JPS6413649U - - Google Patents
Info
- Publication number
- JPS6413649U JPS6413649U JP10816387U JP10816387U JPS6413649U JP S6413649 U JPS6413649 U JP S6413649U JP 10816387 U JP10816387 U JP 10816387U JP 10816387 U JP10816387 U JP 10816387U JP S6413649 U JPS6413649 U JP S6413649U
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- insulating substrate
- low melting
- metal body
- point metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 229920002430 Fibre-reinforced plastic Polymers 0.000 claims description 2
- 239000011151 fibre-reinforced plastic Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Description
第１図Ａは本考案に係る基板型温度ヒユーズを
示す説明図、第２図は本考案温度ヒユーズの使用
状態を示す説明図、第３図Ａ並びに第３図Ｂはそ
れぞれ本考案の別実施例を示す説明図である。
図において、１は絶縁基板、３，３は棒状電極
、４は低融点金属体、６は繊維強化プラスチツク
層である。
FIG. 1A is an explanatory diagram showing a substrate-type temperature fuse according to the present invention, FIG. 2 is an explanatory diagram showing the usage state of the temperature fuse of the present invention, and FIGS. 3A and 3B are different embodiments of the present invention. It is an explanatory diagram showing an example. In the figure, 1 is an insulating substrate, 3 and 3 are rod-shaped electrodes, 4 is a low melting point metal body, and 6 is a fiber reinforced plastic layer.
Claims (1)
ら電極間に低融点金属体を橋設し、該低融点金属
体を絶縁する繊維強化プラスチツク層を絶縁基板
の片面上に設けたことを特徴とする基板型温度ヒ
ユーズ。 Rod-shaped electrodes are attached to both sides of one side of an insulating substrate, a low melting point metal body is bridged between these electrodes, and a fiber-reinforced plastic layer is provided on one side of the insulating substrate to insulate the low melting point metal body. Features a board-type temperature fuse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10816387U JPH0514437Y2 (en) | 1987-07-14 | 1987-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10816387U JPH0514437Y2 (en) | 1987-07-14 | 1987-07-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413649U true JPS6413649U (en) | 1989-01-24 |
| JPH0514437Y2 JPH0514437Y2 (en) | 1993-04-16 |
Family
ID=31343235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10816387U Expired - Lifetime JPH0514437Y2 (en) | 1987-07-14 | 1987-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514437Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013175361A (en) * | 2012-02-24 | 2013-09-05 | Kyocera Corp | Current fuse and electronic apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5135669B2 (en) * | 1972-09-06 | 1976-10-04 |
-
1987
- 1987-07-14 JP JP10816387U patent/JPH0514437Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013175361A (en) * | 2012-02-24 | 2013-09-05 | Kyocera Corp | Current fuse and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514437Y2 (en) | 1993-04-16 |