JPS62107342U - - Google Patents
Info
- Publication number
- JPS62107342U JPS62107342U JP20108485U JP20108485U JPS62107342U JP S62107342 U JPS62107342 U JP S62107342U JP 20108485 U JP20108485 U JP 20108485U JP 20108485 U JP20108485 U JP 20108485U JP S62107342 U JPS62107342 U JP S62107342U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- layer
- flux
- insulating
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
Description
第１図は本考案に係る基板形温度ヒユーズを示
す一部欠截上面説明図、第２図は第１図における
―断面図である。
図において、１は絶縁基板、２，２は電極、４
は可溶金属体、５はフラツクス層、６は第１絶縁
層、７は第２絶縁層である。
FIG. 1 is a partially cutaway top explanatory view showing a substrate-type temperature fuse according to the present invention, and FIG. 2 is a sectional view taken in FIG. 1. In the figure, 1 is an insulating substrate, 2 and 2 are electrodes, and 4
5 is a fusible metal body, 5 is a flux layer, 6 is a first insulating layer, and 7 is a second insulating layer.
Claims (1)
電極間に可溶金属体を設け、この可溶金属体上に
フラツクス層を設け、このフラツクス層を覆い、
かつ上記絶縁基板の外郭よりも小さい外郭にて、
フラツクスの融点よりもやや成形温度の低い第１
絶縁層を設け、該第１絶縁層上に絶縁基板の全片
面を覆つて第１絶縁層の成形温度よりも成形温度
の高い第２絶縁層を設けたことを特徴とする基板
形温度ヒユーズ。 A pair of electrodes is provided on one side of an insulating substrate, a fusible metal body is provided between these electrodes, a flux layer is provided on the fusible metal body, and this flux layer is covered,
And with an outer shell smaller than the outer shell of the insulating substrate,
The first molding temperature is slightly lower than the melting point of the flux.
1. A substrate-type temperature fuse, characterized in that an insulating layer is provided, and a second insulating layer having a molding temperature higher than that of the first insulating layer is provided on the first insulating layer, covering the entire surface of the insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20108485U JPS62107342U (en) | 1985-12-25 | 1985-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20108485U JPS62107342U (en) | 1985-12-25 | 1985-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62107342U true JPS62107342U (en) | 1987-07-09 |
Family
ID=31164204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20108485U Pending JPS62107342U (en) | 1985-12-25 | 1985-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62107342U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009152083A (en) * | 2007-12-20 | 2009-07-09 | Uchihashi Estec Co Ltd | Alloy-type thermal fuse |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS525453A (en) * | 1975-07-02 | 1977-01-17 | Uchihashi Metal Ind | Method of manufacturing temperature fuse |
-
1985
- 1985-12-25 JP JP20108485U patent/JPS62107342U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS525453A (en) * | 1975-07-02 | 1977-01-17 | Uchihashi Metal Ind | Method of manufacturing temperature fuse |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009152083A (en) * | 2007-12-20 | 2009-07-09 | Uchihashi Estec Co Ltd | Alloy-type thermal fuse |