhabditis elegans pot-2 gene Proteins 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
- B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置のマルチ成形方式による樹脂封止金
型に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin sealing mold for semiconductor devices using a multi-molding method.
従来、半導体装置のマルチ成形方式に用いられる樹脂封
止金型（以下マルチモールド金型と略す）の機能部配置
は、第３図に示す様に、各ボッＩ−２に対してそれぞれ
数個の樹脂成形部１（以下キャビティと略す。）を有し
ており、これらキャビティ１は樹脂導入路３を介して各
ボット２と接続させているが、各成形単位が各ボット２
毎に独立していた。Conventionally, the functional parts of a resin sealing mold (hereinafter referred to as a multi-mold mold) used in a multi-molding method for semiconductor devices are arranged in several parts for each box I-2, as shown in Figure 3. These cavities 1 are connected to each bot 2 via a resin introduction path 3, and each molding unit is connected to each bot 2.
Each was independent.
上述した従来のマルチモールド金型では、各ボット２毎
に投入される成形材料（以下タブレッ）・と略す）の体
積に差が存在すると、樹脂を各キャビディ１へ完全に圧
入完了した時に、各圧入プランジャ５の位置が不均一と
なり、良好な成形結果を得る事が難しい。この為、第４
図に示す様な油圧等を利用した等圧機横（１０）をマル
チモールド金型内、又は圧入機構部へ設けてこの差を吸
収してやる必要がある。この等圧機構は、各圧入プラン
ジャ５がシリンダピストン７を介して等圧機能ブロック
１０に挿入され、この等圧機能をブロック１０には、圧
油入口９から圧油が供給され、各シリンダピストン７の
入る圧油室は等圧油用連絡路１１で連結されている。そ
のため各機構部の複雑化を招くと共に、等圧機槽の良否
が製品品質を左右するといった欠点があった。In the conventional multi-mold mold described above, if there is a difference in the volume of the molding material (hereinafter abbreviated as "tablet") introduced for each bot 2, when the resin is completely press-fitted into each cavity 1, The position of the press-fit plunger 5 becomes uneven, making it difficult to obtain good molding results. For this reason, the fourth
It is necessary to absorb this difference by installing a horizontal isobaric machine (10) using hydraulic pressure or the like as shown in the figure in the multi-mold mold or in the press-fitting mechanism. In this equal pressure mechanism, each press-fitting plunger 5 is inserted into an equal pressure function block 10 via a cylinder piston 7, and pressure oil is supplied to the block 10 from a pressure oil inlet 9 to perform this equal pressure function. The pressure oil chambers 7 are connected by an equal pressure oil communication path 11. As a result, each mechanical part becomes complicated, and the product quality is affected by the quality of the isobaric machine tank.
本発明の目的は、これらの欠点を除き、下型のポット間
に樹脂流路を設けることにより、等圧機槽を不要とし、
簡単な構造で製品品質も改善できてマルチ成型用樹脂封
止金型を提供することにある。The purpose of the present invention is to eliminate these drawbacks, eliminate the need for an isobaric machine tank by providing a resin flow path between the pots of the lower mold, and
The object of the present invention is to provide a resin-sealed mold for multi-molding, which has a simple structure and can improve product quality.
本発明の構成は、半導体装置のマルチ成型に用いる樹脂
封止金型において、各マルチポット間を連絡する樹脂流
路を設けることにより、各樹脂成形部内圧力を均一にな
るようにしたことを特徴とする。The structure of the present invention is characterized in that in a resin sealing mold used for multi-molding of semiconductor devices, a resin flow path is provided that communicates between each multi-pot, thereby making the internal pressure of each resin molding part uniform. shall be.
［実施例〕 次に本発明について図面を参照して説明する。[Example〕 Next, the present invention will be explained with reference to the drawings.
第１図、第２図は本発明の一実施例のマルチモールド金
型下型の平面図、およびその圧入機構を部分断面で示し
た側面図である。本実施例の基本的構造は、従来のマル
チモールド金型と同一であるが、各ボッ）〜２間に樹脂
流路４を有することを特徴とする。これら複数のポット
２へ投入されたタブレッ１〜は、第２図に示す様に、等
圧機槽をもたない圧入機構により、樹脂導入ｉ￥８３を
経てキャビティ１へ圧入される。この時、各タブレット
の体積差を樹脂流路４を用いて吸収するこにより、全キ
ャビティ１の圧力を均一とし良好な成形品を得る事が出
来る。FIGS. 1 and 2 are a plan view of a lower die of a multi-mold mold according to an embodiment of the present invention, and a side view showing a press-fitting mechanism thereof in partial cross section. The basic structure of this embodiment is the same as that of the conventional multi-mold mold, but it is characterized by having a resin flow path 4 between each of the holes. As shown in FIG. 2, the tablets 1 to 1 put into the plurality of pots 2 are press-fitted into the cavity 1 through the resin introduction i\83 by a press-fitting mechanism that does not have an isobaric machine tank. At this time, by absorbing the difference in volume between the tablets using the resin channel 4, the pressure in all cavities 1 can be made uniform and a good molded product can be obtained.
以上説明したように、本発明のマルチモールド金型は、
各ポット２間に樹脂流路４を有することにより、各ポッ
ト２毎のタブレット体積の差を吸収して良好な成形結果
を得ることが出来る。このため、他に等圧機槽を有する
必要がなく、圧入機構の簡単化が可能となり、そのため
製品品質も向上するといった効果がある。As explained above, the multi-mold mold of the present invention has
By providing the resin flow path 4 between each pot 2, it is possible to absorb the difference in tablet volume between each pot 2 and obtain a good molding result. Therefore, there is no need to have an additional isobaric machine tank, and the press-fitting mechanism can be simplified, which has the effect of improving product quality.
第１図、第２図は、本発明の一実施例を示すマルチモー
ルド金型下型の平面図およびこのマルチモールド金型の
圧入機構の部分断面側面図、第３図、第４図は、従来の
マルチモールド金型下型の平面図およびこのマルチモー
ルド金型用の等圧機槽を内蔵した圧入機構の側面図であ
る。
ｌ・・・キャビティ、２・・・ポット、３・・・樹脂導
入路、４・・・樹脂流路、５・・・圧入用プランジャ、
６・・・圧入用油圧シリンダ−，７・・・シリンダーピ
ストン、８・・・ベント、９・・・圧油入口、１０・・
・等圧機槽ブロック、１１・・・等圧油圧連絡路。FIGS. 1 and 2 are a plan view of a lower die of a multi-mold mold and a partial cross-sectional side view of a press-fitting mechanism of this multi-mold mold, and FIGS. 3 and 4 are FIG. 2 is a plan view of a conventional multi-mold mold lower die and a side view of a press-fitting mechanism incorporating an isobaric machine tank for the multi-mold mold. l...Cavity, 2...Pot, 3...Resin introduction path, 4...Resin flow path, 5...Plunger for press-fitting,
6... Hydraulic cylinder for press-fitting, 7... Cylinder piston, 8... Vent, 9... Pressure oil inlet, 10...
・Isobaric machine tank block, 11... Equal pressure hydraulic communication path.
Claims (1)
、各マルチポット間を連絡する樹脂流路を設けることに
より、各樹脂成形部内圧力を均一になるようにしたこと
を特徴とするマルチ成形用樹脂封止金型。A resin for multi-molding, which is characterized in that, in a resin sealing mold used for multi-molding of semiconductor devices, the pressure inside each resin molding part is made uniform by providing a resin flow path that communicates between each multi-pot. Sealing mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25319286A JPS63107530A (en) | 1986-10-23 | 1986-10-23 | Resin sealing mold for multi-molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25319286A JPS63107530A (en) | 1986-10-23 | 1986-10-23 | Resin sealing mold for multi-molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63107530A true JPS63107530A (en) | 1988-05-12 |
| JPH0469533B2 JPH0469533B2 (en) | 1992-11-06 |
Family
ID=17247829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25319286A Granted JPS63107530A (en) | 1986-10-23 | 1986-10-23 | Resin sealing mold for multi-molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63107530A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210080487A (en) * | 2018-11-21 | 2021-06-30 | 토와 가부시기가이샤 | Transfer drive mechanism, resin molding apparatus, and manufacturing method of a resin molded article |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5467768U (en) * | 1977-10-21 | 1979-05-14 | ||
| JPS6038717U (en) * | 1983-08-25 | 1985-03-18 | ロ−ム株式会社 | Multi-type transfer molding equipment |
| JPS6339054U (en) * | 1986-08-30 | 1988-03-14 | ||
| JPH0340579U (en) * | 1989-08-31 | 1991-04-18 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3831710A (en) * | 1973-01-24 | 1974-08-27 | Lockheed Aircraft Corp | Sound absorbing panel |
-
1986
- 1986-10-23 JP JP25319286A patent/JPS63107530A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5467768U (en) * | 1977-10-21 | 1979-05-14 | ||
| JPS6038717U (en) * | 1983-08-25 | 1985-03-18 | ロ−ム株式会社 | Multi-type transfer molding equipment |
| JPS6339054U (en) * | 1986-08-30 | 1988-03-14 | ||
| JPH0340579U (en) * | 1989-08-31 | 1991-04-18 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210080487A (en) * | 2018-11-21 | 2021-06-30 | 토와 가부시기가이샤 | Transfer drive mechanism, resin molding apparatus, and manufacturing method of a resin molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0469533B2 (en) | 1992-11-06 |
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