JPS63106042U - - Google Patents

Info

Publication number
JPS63106042U
JPS63106042U JP20316886U JP20316886U JPS63106042U JP S63106042 U JPS63106042 U JP S63106042U JP 20316886 U JP20316886 U JP 20316886U JP 20316886 U JP20316886 U JP 20316886U JP S63106042 U JPS63106042 U JP S63106042U
Authority
JP
Japan
Prior art keywords
electrodes
melting point
low melting
point metal
temperature fuse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20316886U
Other languages
Japanese (ja)
Other versions
JPH0436034Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20316886U priority Critical patent/JPH0436034Y2/ja
Publication of JPS63106042U publication Critical patent/JPS63106042U/ja
Application granted granted Critical
Publication of JPH0436034Y2 publication Critical patent/JPH0436034Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る基板型温度ヒユーズを示
す説明図、第2図は第1図における―断面図
である。 図において、1は絶縁基板、2,2は電極、4
は低融点金属、5はフラツクス層、6は樹脂被覆
層である。
FIG. 1 is an explanatory diagram showing a substrate-type temperature fuse according to the present invention, and FIG. 2 is a cross-sectional view taken in FIG. 1. In the figure, 1 is an insulating substrate, 2, 2 are electrodes, 4
5 is a low melting point metal, 5 is a flux layer, and 6 is a resin coating layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板上に一対の電極を設け、該電極間を低
融点金属で橋設し、該低融点金属上にフラツクス
層を設け、基板上に樹脂被覆層を設けた温度ヒユ
ーズにおいて、上記フラツクス層の平面形状を丸
味形状としたことを特徴とする基板型温度ヒユー
ズ。
In a temperature fuse in which a pair of electrodes is provided on an insulating substrate, a low melting point metal is used as a bridge between the electrodes, a flux layer is provided on the low melting point metal, and a resin coating layer is provided on the substrate. A board-type temperature fuse characterized by a rounded planar shape.
JP20316886U 1986-12-26 1986-12-26 Expired JPH0436034Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20316886U JPH0436034Y2 (en) 1986-12-26 1986-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20316886U JPH0436034Y2 (en) 1986-12-26 1986-12-26

Publications (2)

Publication Number Publication Date
JPS63106042U true JPS63106042U (en) 1988-07-08
JPH0436034Y2 JPH0436034Y2 (en) 1992-08-26

Family

ID=31168243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20316886U Expired JPH0436034Y2 (en) 1986-12-26 1986-12-26

Country Status (1)

Country Link
JP (1) JPH0436034Y2 (en)

Also Published As

Publication number Publication date
JPH0436034Y2 (en) 1992-08-26

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